Heatsink assembly having stabilzation plate

Abstract

A heatsink assembly having a stabilization plate is described. The stabilization plate, such as an n-shaped PORON slice, is disposed under a heatsink, and is surrounding a thermal pad under the heatsink. The stabilization plate is helpful to stabilize the combination of the thermal pad up to the heatsink. With the stabilization, the thermal pad is efficiently stuck on to a die for dissipating the heat therefrom.

What is claimed is:  
     
         1 . A heatsink assembly, comprising: 
 a heatsink;    a thermal pad located under the heatsink;    a PORON slice, being located on a bottom of the heatsink and surrounding the thermal pad, for making the thermal pad closely compact to a die of a chip when the heatsink is located on the chip; and    an amount of paste, coated on the PORON slice, for sticking the PORON slice on the bottom of the heatsink.    
     
     
         2 . The heatsink stabilization plate of  claim 1 , wherein the PORON slice is an n-shaped slice in a top view.  
     
     
         3 . The heatsink stabilization plate of  claim 1 , wherein the PORON slice has a thickness smaller than that of the die.  
     
     
         4 . The heatsink stabilization plate of  claim 1 , wherein the PORON slice has a fingerprint thereon after being pressed by a finger, but the fingerprint disappears right away.  
     
     
         5 . A cooling assembly, comprising: 
 an n-shaped PORON slice; and    a heatsink, stuck with the n-shaped PORON slice.    
     
     
         6 . The cooling assembly of  claim 5 , wherein the heatsink comprises a right portion and a left portion respectively having a first plurality of cooling fins and a second plurality of cooling fins.  
     
     
         7 . The cooling assembly of  claim 6 , wherein the second cooling fins are less than the first cooling fins.  
     
     
         8 . The cooling assembly of  claim 5 , further comprising a thermal pad through which heat from a socket is conducted to the heatsink.  
     
     
         9 . The cooling assembly of  claim 8 , wherein the n-shaped PORON slice surrounds the thermal pad for making the thermal pad closely compact to the die when the heatsink is located on the die.  
     
     
         10 . The cooling assembly of  claim 5 , wherein the n-shaped PORON slice has a thickness smaller than that of the die.  
     
     
         11 . The cooling assembly of  claim 5 , wherein the n-shaped PORON slice has a fingerprint thereon after being pressed by a finger, but the fingerprint disappears right away.  
     
     
         12 . The cooling assembly of  claim 5 , wherein the n-shaped PORON slice comprises two bars respectively having length of about 49.29 to about 49.31 millimeters in a top view.  
     
     
         13 . The cooling assembly of  claim 5 , wherein the bars respectively have width of about 9.99 to about 10.01 millimeters in a top view.  
     
     
         14 . The cooling assembly of  claim 5 , wherein the n-shaped PORON slice comprises a lateral bar having a length of about 48.69 millimeters to about 48.71 millimeters in a top view.