Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method

Abstract

To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.

1 . An electronic component material comprising: 
 a resin which may be crosslinked and cured,    a pest repellent contained in said resin, and    a filler contained in said resin,    wherein a pest repelling layer having a pest repelling performance may be formed by curing said resin by crosslinking chemical reaction.    
     
     
         2 . An electronic component material of  claim 1 , further comprising: 
 a solvent,    wherein when said resin is cured, it may be cured in a state having part of said pest repellent moved to the surface of said pest repelling layer by the action of said solvent.    
     
     
         3 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc,    said pest repel lent is contained in a range of 5 parts by weight to 150 parts by weight in 100 parts by weight of said epoxy resin, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried to be a paste by cross linking chemical reaction of said resin.    
     
     
         4 . An electronic component material of  claim 1 , 
 wherein said resin has epoxy acrylate, a reactive diluent, and a light initiator,    said filler has at least one of silica and talc,    said pest repellent is contained in a range of 2 parts by weight to 100 parts by weight in 0.100 parts by weight of said epoxy acrylate, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried to be a paste by crosslinking chemical reaction by beams of light.    
     
     
         5 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a reactive diluent, a light initiator, a hardener, and a solvent,    said filler has at least one of silica and talc, and a coloring pigment,    said pest repellent is contained in a range of 5 parts by weight to 100 parts by weight in 100 parts by weight of said epoxy resin, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried to be a paste by crosslinking chemical reaction by beams of light and heating.    
     
     
         6 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc, and titanium oxide as coloring pigment,    said pest repellent is contained in a range of 5 parts by weight to 150 parts by weight in 100 parts by weight of said epoxy resin, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried by crosslinking chemical reaction of said resin, thereby having a function as a solder resist capable of forming an electric insulating film.    
     
     
         7 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc, and phthalocyanine green as coloring pigment,    said pest repellent is contained in a range of 8 parts by weight to 120 parts by weight in 100 parts by weight of said epoxy resin, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried by crosslinking chemical reaction of said resin, thereby having a function as a solder resist capable of forming an electric insulating film.    
     
     
         8 . An electronic component material of  claim 1 , 
 wherein said resin has epoxy acrylate, a reactive diluent, and a light initiator,    said filler has at least one of silica and talc, and phthalocyanine green as coloring pigment,    said pest repellent is contained in a range of 5 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy acrylate, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried by beams of light, thereby having a function as a solder resist capable of forming an electric insulating film.    
     
     
         9 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a reactive diluent, a light initiator, a hardener, and a solvent,    said filler has at least one of silica and talc, and phthalocyanine green as coloring pigment,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy acrylate, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried by beams of light and heating, thereby having a function as a solder resist capable of forming an electric insulating film.    
     
     
         10 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a hardener, and a solvent,    said filler is at least one of glass woven fabric and glass non-woven fabric,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy acrylate, and    said resin and said pest repellent are impregnated in said filler, and are cured and dried by crosslinking chemical reaction of said resin, thereby having a function as a prepreg.    
     
     
         11 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy acrylate, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried by crosslinking chemical reaction of said resin, thereby having a function as a paste capable of forming an electric insulating layer.    
     
     
         12 . An electronic component material of  claim 1 , 
 wherein said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy acrylate, and    said resin, said pest repellent and said filler are mutually mixed and dispersed, and are cured and dried by crosslinking chemical reaction of said resin, thereby having a function as a paste capable of forming a film.    
     
     
         13 . An electronic component material of  claim 1 , wherein said pest repellent is a cockroach repellent.  
     
     
         14 . An electronic component material of  claim 1 , wherein said pest repellent contains a neurotransmitter repellent having pyrolysis temperature of about 250 deg. C. or more.  
     
     
         15 . An electronic component material of  claim 1 , wherein said pest repellent contains a pyrethroid compound having pyrolysis temperature of about 250 deg. C. or more.  
     
     
         16 . An electronic component material of  claim 3 , wherein said resin further contains a reaction promoter.  
     
     
         17 . An electronic component comprising: 
 (a) a printed wiring board having an electric insulating board and a conductive layer disposed on the surface of said electric insulating board, and    (b) a pest repelling layer disposed on the surface of said printed wiring board having a function of repelling pest insects,    wherein said pest repelling layer contains: 
 a crosslinked and cured resin, and  
 a pest repellent dispersed and disposed in said resin.  
   
