Embossed carrier tape molding and sealing apparatus

Abstract

The invention provides an embossed carrier tape molding and sealing apparatus which is devised so that the molding of the embossed carrier tape and the sealing of electronic parts can be efficiently performed. An embossed carrier tape molding and sealing apparatus is constructed by installing, on a continuous conveying path for a thermoplastic resin tape 10, [i] a molding part heating means 110 which heats and softens the molding parts, [ii] a molding means 130 which positions the above-mentioned heated parts in a mold 132, and subjects these parts to embossing-molding, [iii] a hole working means 150 which forms guide holes at specified intervals in the side portions of the above-mentioned thermoplastic resin tape 10, [iv] a product insertion stage 210 which places products 20 in the recesses 12 formed by the aforementioned embossing-molding, [v] a covering tape supply means 230 which supplies a covering tape 30 to the upper surface of the recesses 12 formed by the above-mentioned embossing-molding of the above-mentioned thermoplastic resin tape 10, and [vi] a tape thermal-bonding means 250 which thermally bonds the above-mentioned covering tape 30 to the above-mentioned thermoplastic resin tape 10 at the peripheral edges of the above-mentioned recesses 12.

I/We claim:  
     
         1 . An embossed carrier tape molding and sealing apparatus comprising: 
 a continuous conveying path for a thermoplastic resin tape having, 
 a molding part heating means which heats and softens molding parts,  
 a molding means which positions the heated molding parts in a mold and subjects these parts to embossing-molding to form recesses therein,  
 a hole working means which forms guide holes at specified intervals in side portions of the thermoplastic resin tape,  
 a product insertion stage which places products in the recesses formed by the embossing-molding,  
 a covering tape supply means which supplies a covering tape to an upper surface of the recesses formed by the embossing-molding, and  
 a tape thermal-bonding means which thermally bonds the covering tape to the thermoplastic resin tape at edges of the recesses.  
   
     
     
         2 . The embossed carrier tape molding and sealing apparatus as recited in  claim 1  wherein the molding means has a mold which has an outer frame block that has a receiving part that is C-shaped, an inner frame block that is assembled with the outer frame block, and an insert which is sandwiched between the outer frame block and inner frame block.  
     
     
         3 . The embossed carrier tape molding and sealing apparatus as recited in  claim 2  wherein a pressurized gas delivery means is provided which presses the heated and softened molding parts of the thermoplastic resin tape into the mold.  
     
     
         4 . The embossed carrier tape molding and sealing apparatus as recited in  claim 1  wherein the conveying path is equipped with guide rails which are disposed on both sides so that guide grooves that match the width of the thermoplastic resin tape are formed, and rotating teeth which engage with the guide holes formed by the hole working means, whereby the spacing of the guide rails and the rotating teeth is made variable.  
     
     
         5 . The embossed carrier tape molding and sealing apparatus as recited in  claim 4  wherein the above-mentioned hole working means has a plurality of punches that are lined up at specified intervals along the sides of the thermoplastic resin tape and pilot pins which are inserted into already-formed guide holes so that the pilot pins position the thermoplastic resin tape when hole working is performed by the punches.  
     
     
         6 . The embossed carrier tape molding and sealing apparatus as recited in  claim 4  wherein a tension roller is provided which is pressed against the rotating teeth, and which clamps the thermoplastic resin tape between the roller and the rotating teeth.  
     
     
         7 . The embossed carrier tape molding and sealing apparatus as recited in  claim 6  wherein a means is provided which releases the pressing contact of the tension roller during the hole working performed by the punches and pilot pins.