Disposable electronic chip device and process of manufacture

Abstract

An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 μm, the best results being obtained with a thickness of between 10 μm and 30 μm. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections.

What is claimed is:  
     
         1 . A process to manufacture an electronic chip device, comprising the steps of: 
 providing an interface support film including a support film and at least one flat communication interface, said interface support film provided having such properties that it is capable of being creased or folded without deterioration;    affixing at least one microcircuit on the interface support film; and    connecting the microcircuit to the communication interface.    
     
     
         2 . A process to manufacture an electronic chip device, comprising the steps of: 
 providing an interface support film including a support film and at least one flat communication interface;    affixing at least one microcircuit on the interface support film;    connecting the microcircuit to the communication interface; and    affixing a compensation film on the support film, said compensation film having at least one recess corresponding to a place for a microcircuit.    
     
     
         3 . The process according to  claim 1 , further including the step of affixing a compensation film on the support film, said compensation film having at least one recess corresponding to a place for a microcircuit.  
     
     
         4 . The process according to  claim 3 , wherein the step of affixing the compensation film is carried out before the microcircuit is fixed to the support film.  
     
     
         5 . The process according to  claim 3 , further including the step of depositing an encapsulating material only within the recess of the compensation film.  
     
     
         6 . The process according to  claim 3 , wherein the step of affixing the compensation film is carried after the microcircuit is fixed to the support film.  
     
     
         7 . The process according to  claim 1 , wherein the interface support film is provided in at least one strip on a roll, and the support film is transported to at least one work station by a transport means that is controlled by the tension of the support film.  
     
     
         8 . The process according to  claim 1 , wherein the microcircuit is connected to the interface by ultrasonic welding of conductor wires.  
     
     
         9 . The process according to  claim 8 , wherein said conductor wires are made of aluminum.  
     
     
         10 . The process according to  claim 8 , wherein, during said welding, at least the area of the support film on which the microcircuit is located is placed on a firm reference surface.  
     
     
         11 . The process according to  claim 10 , wherein the support film is placed on the reference surface by means of suction.  
     
     
         12 . The process according to  claim 1 , wherein the communication interface is created on the support film by an aluminum engraving technique.  
     
     
         13 . The process according to  claim 1 , further including the step of connecting interface elements to contact pads through the support film by mechanical perforations.  
     
     
         14 . The process according to  claim 1 , further including the step of placing an encapsulating material at least over the microcircuit and its connections.  
     
     
         15 . The process according to  claim 1 , further including the step of applying an adhesive layer with a peelable protection film on at least one face of the device.  
     
     
         16 . The process according to  claim 15 , wherein the adhesive layer with the protection film is provided in a continuous strip, the support film comprises a strip with a plurality of interfaces, wherein the devices are cut from the strips while remaining fixed on the protection film, and a cleaning up operation is carried out between the devices.  
     
     
         17 . The process according to  claim 7 , wherein each of the at least one strips has a plurality of communication interfaces formed thereon, and further including the step of cutting each device.  
     
     
         18 . The process according to  claim 1 , wherein the support film and the interface can be creased or folded together with a curve radius of less than 2.5 mm without deterioration.  
     
     
         19 . The process according to  claim 1 , wherein the support film and the interface can be creased or folded together with a curve radius of less than 1 mm without deterioration.  
     
     
         20 . The process according to  claim 2 , wherein an encapsulating material is contained at least partly by said recess and covers the microcircuit and its connections.  
     
     
         21 . The process according to  claim 1 , wherein the support film has a thickness of less than 75 μm.  
     
     
         22 . The process according to  claim 21 , wherein the support film has a thickness between 10 μm and 30 μm.  
     
     
         23 . The process according to  claim 1 , wherein the support film has at least one of an elongation at break of more than 80%, a Shore hardness of less than 80, a vitreous transition temperature Tg of less than 0°, and a fusion temperature of less than 130° C.  
     
     
         24 . The process according to  claim 1 , wherein the flat communication interface is an antenna formed in a spiral by plural turns of a conductive material.  
     
     
         25 . The process according to  claim 1 , comprising attaching a strap to a face of the support film opposite the microcircuit to pull back at least one end of the interface in a vicinity of the microcircuit.  
     
     
         26 . The process according to  claim 2 , wherein the microcircuit, the communication interface, and the compensation film are located on a single side of the support film, and wherein the support film can be folded or creased upon itself without deterioration.  
     
     
         27 . The process according to  claim 26 , comprising the step of placing an encapsulating material within the recess to cover at least the microcircuit and connections between the microcircuit and the communication interface.  
     
     
         28 . A process for forming a chip card, comprising: 
 providing an interface support film including a support film and at least one flat communication interface, wherein the interface support film is capable of being creased or folded upon itself without deterioration;    affixing at least one microcircuit on the interface support film;    connecting the microcircuit to the communication interface;    affixing a compensation film on the support film, said compensation film having at least one recess corresponding to a place for a microcircuit, said compensation film forming a card body of the chip card.    
     
     
         29 . A process for forming a chip card according to  claim 28 , wherein the communication interface, the microcircuit, and the compensation film are located on a single side of the support film.