Component mounter and mounting method

Abstract

A component mounter for picking up a component and mounting it on a board using a transfer head. A position of solder paste printed on an electrode on a board is previously measured and a measurement result is stored. Mounting coordinates for mounting the component using the transfer head is calculated based on this measurement result. In the mounting operation, the transfer head is controlled using mounting coordinates determined based on the solder printing position so as to mount the component on each electrode on the board. This prevents the occurrence of positional deviation between the mounted component and printed solder paste. Defective mounting, which may occur in a reflow process due to positional deviation, is thus preventable.

What is claimed is:  
     
         1 . A component mounter for picking up a component from a component feeder carriage and mounting the component on a board using a transfer head, said component mounter comprising: 
 (a) a positioner for relatively positioning said board with respect to said transfer head;    (b) a first memory for storing a position measurement result of solder printed on an electrode on said board;    (c) a calculator for calculating mounting coordinates for mounting the component using said transfer head based on said measurement result; and    (d) a controller for driving said positioner based on said mounting coordinates.    
     
     
         2 . The component mounter as defined in  claim 1  further comprising a second memory for storing said mounting coordinates.  
     
     
         3 . The component mounter as defined in  claim 1 , wherein said measurement result is a result of measurement performed by a measuring apparatus installed in the component mounter.  
     
     
         4 . The component mounter as defined in  claim 1 , wherein said measurement result is a result of measurement performed by a testing function installed in a screen printer for printing solder on the electrode on the board.  
     
     
         5 . The component mounter as defined in  claim 1 , wherein said position measurement result is a result of measurement performed by a separate appearance inspection device other than the component mounter.  
     
     
         6 . A method for picking up a component from a component feeder carriage and mounting the component on a board using a transfer head, said method comprising: 
 (a) storing a position measurement result of solder printed on an electrode on said board;    (b) calculating mounting coordinates for mounting the component by said transfer head based on said measurement result; and    (c) controlling a positioner for relatively positioning said board with respect to said transfer head based on said mounting coordinates.    
     
     
         7 . The method as defined in  claim 6 , further comprising: 
 recognizing a position of said board by a recognition mark on said board; and    obtaining image data for the electrode on said board.    
     
     
         8 . The method as defined in  claim 7 , further comprising the step of measuring a printing position of solder printed on said electrode as relative coordinates with respect to the recognition mark on said board based on said image data.