Bonding pad of suspension circuit

Abstract

A new type of suspension circuit electrical bonding pad is described for electrically and mechanically connecting process for the magnetic recording head. The new type of bonding pad will serve as the joint material as well as the joint interface. Thus there is no need to apply the conductive material in between the bonding pads and magnetic recording head terminals, consequently reducing the process leading time and simplifying the magnetic recording head assemble process.

What is claimed is:  
     
         1 . A bonding pad for electrically bonding a magnetic head terminal comprising a metal pad having a bonding substance as a surface finishing material.  
     
     
         2 . A bonding pad for electrically bonding a magnetic head terminal as set forth in  claim 1 , wherein said bonding substance is solder.  
     
     
         3 . A bonding pad for electrically bonding a magnetic head terminal as set forth in  claim 1 , wherein said bonding substance is a conductive polymer.  
     
     
         4 . A bonding pad for electrically bonding a magnetic head terminal as set forth in  claim 1 , wherein said bonding substance is an adhesive.  
     
     
         5 . A bonding pad for electrically bonding a magnetic head terminal as set forth in  claim 1 , wherein said bonding substance is a film.  
     
     
         6 . A bonding pad for electrically bonding a magnetic head terminal as set forth in  claim 1 , wherein the solder bump height is approximately 50-300 μm, and the solder bump diameter is less than 180 μm.  
     
     
         7 . A disk drive comprising: 
 a bonding pad for electrically bonding a magnetic head terminal, wherein said bonding pad includes a metal pad having a bonding substance as a surface finishing material.    
     
     
         8 . The disk drive as claimed in  claim 7 , wherein said bonding substance is solder.  
     
     
         9 . The disk drive as claimed in  claim 7 , wherein said bonding substance is a conductive polymer.  
     
     
         10 . The disk drive as claimed in  claim 7 , wherein said bonding substance is an adhesive.  
     
     
         11 . The disk drive as claimed in  claim 7 , wherein said bonding substance is a film.  
     
     
         12 . The disk drive as claimed in  claim 7 , wherein the solder bump height is approximately 50-300 μm, and the solder bump diameter is less than 180 μm.  
     
     
         13 . An assemble method for a bonding pad for electrically bonding a magnetic head terminal comprising: 
 providing a metal pad on an incoming suspension;    planting solder onto said metal pad of said suspension;    potting a slider on said suspension; and    making a heat treatment for said suspension so that said solder on said metal pad adheres to a metal pad of said slider, and becomes a solid state.    
     
     
         14 . The method as claimed in  claim 13 , wherein said bonding substance is solder.  
     
     
         15 . The method as claimed in  claim 13 , wherein said bonding substance is a conductive polymer.  
     
     
         16 . The method as claimed in  claim 13 , wherein said bonding substance is an adhesive.  
     
     
         17 . The method as claimed in  claim 13 , wherein said bonding substance is a film.  
     
     
         18 . The method as claimed in  claim 13 , wherein the solder bump height is approximately 50-300 μm, and the solder bump diameter is less than 180 μm.