Cooling system for multichip module

Abstract

It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body 1 capable of covering upper portion of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body 1 and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.

What is claimed is:  
     
         1 . A cooling system for cooling a multichip module, having a predetermined function, on a substrate of which a plurality of electronic parts including heat generating parts are mounted, the cooling system for cooling a multichip module comprising: 
 a radiating body capable of covering upper portions of the plurality of electronic parts while a predetermined clearance is formed between the radiating body and the electronic parts;    a heat conducting member arranged in the clearance, for thermally connecting an upper surface of the electronic parts and of a radiating member; and    a fastening body for detachably connecting the radiating body with the substrate of the multichip module, the fastening body including an elastic frame having a hook portion capable of catching the substrate so that the radiating body can be detachably fixed to the substrate while the fastening body covers the radiating body.    
     
     
         2 . A cooling system for cooling a multichip module, having a predetermined function, on a substrate of which a plurality of electronic parts including heat generating parts are mounted, the cooling system for cooling a multichip module comprising: 
 a radiating body capable of covering upper portions of the plurality of electronic parts while a predetermined clearance is formed between the radiating body and the electronic parts;    a heat conducting member arranged in the clearance, for thermally connecting an upper surface of the electronic parts and of a radiating member; and    a fastening body for detachably connecting the radiating body with the substrate of the multichip module, the fastening body including an elastic frame having a hook C-shaped clip to pinch the radiating body and the substrate.