     
     
         18 . An electronic component of  claim 17 , wherein said pest repelling layer further contains a filler dispersed and disposed in said resin.  
     
     
         19 . An electronic component of  claim 17 , wherein said pest repelling layer further contains a filler having at least one of silica and talc dispersed and disposed in said resin.  
     
     
         20 . An electronic component of  claim 17 , wherein said pest repellent is contained in a range of about 2 parts by weight to about 150 parts by weight in 100 parts by weight of said resin.  
     
     
         21 . An electronic component of  claim 17 , wherein said pest repellent is a cockroach repellent.  
     
     
         22 . An electronic component comprising: 
 (a) a printed wiring board having an electric insulating board, a conductive layer disposed on the, surface of said electric insulating board, and a first solder resist disposed to cover said conductive layer, and    (b) a pest repelling layer disposed on the surface of said first solder resist,    wherein said pest repelling layer includes:    a crosslinked and cured resin, and    a pest repellent dispersed and disposed in said resin.    
     
     
         23 . An electronic component of  claim 22 , 
 wherein said conductive layer has a mounting land, and    said first solder resist is disposed to cover said conductive layer excluding said mounting land.    
     
     
         24 . An electronic component of  claim 22 , 
 wherein said pest repelling layer contains: 
 said crosslinked and cured resin having an epoxy resin and a hardener,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc.  
   
     
     
         25 . An electronic component of  claim 24 , wherein said pest repellent is contained in a range of 5 parts by weight to 150 parts by weight in 100 parts by weight of said epoxy resin.  
     
     
         26 . An electronic component of  claim 24 , 
 wherein said pest repelling layer contains: 
 said crosslinked and cured resin having epoxy acrylate, a reactive diluent, and a light initiator,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc.  
   
     
     
         27 . An electronic component of  claim 26 , wherein said pest repellent is contained in a range of 2 parts by weight to 100 parts by weight in 100 parts by weight of said epoxy acrylate.  
     
     
         28 . An electronic component of  claim 24 , 
 wherein said pest repelling layer contains: 
 said crosslinked and cured resin having an epoxy resin, a reactive diluent, a light initiator, and a hardener,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc.  
   
     
     
         29 . An electronic component of  claim 28 , wherein said pest repellent is contained in a range of 5 parts by weight to 150 parts by weight in 100 parts by weight of said epoxy resin.  
     
     
         30 . An electronic component of  claim 24 , 
 wherein said pest repelling layer contains: 
 said crosslinked and cured resin having an epoxy resin and a hardener,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc, and  
 said pest repelling layer has a shape of a parts layout.  
   
     
     
         31 . An electronic component of  claim 30 , 
 wherein said filler further contains titanium oxide pigment.    
     
     
         32 . An electronic component of  claim 24 , 
 wherein said pest repelling layer contains: 
 said crosslinked and cured resin having an epoxy resin and a hardener,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc, and  
 said pest repelling layer has a parts layout, and a shape having a specified width in the peripheral region of said parts layout.  
   
     
     
         33 . An electronic component of  claim 32 , wherein said width of said pest repelling layer disposed in the peripheral region of said parts layout is about 10 cm or more.  
     
     
         34 . An electronic component of  claim 17 , wherein said pest repelling layer has a shape of a parts layout.  
     
     
         35 . An electronic component of  claim 17 , wherein said pest repelling layer is disposed in the peripheral region of said printed wiring board.  
     
     
         36 . An electronic component comprising: 
 (a) a printed wiring board having an electric insulating board and a conductive layer disposed on the surface of said electric insulating board, and    (b) a pest repelling layer disposed to cover said conductive layer,    wherein said pest repelling layer contains: 
 a crosslinked and cured resin, and  
 a pest repellent dispersed and disposed in said resin.  
   
     
     
         37 . An electronic component of  claim 36 , 
 wherein said conductive layer has a mounting land,    said pest repelling layer has a function as second solder resist and electric insulating film, and    said pest repelling layer is disposed to cover said conductive layer except for the mounting land.    
     
     
         38 . An electronic component of  claim 36 , 
 wherein said pest repelling layer has a function as second solder resist and electric insulating film, and    said pest repelling layer contains: 
 said crosslinked and cured resin having an epoxy resin and a hardener,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc, and phthalocyanine green as coloring pigment.  
   
     
     
         39 . An electronic component of  claim 38 , 
 wherein said pest repellent is contained in a range of 8 parts by weight to 120 parts by weight in 100 parts by weight or said epoxy resin.    
     
