US2002057986A1PendingUtilityA1

Solders

Assignee: QUANTUM CHEM TECH SINGAPOREPriority: Nov 16, 2000Filed: Aug 17, 2001Published: May 16, 2002

Est. expiryNov 16, 2020(expired)· nominal 20-yr term from priority

Inventors:Kai Hwa Chew Wei Pan

B23K 35/262C22C 13/02C22C 13/00

PatentIndex Score

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References

Claims

Abstract

A solder comprising: between 87.2% and 89.5% tin; between 4.0% and 4.8% bismuth; between 3.5% and 4.5% indium; and between 3.0% and 3.5% silver.

Claims

exact text as granted — not AI-modified

1 . A solder comprising: 
 between 87.2% and 89.5% tin;    between 4.0% and 4.8% bismuth;    between 3.5% and 4.5% indium; and    between 3.0% and 3.5% silver.    
     
     
         2 . A solder according to  claim 1 , wherein the solder is a substantially lead-free solder.  
     
     
         3 . A solder according to  claim 2 , wherein the solder is a lead-free solder.  
     
     
         4 . A solder according to  claim 3 , wherein the solder comprises 88.3% tin, 4.5% bismuth, 4.0% indium and 3.2% silver.  
     
     
         5 . A method of preparing a solder, comprising the step of mixing tin, bismuth, indium and silver such that: 
 the proportion of tin in the solder is between 87.2% and 89.5%;    the proportion of bismuth in the solder is between 4.0% and 4.8%;    the proportion of indium in the solder is between 3.5% and 4.5%; and    the proportion of silver in the solder is between 3.0% and 3.5%.    
     
     
         6 . A method according to  claim 5 , wherein the method comprises the addition of substantially no lead to the solder.  
     
     
         7 . A method according to  claim 6 , wherein the method comprises the addition of no lead to the solder.  
     
     
         8 . A method according to  claim 7 , wherein the method comprises the step of mixing tin, bismuth, indium and silver such that: 
 the proportion of tin in the solder is 88.3%;    the proportion of bismuth in the solder is 4.5%;    the proportion of indium in the solder is 4.0%; and    the proportion of silver in the solder is 3.2%.    
     
     
         9 . A method of soldering, comprising the step of using a solder comprising: 
 between 87.2% and 89.5% tin;    between 4.0% and 4.8% bismuth;    between 3.5% and 4.5% indium; and    between 3.0% and 3.5% silver.    
     
     
         10 . A method according to  claim 9 , comprising the step of using a solder comprising: 88.3% tin; 4.5% bismuth; 4.0% indium; and 3.2% silver  
     
     
         11 . A method according to  claim 9 , wherein the method comprises the step of wave-soldering.

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