Heat sink for electronic parts and manufacture thereof

Abstract

Heat dissipation fins 12 provided on a metal flat plate 10 with a predetermined distance and a metal base plate provided with a plurality of bottom-expanded recesses 15 on the flat surface 14 with a predetermined distance are prepared and pressing portions corresponding to the bottom-expanded recesses on the flat plate between fins to press down protrusions provided on the back side of the flat plate into the bottom-expanded recesses to fix the heat dissipation fins and the base plate securely. Number of components of the heat sink is reduced and construction has become simple. The manufacturing cost is reduced.

What is claimed is:  
     
         1 . A heat sink for electronic parts comprising: 
 a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance,    a metal base plate provided with a plurality of bottom expanded recesses on the flat surface with a predetermined distance,    pressing a portion corresponding to the bottom-expanded recesses provided on the flat surface between the fins to press down protrusions provided on the back side of the metal flat plate to press into the bottom-expanded recesses to fix the heat dissipation fins and the base plate securely.    
     
     
         2 . A heat sink for electronic parts comprising: 
 a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance,    a metal base plate provided with a plurality of bottom-expanded recesses on the flat surface with a predetermined distance, and the base plate provided with a holding protrusions to hold both ends of the heat dissipation fins.    pressing the portion corresponding to the bottom-expanded recesses of the metal flat plate between fins and to press the protrusions provided on the back side of said flat plate to press into said bottom-expanded recesses and to press the holding protrusions provided on the edges of the base plate toward the side of the heat dissipation fins to fix said heat dissipation fins and the base plate securely.    
     
     
         3 . A manufacturing process of a heat sink for electronic parts comprising: 
 a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance and a metal base plate provided with a plurality of bottom-expanded recesses on the flat surface with a predetermined distance are prepared, and    pressing a portion corresponding to the bottom-expanded recesses of the flat plate between the fins to press down protrusions provided on the back side of the flat surface plate to press into the bottom-expanded recesses to fix the heat dissipation fins and the base plate securely.    
     
     
         4 . A manufacturing process of a heat sink for electronic parts comprising: 
 a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance,    a metal base plate provided with a plurality of bottom-expanded recesses provided on the metal flat surface with a predetermined distance, and the base plate provided with a holding protrusions to hold at both ends of the plate,    pressing the portions corresponding to the bottom-expanded recesses of the flat plate between fins and to press down the protrusions provided on the back side of said flat plate into said bottom-expanded recesses and to press the holding protrusions provided on the base plate toward the side of the fins to fix the heat dissipation fins and the base plate securely.