Bonding apparatus

Abstract

A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus is configured so that a chip and a substrate are subjected to positioning on the basis of a recognition result of the chip recognition camera so that the chip is bonded onto the substrate. The chip recognition camera is disposed to be lower than a level of a substrate mounted surface of the substrate stage. A lower surface of the chip is recognized in a condition that the lower surface of the chip is located to be substantially on a level with a chip bonding surface of the substrate. Positioning of the chip and the substrate is performed by the recognition image.

What is claimed is:  
     
         1 . A bonding apparatus comprising: 
 a bonding tool for holding a chip;    a substrate stage for mounting a substrate thereon;    a moving mechanism for moving said bonding tool and said substrate stage relatively to each other in a horizontal plane;    an up-and-down mechanism for moving up and down said bonding tool; and    a chip recognition camera being disposed to be lower than a level of a substrate mounted surface of said substrate stage to thereby recognize said chip held by said bonding tool from a position below said chip so that said chip and said substrate are subjected to positioning on the basis of a recognition result of said chip recognition camera and said bonding tool is moved down to bond said chip onto said substrate;    wherein a lower surface of said chip is recognized by said chip recognition camera when the lower surface of said chip is located substantially on a level with a chip bonding surface of said substrate.    
     
     
         2 . A bonding apparatus according to  claim 1 , wherein a position where said chip recognition camera is focused is set to a position which is substantially on a level with the chip bonding surface of said substrate.  
     
     
         3 . A bonding apparatus according to  claim 1 , further comprising a chip tray for receiving said chip, said chip tray being located to be lower than the level of the chip bonding surface of said substrate.