     
         40 . An electronic component of  claim 36 , 
 wherein said pest repelling layer has a function as second solder resist and electric insulating film, and    said pest repelling layer contains: 
 said crosslinked and cured resin having epoxy acrylate, a reactive diluent, and a light initiator,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc, and phthalocyanine green as coloring pigment.  
   
     
     
         41 . An electronic component of  claim 40 , 
 wherein said pest repellent is contained in a range of 5 parts by weight to 80 parts by weight in 100 parts by weight or said epoxy acrylate.    
     
     
         42 . An electronic component of  claim 36 , 
 wherein said pest repelling layer has a function as second solder resist and electric insulating film, and    said pest repelling layer contains: 
 said crosslinked and cured resin having an epoxy resin, a reactive diluent, a light initiator, and a hardener,  
 said pest repellent dispersed and disposed in said resin, and  
 a filler dispersed and disposed in said resin, having at least one of silica and talc, and phthalocyanine green as coloring pigment.  
   
     
     
         43 . An electronic component of  claim 42 , 
 wherein said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight or said epoxy resin.    
     
     
         44 . An electronic component comprising: 
 (a) a printed wiring board having an electric insulating board, and a copper clad circuit layer disposed on the surface of said electric insulating board, and    (b) a pest repelling layer laminated and disposed at said copper clad circuit layer side of said printed wiring board,    wherein said pest repelling layer includes: 
 at least one base material of glass woven fabric and glass non-woven fabric,  
 a cured and dried crosslinked resin impregnated in said base material, having en epoxy resin and a hardener, and  
 a pest repellent dispersed and disposed in both said base material and said cured and dried crosslinked resin.  
   
     
     
         45 . An electronic component of  claim 44 , further comprising: 
 (c) a first solder resist disposed on the surface of said copper clad circuit layer,    wherein said copper clad circuit layer has a mounting land,    said first solder resist is disposed in a region excluding said mounting land,    said pest repelling layer is disposed on the surface of said solder resist, and    said pest repelling layer is disposed at the outermost layer side of said printed wiring board.    
     
     
         46 . An electronic component of  claim 45 , 
 wherein said electric insulating board is a glass-epoxy board,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy resin, and    said pest repelling layer is formed by pressing, heating and curing a prepreg composed of said base material impregnating said pest repellent, said epoxy resin and said hardener, together with said glass-epoxy board.    
     
     
         47 . An electronic component comprising: 
 (a) a printed wiring board having an electric insulating board, and a first copper clad circuit layer disposed on the surface of said electric insulating board,    (b) a pest repelling layer laminated and disposed at said first copper clad circuit layer side of said printed wiring board, and    (c) a second copper clad circuit layer disposed at other side of said printed wiring board,    wherein said pest repelling layer includes: 
 at least one base material of glass woven fabric and glass non-woven fabric,  
 a cured and dried crosslinked resin impregnated in said base material, having en epoxy resin and a hardener, and  
 a pest repellent dispersed and disposed in both said base material and said cured and dried crosslinked resin.  
   
     
     
         48 . An electronic component of  claim 47 , further comprising: 
 (d) a first solder resist disposed on the surface of said second copper clad circuit layer,    wherein said second copper clad circuit layer has a mounting land,    said first solder resist is disposed in a region excluding said mounting land, and    said pest repelling layer is disposed at the outermost layer side of said printed wiring board.    
     
     
         49 . An electronic component of  claim 47 , 
 wherein said electric insulating board is a glass-epoxy board,    said pest repel lent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy resin, and    said pest repelling layer is formed by pressing, heating and curing a prepreg composed of said base material impregnating said pest repellent, said epoxy resin and said hardener, together with said glass-epoxy board.    
     
     
         50 . An electronic component comprising: 
 (a) a printed wiring board having an electric insulating board, and a first copper clad circuit layer disposed on the surface of said electric insulating board,    (b) a pest repelling layer laminated and disposed at said first copper clad circuit layer side of said printed wiring board,    (c) a second copper clad circuit layer disposed at other side of said printed wiring board, and    (d) an interstitial via hole (IVH),    wherein said pest repelling layer includes: 
 at least one base material of glass woven fabric and glass non-woven fabric,  
 a cured and dried crosslinked resin impregnated in said base material, having en epoxy resin and a hardener, and  
 a pest repellent dispersed and disposed in both said base material and said cured and dried crosslinked resin.  
   
