Apparatus and method for separating circuit boards

Abstract

An apparatus for separating individual circuit boards from a multiple board array with pre-scored planes 10 is provided. The apparatus includes a splitting element 36, positioned along one of the pre-scored planes 28, and a torque inducing element 38 mechanically forcing the multiple board array 20 onto the splitting element 36 thereby breaking the board array 20 along the pre-scored plane 28.

What is claimed is:  
     
         1 . An apparatus for separating individual circuit boards from a multiple board array with pre-scored planes comprising: 
 at least one splitting element positioned along one of the pre-scored planes; and    at least one torque inducing element mechanically forcing the multiple board array onto said at least one splitting element and thereby breaking the multiple board array along the pre-scored plane.    
     
     
         2 . An apparatus as described in  claim 1  further comprising: 
 a stabilizing element exerting a load on the surface of the multiple board array and thereby reducing board flex.  
 
     
     
         3 . An apparatus as described in  claim 1  wherein said stabilizing element includes a plate element; and 
 a plurality of spring elements, said plurality of spring elements pushing said plate element onto the multiple board array.  
 
     
     
         4 . An apparatus as described in  claim 1  wherein said at least one splitting element is wedge shaped.  
     
     
         5 . An apparatus as described in  claim 1  wherein said at least one splitting element is block shaped.  
     
     
         6 . An apparatus as described in  claim 1  further comprising: 
 a transport element for automatically positioning said at least one splitting element along one of the pre-scored planes.  
 
     
     
         7 . An apparatus as described in  claim 1  wherein said transport element includes a plurality of wheels.  
     
     
         8 . An apparatus as described in  claim 1  wherein said at least one torque moving element is a pneumatic lever.  
     
     
         9 . An apparatus for separating individual circuit board from a multiple board array with pre-scored planes comprising: 
 at least one splitting element positioned along one of the pre-scored planes; and    at least one torque inducing element mechanically forcing the multiple board array onto said at least one splitting element and thereby breaking the multiple board array along the pre-scored plane; and    a transport element for automatically positioning said at least one splitting element along one of the pre-scored planes.    
     
     
         10 . An apparatus as described in  claim 9  further comprising: 
 a stabilizing element exerting a load on the surface of the multiple board array and thereby reducing board flex.  
 
     
     
         11 . An apparatus as described in  claim 9  wherein said stabilizing element includes a plate element; and 
 a plurality of spring elements, said plurality of spring elements pushing said plate element onto the multiple board array.  
 
     
     
         12 . An apparatus as described in  claim 9  wherein said at least one splitting element is wedge shaped.  
     
     
         13 . An apparatus as described in  claim 9  wherein said at least one splitting element is block shaped.  
     
     
         14 . An apparatus as described in  claim 9  wherein said transport element includes a plurality of wheels.  
     
     
         15 . An apparatus as described in  claim 9  wherein said at least one torque moving element is a pneumatic lever.  
     
     
         16 . A method for separating individual circuit boards from a multiple board array with pre-scored planes comprising: 
 positioning a splitting element along one of the pre-scored planes inducing torque on the multiple board array such that the multiple board array is forced onto the splitting element and breaks along the pre-scored plane.    
     
     
         17 . A method for separating individual circuit boards as described in  claim 16  further comprising: 
 loading the surface of the multiple board array to reduce board flex.  
 
     
     
         18 . A method of separating individual circuit boards from a multiple board array as described in  claim 16  further comprising: 
 transporting the multiple board array using a plurality of wheels.  
 
     
     
         19 . A method of separating individual circuit boards from a multiple board array with pre-scored planes as described in  claim 16  further comprising: 
 repeating said positioning and said inducing torque on each pre-scored plane.