Cryogenic devices

Abstract

This invention relates generally to cryogenic devices and, more particularly, to cryogenic devices of very small size based on superconducting elements, low thermal transmission interconnects and low dissipated power semiconductor devices.

What is claimed is:  
     
         1 . A cryogenic device comprising a cryogenic electronic portion, a non-cryogenic electronic portion and an interconnect connecting the cryogenic electronic portions and the non-cryogenic electronic portions, wherein the interconnect comprises a thermal break between the cryogenic electronic portion and non-cryogenic electronic portions.  
     
     
         2 . The cryogenic device of  claim 1 , wherein the interconnect comprises a microstrip line on a low thermal conductivity substrate.  
     
     
         3 . The cryogenic device of  claim 2 , wherein the substrate comprises one or more of a fused silica and an aerogel.  
     
     
         4 . The cryogenic device of  claim 1 , wherein the cryogenic electronic portion comprises one or both of a high temperature superconductor filter element and a cryogenic active semiconductor circuit.  
     
     
         5 . The cryogenic device of  claim 1 , wherein the cryogenic electronic portion comprises a high temperature superconductor filter element comprising one or more mini-filters based on self-resonant spiral resonators.  
     
     
         6 . A cryogenic device comprising: 
 (1) a cryogenic electronic portion contained within a vacuum dewar assembly, the cryogenic electronic portion having an input end and an output end;    (2) an ambient to cryogenic input connector having an ambient end passing through the vacuum dewar assembly to a cryogenic end connected to the input end of the cryogenic electronic portion,    (3) a cryogenic to ambient output connector having a cryogenic end connected to the output end of the cryogenic electronic portion, passing through the vacuum dewar assembly to an ambient end; and    (4) a cryogenic source connected to the vacuum dewar assembly so as to be in intimate contact with the cryogenic electronic portion,    wherein: 
 (i) the cryogenic electronic portion comprises at least one of a high temperature superconductor filter element and a cryogenic active semiconductor circuit,  
 (ii) an active semiconductor circuit, if present, produces a total dissipated power into the cryogenic electronic portion of less than about 850 mW, and  
 (iii) the cryogenic device has a maximum cooler lift of less than about 3 W at 80 K at an ambient temperature of 20° C.  
   
     
     
         7 . The cryogenic device of  claim 6 , wherein the cryogenic electronic portion comprises a high temperature superconductor filter element having an input end and an output end, and an active semiconductor circuit having an input end and an output end, wherein: 
 the input end of the active semiconductor circuit is connected to the cryogenic end of the input connector via the high temperature superconductor filter element;    the input end of the filter element is connected to the cryogenic end of the input connector; and    the output end of the filter element is connected to the input end of the active semiconductor circuit.    
     
     
         8 . The cryogenic device of  claim 6 , wherein the cryogenic electronic portion comprises an active semiconductor circuit selected from one or a combination of amplifiers, mixers, analog-to-digital converts and digital processors.  
     
     
         9 . The cryogenic device of  claim 8 , wherein the active semiconductor circuit is a cryogenic amplifier.  
     
     
         10 . The cryogenic device of  claim 6 , wherein the cryogenic electronic portion comprises a high temperature superconductor filter element comprising one or more mini-filters based on self-resonant spiral resonators.  
     
     
         11 . The cryogenic device of  claim 10 , further comprising a superconducting plate above at least the filter element and in intimate contact with the cryogenic source.  
     
     
         12 . The cryogenic device of  claim 6 , wherein one or both of the ambient to cryogenic input connector and cryogenic to ambient output connector is a thermal break.  
     
     
         13 . The cryogenic device of  claim 6 , wherein the cryogenic source is a cryocooler, wherein the cryocooler and vacuum dewar assembly are formed as an integral unit or assembly.  
     
     
         14 . The cryogenic device of  claim 6 , wherein the cryogenic electronic portion comprises a high temperature superconductor filter element comprising one or more mini-filters based on self-resonant spiral resonators; wherein one or both of the ambient to cryogenic input connector and cryogenic to ambient output connector is a thermal break; and wherein the cryogenic source is a cryocooler, wherein the cryocooler and vacuum dewar assembly are formed as an integral unit or assembly.  
     
     
         15 . A cryogenic receiver comprising the cryogenic device of  claim 6 .  
     
     
         16 . The cryogenic receiver of  claim 15 , wherein the cryogenic source is a cryocooler, wherein the cryocooler and vacuum dewar assembly are formed as an integral unit or assembly.  
     
     
         17 . The cryogenic receiver of  claim 15 , wherein the cryogenic electronic portion comprises a high temperature superconductor filter element comprising one or more mini-filters based on self-resonant spiral resonators; wherein one or both of the ambient to cryogenic input connector and cryogenic to ambient output connector is a thermal break; and wherein the cryogenic source is a cryocooler, wherein the cryocooler and vacuum dewar assembly are formed as an integral unit or assembly.  
     
     
         18 . An integrated antenna assembly comprising the cryogenic receiver of  claim 15  and an antenna assembled as an integrated unit.  
     
     
         19 . The integrated antenna assembly of  claim 18 , wherein the cryogenic source is a cryocooler, wherein the cryocooler and vacuum dewar assembly are formed as an integral unit or assembly.  
     
     
         20 . The integrated antenna assembly of  claim 18 , wherein the cryogenic electronic portion comprises a high temperature superconductor filter element comprising one or more mini-filters based on self-resonant spiral resonators; wherein one or both of the ambient to cryogenic input connector and cryogenic to ambient output connector is a thermal break; and wherein the cryogenic source is a cryocooler, wherein the cryocooler and vacuum dewar assembly are formed as an integral unit or assembly.  
     
     
         21 . A method of tuning a cryogenic receiver comprising a high temperature superconducting filter element, said cryogenic receiver being programmed to operate at a specified operating frequency at a specified temperature, comprising the step of altering the specified operating temperature to induce a shift in the operating frequency of the cryogenic receiver.