US2002140869A1PendingUtilityA1

System and method for providing a low power receiver design

Priority: Nov 12, 1998Filed: Apr 1, 2002Published: Oct 3, 2002
Est. expiryNov 12, 2018(expired)· nominal 20-yr term from priority
H10W 20/497H10D 89/601H10D 89/60H10D 84/00H03F 1/26H03J 1/0075H03H 19/004H03H 11/53H03F 1/3211H03J 3/08H03D 3/18H03F 3/68H03F 2200/372H03G 1/0023H03J 3/04H03L 7/103H03H 11/54H01F 2021/125H03B 5/364H01F 2017/0053H03F 3/72H03F 3/45183H03F 3/195H03L 7/183H03F 2200/447H03F 2203/45286H03D 7/18H03B 5/04H03L 7/23H03F 2200/111H03L 2207/06H03F 3/45188H03F 2200/294H03G 3/3052H03H 11/04H01F 17/0013H01F 17/0006H03G 1/0029H03J 2200/10H03F 2200/63H03H 11/1291H03F 2203/45264H01F 27/42H03H 7/25H03D 7/161H01F 27/40H01F 27/34H03J 3/185
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Claims

Abstract

An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programable attenuation and a programable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator. The VCOs in the PLLs are centered using a control circuit to center the tuning capacitance range. A differential crystal oscillator is advantageously used as a frequency reference. Differential signal transmission is advantageously used throughout the receiver.

Claims

exact text as granted — not AI-modified
1 . A receiver partially implemented on an integrated circuit chip, the receiver comprising: 
 means on the chip for receiving a plurality of channels of signals in a radio frequency telecast band;    first mixer on the chip to which the television signals are applied;    a first bandpass filter off the chip coupled onto the chip to the output of the first mixer; the first filter having a first pass band;    a first local oscillator (LO) on the chip coupled to the first mixer, the first LO having a variable frequency;    means on the chip for adjusting the first LO to select one of the channels and shift the selected channel to the first pass band;    a second mixer on the chip to which the selected channel is applied after the first mixer;    a second LO on the chip coupled to the second mixer, the second LO having a fixed frequency that shifts the selected channel to an intermediate frequency; and    means for demodulating the selected channel.    
     
     
         2 . The television receiver of  claim 1 , additionally comprising a second bandpass filter off the chip coupled onto the chip to the output of the second mixer; the second filter having a second pass band, the second LO having a frequency that shifts the selected channel to the second pass band.  
     
     
         3 . The television receiver of  claim 1 , in which the receiving means, the first LO, and the second LO have differential outputs, the first and second mixers have differential inputs and outputs, and the first bandpass filter has a differential input and a differential output.  
     
     
         4 . An integrated receiver comprising: 
 a substrate providing a physical medium upon which a receiver circuit is disposed;    a first local oscillator;    a second local oscillator;    a mixer having its circuit elements disposed upon the substrate for converting a received signal to a first IF using the first local oscillator's output to mix the received signal with;    a first buffer amplifier having its circuit elements disposed upon the substrate cascaded after the mixer;    an external first differential filter assembly coupled to the first buffer amplifier output for removing an image distortion from the first IF and removing unwanted channels;    a second buffer amplifier having its circuit elements disposed upon the substrate coupled to the external first differential filter assembly output;    a first I/Q mixer disposed upon the substrate for converting the first IF to a second IF I and Q signal and rejecting a first IF image distortion;    a polyphase circuit for combining the second IF I and Q signals into a second IF signal;    a third buffer amplifier having its circuit elements disposed upon the substrate and cascaded with the polyphase circuit; and    an external second differential filter assembly coupled to the third buffer amplifier output for removing an image distortion from the second IF and removing unwanted channels;    whereby frequency conversion, channel selectivity and image rejection are performed on the integrated circuit.    
     
     
         5 . The integrated receiver of  claim 4  additionally comprising an AGC circuit having its circuit elements disposed upon the substrate, cascaded after the external second differential filter assembly.  
     
     
         6 . The integrated receiver of  claim 4  additionally comprising a programable gain attenuator and LNA circuit having its circuit elements disposed upon the substrate, cascaded in front of the first mixer.  
     
     
         7 . The integrated receiver of  claim 4  wherein the substrate is silicon.  
     
     
         8 . The integrated receiver of  claim 4  wherein the substrate comprises devices fabricated according to standard CMOS processing.  
     
     
         9 . The integrated receiver of  claim 4  further comprising interconnection by differential signal transmission lines.

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