     
     
         51 . An electronic component of  claim 50 , 
 wherein said electric insulating board is a board cured by heating a glass-epoxy prepreg,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy resin, and    said pest repelling layer and said electric insulating board are both formed by pressing, heating and curing a prepreg composed of said base material impregnating said pest repellent, said epoxy resin and said hardener, together with said glass-epoxy prepreg.    
     
     
         52 . An electronic component of  claim 47 , 
 wherein said electric insulating board is a glass-epoxy board,    said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy resin, and    said pest repelling layer is formed by heating and curing a coat film of a mixture of said resin said pest repellent and said filler applied by at least one method selected from the group consisting of screen printing, curtain coating, and laminating.    
     
     
         53 . An electronic component of  claim 52 , further comprising: 
 (d) a first solder resist disposed on the surface of said second copper clad circuit layer,    wherein said second copper clad circuit layer has a mounting land,    said first solder resist is disposed in a region excluding said mounting land, and    said pest repelling layer is disposed at the outermost layer side of said printed wiring board.    
     
     
         54 . An electronic component of  claim 47 , 
 wherein said electric insulating board is a glass-epoxy board,    said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc,    said pest repellent is contained in a range of 10 parts by weight to 80 parts by weight in 100 parts by weight of said epoxy resin, and    said pest repelling layer has a film formed by curing and drying by crosslinking chemical reaction of said resin in a paste containing said resin said pest repellent and said filler.    
     
     
         55 . An electronic component of  claim 54 , further comprising: 
 (d) a first solder resist disposed on the surface of said second copper clad circuit layer,    wherein said second copper clad circuit layer has a mounting land,    said first solder resist is disposed in a region excluding said mounting land, and    said pest repelling layer is disposed at the outermost layer side of said printed wiring board.    
     
     
         56 . An electronic component comprising: 
 (a) an integrated circuit of one of IC and LSI, and    (b) a pest repelling layer having a function for repelling pest insects disposed on the surface of said integrated circuit,    wherein said pest repelling layer includes: 
 a crosslinked and cured resin, and  
 a pest repellent dispersed and disposed in said resin.  
   
     
     
         57 . An electronic component comprising: 
 (a) an integrated circuit of one of IC and LSI, and    (b) a pest repelling layer having a function for repelling pest insects disposed on the surface of said integrated circuit,    wherein said pest repelling layer contains a crosslinked and cured resin, and a pest repellent dispersed and disposed in said resin,    said resin has an epoxy resin, a hardener, and a solvent,    said filler has at least one of silica and talc, and titanium oxide as coloring pigment,    said pest repellent is contained in a range of 5 parts by weight to 150 parts by weight in 100 parts by weight of said epoxy resin,    said resin, said pest repellent and said filler are mutually mixed and dispersed, and cured and dried by crosslinking chemical reaction of said resin, and    said pest repelling layer is formed in at least one shape of stencil characters or graphic patterns to show at least the manufacturer's name and product number.    
     
     
         58 . A manufacturing method of electronic component having a pest repelling layer with a function. of repelling pest insects on the surface of a printed wiring board, 
 said method comprises: 
 (a) a step of preparing an electronic component material having a pest repel lent and a resin which may be crosslinked and cured,  
 (b) a step of applying said electronic component material at a specified position on the surface of said printed wiring board, and  
 (c) a step of forming said cured pest repelling layer, containing said pest repel lent, by crosslinking chemical reaction of said resin in said electronic component material on said printed wiring board.  
   
     
     
         59 . A manufacturing method of electronic component of  claim 58 , 
 wherein, at said step (a), said electronic component material further contains a solvent, and    at said step (c), when said resin is cured, said pest repelling layer is formed in a state in which part of said pest repellent is moved to the surface of said pest repelling layer by the action of said solvent.    
     
     
         60 . A manufacturing method of electronic component of  claim 58 , further comprising: 
 (d) a step of soldering other electronic component on said printed wiring board forming said pest repelling layer.    
     
     
         61 . A manufacturing method of electronic component of claim  58 , 
 wherein, at said step (a), said printed wiring board has a conductive layer disposed on the surface of an electric insulating board, and    at said step (b), said electronic component material is disposed to cover said conductive layer.    
     
     
         62 . A manufacturing method of electronic component of  claim 61 , 
 wherein said conductive layer has a mounting land, and    said electronic component material is disposed to cover said conductive layer excluding the position of said mounting land.    
     
