Modular imaging apparatus

Abstract

Radiation imaging apparatus includes a support structure for a number of modules which each in their turn support a number of imaging device tiles. An imaging device on each tile provides an array of radiation detector cells. With the modular construction, the apparatus can provide a large imaging array from a large number of individual tiles. The support structure may be located in or form part of an imaging cassette. The modules provide tile mounting locations in one or more rows for the imaging device tiles, whereby the tiles may be accurately mounted with respect the module and to each other prior to being mounted on the support structure. The tiles are mounted on the modules and the modules are mounted within the cassette in a removable manner to facilitate the replacement of faulty tiles when required and/or the replacement of tiles having different resolutions and/or specifications for different imaging applications. Various arrangements for electronically clustering tiles are provided.

What is claimed is:  
     
         1 . Apparatus for imaging radiation, said apparatus comprising: 
 a plurality of tiles, each tile comprising an imaging device having an array of radiation detector cells; and    a plurality of modules, each module supporting a plurality of said tiles.    
     
     
         2 . Apparatus according to  claim 1 , further comprising a module support structure, said support structure supporting said module(s).  
     
     
         3 . Apparatus according to  claim 1 , wherein a said tile is removably mountable to a said module.  
     
     
         4 . Apparatus according to  claim 1 , wherein a said imaging device has a two-dimensional array of radiation detector cells.  
     
     
         5 . Apparatus according to  claim 1 , wherein a said module supports a two-dimensional array of tiles.  
     
     
         6 . Apparatus according to  claim 1 , wherein each said module comprises a board comprising, on a first surface thereof, an array of tile mounting locations, each mounting location comprising an arrangement of mounting location contacts for contacting corresponding tile contacts on a said tile.  
     
     
         7 . Apparatus according to  claim 6 , wherein each board is a multilayer printed circuit board.  
     
     
         8 . Apparatus according to  claim 6 , wherein said board is elongate and comprises two or more rows of mounting locations for supporting two or more rows of tiles.  
     
     
         9 . Apparatus according to  claim 6 , wherein said board has, on said first surface, a circuit region not populated with said tiles.  
     
     
         10 . Apparatus according to  claim 9 , wherein said board, adjacent one end thereof, has, on said first surface, a circuit region not populated with said tiles.  
     
     
         11 . Apparatus according to  claim 9 , wherein said circuit region comprises control circuitry for controlling access to and output of signals from said imaging devices.  
     
     
         12 . Apparatus according to  claim 11 , further comprising circuitry on a surface of said board, opposite to said first surface.  
     
     
         13 . Apparatus according to  claim 11 , wherein conductive tracks connect said mounting location contacts to said circuitry.  
     
     
         14 . Apparatus according to  claim 13 , wherein said circuitry and said conductive tracks are arranged electronically to group tiles into first clusters, imaging devices on said tiles of a said first cluster being read out in a serial manner.  
     
     
         15 . Apparatus according to  claim 14 , wherein said first electronic clusters are electronically grouped in second electronic clusters, a said second electronic cluster comprising one or more first electronic clusters read out in a serial manner.  
     
     
         16 . Apparatus according to  claim 15 , configured to read out plural said second clusters read out in parallel.  
     
     
         17 . Apparatus according to  claim 15 , comprising electronic switch circuitry for determining which of said first clusters are combined for a said second cluster.  
     
     
         18 . Apparatus according to  claim 17 , wherein said switches are mounted on a surface of said board opposite to said first surface.  
     
     
         19 . Apparatus according to  claim 17 , wherein said switches are arranged to provide selective deactivation of said first clusters.  
     
     
         20 . Apparatus according to  claim 1 , wherein a said imaging device tile comprises: 
 a said imaging device and a mount, an image detecting plane of said imaging device being tilted with respect to a mounting surface of said mount, said mounting surface comprising tile electrical contacts interconnectable with corresponding mounting location contacts at a tile mounting location on said module.    
     
     
         21 . Apparatus according to  claim 20 , wherein said modules are tilted at least partially to compensate for tilting of said image detector planes.  
     
     
         22 . Apparatus according to  claim 20 , wherein said imaging device comprises one or more detecting layers sensitive to radiation and one or more readout layers, said detecting layer(s) and said readout layer(s) being joined together with an image detecting plane or planes of said detector layer(s) substantially parallel to said readout layer(s).  
     
     
         23 . Apparatus according to  claim 22 , wherein said detecting layer extends beyond said readout layer on at least two edges, a further edge providing wire connections between said readout layer and said mount.  
     
     
         24 . Apparatus according to  claim 20 , comprising a wedge between said imaging device and said mount to maintain an angle between said image detecting plane of said imaging device and said mounting surface of said mount.  
     
     
         25 . Apparatus according to  claim 2 , wherein said modules are elongate and said support structure supports a one-dimensional array of said modules aligned next to each other.  
     
     
         26 . Apparatus according to  claim 25 , wherein said imaging devices of adjacent modules are in mechanical contact with each other.  
     
     
         27 . Apparatus according to  claim 25 , wherein each said module comprises a planar board and adjacent modules are alternately displaced in a first direction and in an opposite direction, said first and opposite directions being substantially perpendicular to the plane of each said board.  
     
     
         28 . Apparatus according to  claim 1 , further comprising an interface board comprising interface circuitry, said modules being electrically connected to said interface board.  
     
     
         29 . An apparatus according to  claim 28 , wherein said interface circuitry comprises circuitry for multiplexing outputs from respective modules.  
     
     
         30 . Apparatus according to  claim 2  comprising an imaging cassette.  
     
     
         31 . Apparatus according to  claim 30 , wherein said imaging cassette comprises an external connector for connecting said imaging cassette to an external processor.  
     
     
         32 . Apparatus according to  claim 30 , wherein said cassette comprises a housing, said support structure being integral to said housing.  
     
     
         33 . Apparatus according to  claim 30 , wherein said cassette comprises a housing, said support structure contained within said housing.  
     
     
         34 . Apparatus according to  claim 30 , wherein said cassette comprises housing having an X-ray transmissive surface.  
     
     
         35 . An imaging system comprising apparatus according to  claim 30  and control electronics and/or an image processor for processing signals output from said cassette.  
     
     
         36 . A module for use in apparatus according to  claim 1 , for mounting an array of tiles, each tile comprising an imaging device having an array of radiation detector cells and having a plurality of tile contacts on a mounting surface thereof, wherein said module comprises: 
 a board having, on a first surface thereof, an array of tile mounting locations, each mounting location comprising an arrangement of mounting location contacts for contacting corresponding tile contacts on a tile and means permitting removable mounting of said tile at said tile mounting location;    circuitry for controlling access to and output of signals from respective tiles when mounted at said tile mounting locations;    electrical connections from said mounting location contacts to said circuitry; and    means for mounting said module on a support structure for a plurality of such modules.    
     
     
         37 . A module according to  claim 36 , wherein said board is a multilayer printed circuit board, conductive tracks connecting said mounting location contacts to said circuitry.  
     
     
         38 . A module according to  claim 36 , wherein said board, adjacent one end thereof, has, on said first surface, a circuit region comprising said circuitry for controlling access to and output of signals from respective tiles when mounted on said board.  
     
     
         39 . A module according to  claim 36 , comprising circuitry on a surface of said board opposite to said first surface.  
     
     
         40 . A module according to  claim 36 , wherein said circuitry comprises an analog to digital converter stage.  
     
     
         41 . A method of forming an imaging array for imaging radiation comprising: 
 forming a plurality of tiles, each tile comprising an imaging device having an array of radiation detector cells; and    forming a plurality of said modules, each module supporting a plurality of said tiles.