US2002117292A1PendingUtilityA1

Arrangement for dissipating thermal energy generated by heat source

31
Priority: Jul 1, 1999Filed: Dec 27, 2001Published: Aug 29, 2002
Est. expiryJul 1, 2019(expired)· nominal 20-yr term from priority
H10W 40/22H10W 40/73
31
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Claims

Abstract

The invention relates to an arrangement for dissipating thermal energy generated by a heat source ( 1 ), which arrangement comprises a heat conductor element ( 2 ) for conducting thermal energy generated by the heat source ( 1 ) away from the heat source ( 1 ), the heat conductor element ( 2 ) having at least one micro heat pipe module ( 3 ) attached to it for distributing thermal energy generated by the heat source ( 1 ) in the heat conductor element ( 2 ). The heat source ( 1 ) is attached to an element ( 4 ) which is made of a heat conducting material and which is in thermal contact with the heat conductor element ( 2 ) and which is arranged to conduct thermal energy from the heat source ( 1 ) to the heat conductor element ( 2 ) by means of the heat conducting ability of said heat conducting material.

Claims

exact text as granted — not AI-modified
1 . An arrangement for dissipating thermal energy generated by a heat source, which arrangement comprises a heat conductor element for conducting thermal energy generated by the heat source away from the heat source, the heat conductor element having at least one micro heat pipe module attached to it for distributing thermal energy generated by the heat source in the heat conductor element, 
 wherein the heat source is attached to an element which is made of a heat conducting material and which is in thermal contact with the heat conductor element and which is arranged to conduct thermal energy from the heat source to the heat conductor element by means of the heat conducting ability of said heat conducting material,    wherein it has at least two micro heat pipe modules having an intermediate space between them, and    wherein the element which is in thermal contact with the heat conductor element is installed in the intermediate space.    
     
     
         2 . An arrangement as claimed in  claim 1 , wherein the element fills the intermediate space substantially entirely.  
     
     
         3 . An arrangement for dissipating thermal energy generated by a heat source, which arrangement comprises a heat conductor element for conducting thermal energy generated by the heat source away from the heat source, the heat conductor element having at least one micro heat pipe module attached to it for distributing thermal energy generated by the heat source in the heat conductor element, 
 wherein the heat source is attached to an element which is made of a heat conducting material and which is in thermal contact with the heat conductor element and which is arranged to conduct thermal energy from the heat source to the heat conductor element by means of the heat conducting ability of said heat conducting material,    wherein the micro heat pipe module has a hole, and    wherein the element which is in thermal contact with the heat conductor element is installed in the hole.    
     
     
         4 . An arrangement as claimed in  claim 3 , wherein the element fills the hole substantially entirely.  
     
     
         5 . An arrangement as claimed in  claim 1  or  3 , wherein the element which is in thermal contact with the heat conductor element is seamlessly attached to the heat conductor element.  
     
     
         6 . An arrangement as claimed in  claim 1  or  3 , wherein the heat conductor element is equipped with cooling fins.  
     
     
         7 . An arrangement as claimed in  claim 1  or  3 , wherein the micro heat pipe module is sunk in a recess in the heat conductor element.  
     
     
         8 . An arrangement as claimed in  claim 1  or  3 , wherein the heat conducting material is a copper metal.  
     
     
         9 . An arrangement as claimed in  claim 1  or  3 , wherein the heat conducting material is an aluminium metal.

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