Joining material for electronic components, electronic components and a method for manufacturing the same

Abstract

A joining material for an electronic component was disclosed. The component has a plurality of functional layers, each selected from a magnetic layer and dielectric layer and joined with each other. The joining material comprising a glass and a composition of a mol % of ZnO, b mol % of BaO and c mol % of TiO 2 (a=12-45, b=4-45, c=18-81, a+b+c=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.

1 . A joining material for an electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer, the functional layers being joined with each other by means of the joining material, the joining material comprising a glass and a composition of a mol % of ZnO, b mol % of BaO and c mol % of TiO 2  (a=12-45, b=4-45, c=18-81, a+b+c=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.  
     
     
         2 . A joining material for an electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer, the functional layers being joined with each other by means of the joining material, the joining material comprising a glass and a composition of a mol % of ZnO, b mol % of BaO, c mol % of TiO 2  and d mol % of MnO (a=12-45, b=4-45, c=18-81, d≦10, a+b+c+d=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.  
     
     
         3 . A joining material for an electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer, the functional layers being joined with each other by means of the joining material, the joining material comprising a glass and a composition of a mol % of ZnO, b mol % of BaO, c mol % of TiO 2  and e mol % of Al 2 O 3  (a=12-45, b=4-45, c=18-81, e≦10, a+b+c+e=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.  
     
     
         4 . A joining material for an electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer, the functional layers being joined with each other by means of the joining material, the joining material comprising a glass and a composition of a mol % of ZnO, b mol % of BaO, c mol % of TiO 2 , d mol % of MnO and e mol % of Al 2 O 3  (a=12-45, b=4-45, c=18-81, d≦10, e≦10, a+b+c+d+e=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.  
     
     
         5 . The joining material as claimed in each of  claims 1  to  4 , wherein a content of ZnO is 25 to 40 mol %, a content of BaO is 5 to 15 mol % and a content of TiO 2  is 45 to 65 mol %.  
     
     
         6 . The joining material as claimed in each of  claims 1  to  5 , further comprising not more than 10 mol % of at least one metal oxide selected from a group consisting of Cr 2 O 3 , Fe 2 O 3  and NiO.  
     
     
         7 . The joining material as claimed in each of  claims 1  to  5 , further comprising not more than 10 mol % of at least one metal oxide selected from a group consisting of Y 2 O 3  and ZrO 2 .  
     
     
         8 . The joining material for an electronic component as claimed in each of  claims 1  to  7 , wherein the glass is selected from a group consisting of ZnO—SiO 2 —B 2 O 3  glass, PbO—B 2 O 3 —SiO 2  glass, Al 2 O 3 —CaO—B 2 O 3 —SiO 2  glass, B 2 O 3 —SiO 2  glass, MgO—Al 2 O 3 —SiO 2  cordierite glass, and ZnO—MgO—Al 2 O 3 —SiO 2  cordierite glass.  
     
     
         9 . An electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer and a joining layer, wherein the joining layer is composed of sintered product of the joining material as claimed in each of  claims 1  to  8 .  
     
     
         10 . An electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer and a joining layer, wherein the joining layer is composed of sintered product showing at least one of a peak corresponding to BaNd 2 Ti 5 O 14  and a peak corresponding to BaNd 2 Ti 4 O 12 , when measured by means of powdery X-ray diffraction method.  
     
     
         11 . The electronic component as claimed in  claim 9  or  10 , wherein the joining layer has a thickness of not smaller than 10 μm and not larger than 500 μm.  
     
     
         12 . A method for manufacturing an electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer and joining layer, the method comprising the steps of: 
 laminating the functional layers already sintered to provide a laminated body, wherein a layer made of the joining material as claimed in each of  claims 1  to  8  is provided, and    firing the joining material to form the joining layer.    
     
     
         13 . A method for manufacturing an electronic component having a plurality of functional layers each selected from a magnetic layer and dielectric layer and a joining layer, the method comprising the steps of: 
 laminating greensheets, for the functional layers, to provide laminated greensheets, wherein a layer made of the joining material as claimed in each of  claims 1  to  8  is provided, and    firing the laminated greensheets with the layer made of the joining material to form the functional layers and the joining layer.    
     
     
         14 . The method as claimed in  claim 12  or  13 , wherein the layer made of the joining material is provided as a form of a greensheet, paste slurry, or thin film.