     
         63 . A manufacturing method of electronic component of  claim 58 , 
 wherein said resin has an epoxy resin, a hardener, and a solvent,    said electronic component material is a paste, and    at said step (c), when said resin is cured, said pest repelling layer is formed in a state in which part of said pest repellent is moved to the surface of said pest repelling layer by the action of said solvent.    
     
     
         64 . A manufacturing method of electronic component of  claim 58 , 
 wherein said resin has epoxy acrylate, a reactive diluent, and a light initiator,    said electronic component material is a paste, and    at said step (c), said resin is curd by irradiation of beams of light, and when said resin is cured, said pest repelling layer is formed in a state in which part of said pest repellent is moved to the surface of said pest repelling layer by the action of said reactive diluent.    
     
     
         65 . A manufacturing method of electronic component of  claim 58 , 
 wherein said resin has an epoxy resin, a reactive diluent, a light initiator, and a hardener,    said electronic component material is a paste, and    at said step (c), said resin is curd by irradiation of beams of light and heating, and when said resin is cured, said pest repelling layer is formed in a state in which part of said pest repellent is moved to the surface of said pest repelling layer by the action of said reactive diluent.    
     
     
         66 . A manufacturing method of electronic component of  claim 58 , 
 wherein said pest repellent is contained in a range of 2 parts by weight to 150 parts by weight in 100 parts by said of said resin.    
     
     
         67 . A manufacturing method of electronic component of  claim 58 , 
 wherein said electronic component material is a prepreg containing said resin and said pest repellent impregnated at least in one of glass woven fabric and glass non-woven fabric, and    at said step (c), said resin is cured by heating and pressing, and when said resin is cured, said pest repelling layer is formed in a state in which part of said pest repellent is moved to the surface of said pest repelling layer by the action of said reactive diluent.    
     
     
         68 . A manufacturing method of electronic component of  claim 58 , 
 wherein said electronic component material is a prepreg containing said resin and said pest repellent impregnated at least in one of glass woven fabric and glass non-woven fabric,    said printed wiring board has a glass-epoxy electric insulating board and a copper clad circuit, and    at said step (c), glass-epoxy prepreg, said copper clad circuit, and said electronic component material are pressed and heated, and said electric insulating board, said copper clad circuit, and said pest repelling layer are laminated and formed.    
     
     
         69 . A manufacturing method of electronic component of claim  58 , wherein said pest repellent is a cockroach repellent.  
     
     
         70 . A manufacturing method of electronic component of  claim 58 , wherein said pest repellent contains a neurotransmitter repellent having pyrolysis temperature of about 250 deg. C. or more.  
     
     
         71 . An electronic component of  claim 17 , wherein said pest repellent is a cockroach repellent.  
     
     
         72 . An electronic component material of  claim 1 , wherein said resin contains a resin having an epoxy group in its chemical structure.  
     
     
         73 . An electronic component material of  claim 1 , wherein said resin contains a prepolymer having plural epoxy groups in its chemical structure and a hardener which can react with said epoxy groups.  
     
     
         74 . An electronic component material of  claim 1 , wherein said resin contains a prepolymer having epoxy group and acrylic group in its chemical structure.  
     
     
         75 . An electronic component of  claim 17 , wherein said pest repelling layer is formed by crosslinking and curing an electronic component material having a curable resin containing an epoxy group in its chemical structure and said pest repellent, in a state in contact with the surface of said printed wiring board.  
     
     
         76 . An electronic component of  claim 17 , wherein said pest repelling layer is formed by crosslinking and curing an electronic component material having a curable resin containing a prepolymer having, plural epoxy groups in its chemical structure and a hardener which may react with said epoxy groups, and said pest repel lent, in a state in contact with the surface of said printed wiring board.  
     
     
         77 . An electronic component of  claim 17 , wherein said pest repelling layer is formed by crosslinking and curing an electronic component material having a curable resin containing a prepolymer having epoxy group and acrylic group in its chemical structure, and said pest repellent, in a state in contact with the surface of said printed wiring board.  
     
     
         78 . A manufacturing method of electronic component of  claim 58 , wherein said resin contains a resin having an epoxy group in its chemical structure.  
     
     
         79 . A manufacturing method of electronic component of claim  58 , wherein said resin contains a prepolymer having plural epoxy groups in its chemical structure and a hardener which can react with said epoxy groups.  
     
     
         80 . A manufacturing method of electronic component of  claim 58 , wherein said resin contains a prepolymer having epoxy group and acrylic group in its chemical structure.