US2002112847A1PendingUtilityA1

Cooling device for heat source

Assignee: TOSHIBA KKPriority: Feb 9, 2001Filed: Feb 8, 2002Published: Aug 22, 2002
Est. expiryFeb 9, 2021(expired)· nominal 20-yr term from priority
H10W 40/475
37
PatentIndex Score
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Claims

Abstract

In a cooling device for a heat source according to the present invention, header is arranged on the downstream side of an inlet port i.e. on the side of holes opposite to that of the heat source, a heat source is arranged on the outside face of a heat sink and holes are provided that spray fluid towards the back face of the heat sink, outlet ports being provided fewer than the number of holes. Thanks to the arrangement of header on the side of holes opposite to that of the heat source, no large differences are generated in the flow rate of the holes; thus, the heat conduction rate when the flow from holes collides with the back face of the heat sink is practically uniform and the cooling performance of the heat sink, with which the flow collides, at the back of the heat source is practically uniform.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A cooling device for a heat source, comprising: 
 a heat sink with a heat source arranged on an outer surface of said heat sink and a plurality of holes provided at a back surface of said heat sink;    a header arranged on a side of said holes arranged in said heat sink opposite to said heat source;    an inlet port at which a coolant flows into said header; and    an outlet port at which said coolant in said heat sink flows out.    
     
     
         2 . A cooling device for a heat source, comprising: 
 (1) a heat sink including a coolant, said heat sink comprising: 
 (a) a first heat sink member with a heat source arranged at an outer surface of said heat sink; and  
 (b) a second heat sink member provided with a plurality of holes, said coolant that cools said heat source being made to pass through said holes;  
   (2) a header configured to an opposite side to said first heat sink member about said second heat sink member as axis;    (3) an inlet port whereby said coolant is made to flow into a first space surrounded by said header and said second heat sink member; and    (4) an outlet port whereby said coolant in a second space surrounded by said first heat sink member and second heat sink member is made to flow out.    
     
     
         3 . The cooling device for a heat source according to  claim 1 , 
 wherein an upright plate is provided on a downstream side of said header.    
     
     
         4 . The cooling device for a heat source according to  claim 2 , 
 wherein an upright plate provided on a downstream side of said header is made of arcuate shape such as to surround a hole.    
     
     
         5 . The cooling device for a heat source according to  claim 2  or  claim 3 , 
 wherein said upright plate provided on a downstream side of said header is provided offset from a center of said hole.  
 
     
     
         6 . The cooling device for a heat source according to any of  claim 1  to  claim 4 , 
 wherein a gap between said upright plate provided on a downstream side of said header and a wall face on a side of said header opposite said holes is eliminated.  
 
     
     
         7 . The cooling device for a heat source according to  claim 1 , 
 wherein a baffle plate is provided on an upstream side of said holes within said heat sink.    
     
     
         8 . The cooling device for a heat source according to  claim 6 , 
 wherein the baffle plate provided on an upstream side of said holes within said heat sink is made of arcuate shape such as to surround a hole.    
     
     
         9 . The cooling device for a heat source according to  claim 6  or  claim 7 , 
 wherein a gap between said baffle plate provided on an upstream side of said holes within said heat sink and said wall face on a side of said heat sink opposite said holes is eliminated.  
 
     
     
         10 . The cooling device for a heat source according to  claim 1 , 
 wherein an upright plate on a downstream side of said holes of said header and a baffle plate on an upstream side of said holes within said heat sink are provided.    
     
     
         11 . The cooling device for a heat source according to  claim 9 , 
 wherein said upright plate and said baffle plate respectively are made of arcuate shape such as to surround a hole.    
     
     
         12 . The cooling device for a heat source according to  claim 1 , 
 wherein a porous fluid resistance is arranged between an upstream end of said header and said holes.    
     
     
         13 . The cooling device for a heat source according to  claim 1 , 
 wherein a porous fluid resistance is arranged on an upstream side of said holes.    
     
     
         14 . The cooling device for a heat source according to  claim 1 , 
 wherein a plurality of headers are arranged on a side of holes arranged in said heat sink opposite that of said heat source.    
     
     
         15 . The cooling device for a heat source according to  claim 13 , 
 wherein a flow path is provided whereby said coolant flowing out from said holes is returned to another header from within said heat sink.    
     
     
         16 . The cooling device for a heat source according to  claim 1 , wherein said cooling device is constructed divided into a part where said heat source is arranged, a part where said holes are arranged and a header part.  
     
     
         17 . A cooling device for a heat source comprising: 
 a header wherein one or a plurality of holes are respectively provided in a wall faces on both sides;    a heat sink outside wall where a heat source is arranged on an outer surface with gaps being provided on both sides of said header;    an inlet port whereby an coolant flows into said header; and    an outlet port whereby said coolant within said heat sink flows out.

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