Thermal enhanced extended surface tape for integrated circuit heat dissipation

Abstract

A thermal conductive tape article is provided which is adhered to the surface of an integrated circuit device to dissipate heat from the device. The thermal conductive tape article is preferably corrugated and may have a number of configurations providing an expanded surface area. The corrugated tape article may also have a metal strip bonded to one or both sides of the tape article to form a single-faced or double-faced corrugated tape article. The tape article is preferably made of copper or aluminum.

Thus, having described the invention, what is claimed is:  
     
         1 . A method to enhance integrated circuit device heat dissipation comprising the steps of: 
 providing an integrated circuit device having a surface;    providing a flexible strip of a thermal conductive material; and    adhering the strip to the surface of the integrated circuit device.    
     
     
         2 . The method of  claim 1  wherein the strip is corrugated.  
     
     
         3 . The method of  claim 2  wherein the strip is metal and is copper or aluminum.  
     
     
         4 . The method of  claim 3  wherein the thickness of the strip is 0.5 mil to 10 mil.  
     
     
         5 . The method of  claim 4  wherein the corrugated strip has corrugations in the shape of a repeating series of triangles.  
     
     
         6 . The method of  claim 4  wherein the corrugations in the strip are in the shape of a repeating series of convex and concave portions comprising sidewall portions, top portions and bottom portions.  
     
     
         7 . The method of  claim 4  wherein the corrugations in the strip are in the shape of a repeating series of convex portions comprising angled sidewalls and a top portion and a triangular concave portion.  
     
     
         8 . The method of  claim 4  wherein the corrugations in the strip are in the shape of a series of vertical fins.  
     
     
         9 . The method of  claim 4  wherein the corrugating in the strip are in the shape of a repeating series of loops.  
     
     
         10 . The method of  claim 1  wherein the flexible corrugated strips have an adhesive thereon to adhere the corrugated strip to the integrated circuit device.  
     
     
         11 . The method of  claim 2  wherein the flexible corrugated strip has a flat flexible strip of a thermal conductive material bonded to one side thereto forming a single-faced flexible corrugated strip article.  
     
     
         12 . The method of  claim 11  wherein the flat flexible strip article has an adhesive thereon on the side to be adhered to an integrated circuit device.  
     
     
         13 . The method of  claim 11  wherein the single-faced flexible corrugated strip article has a flat flexible strip of thermal conductive material bonded to the other side of the flexible corrugated strip forming a double-faced flexible corrugated strip.  
     
     
         14 . The method of  claim 13  wherein at least one of the flat flexible strips has an adhesive on the side to be adhered to the integrated circuit device.  
     
     
         15 . The method of  claim 14  wherein each side of the flat flexible strips has an adhesive thereon for adhering to an integrated circuit device.  
     
     
         16 . A method to enhance integrated circuit device heat dissipation comprising the steps of: 
 providing an integrated circuit device having a surface;    providing a strip of flexible flat thermal conductive material;    forming corrugations in the flexible thermal conductive material; and    adhering the corrugated flexible thermal conductive material to the surface of an integrated circuit device.    
     
     
         17 . The method of  claim 16  wherein an adhesive is applied to the strip surface before corrugation.  
     
     
         18 . The method of  claim 16  wherein an adhesive is applied to a strip surface after corrugation.  
     
     
         19 . The method of  claim 16  wherein a flexible strip thermal conductive material is bonded to the corrugated flexible thermal conductive material forming a single-faced corrugated strip article.  
     
     
         20 . The method of  claim 19  wherein an adhesive is applied to the side of a single-faced corrugated strip to be adhered to an integrated circuit device.  
     
     
         21 . The method of  claim 19  wherein a second flexible strip thermal conductive material is bonded to the other side of the corrugated flexible thermal conductive material forming a double-faced corrugated strip article.  
     
     
         22 . The method of  claim 21  wherein an adhesive is applied to the side of the double-faced corrugated strip to be adhered to an integrated circuit device.  
     
     
         23 . The method of  claim 22  wherein an adhesive is applied to each side of the double-faced corrugated tape article.  
     
     
         24 . An article of manufacture for dissipating heat for integrated circuit devices comprising a flexible strip of thermal conductive material having an adhesive on a portion thereof which will contact with and adhere the strip to an integrated circuit device.  
     
     
         25 . The article of  claim 24  wherein the flexible strip is corrugated.  
     
     
         26 . The article of  claim 25  wherein the flexible corrugated strip has a flat flexible strip of thermal conductive material bonded to the strip forming a single-faced flexible corrugated strip article.  
     
     
         27 . The article of  claim 26  wherein the flat strip of thermal conductive material has an adhesive on the side to be adhered to an integrated circuit device.  
     
     
         28 . The article of  claim 26  wherein a second flat flexible strip of thermal conductive material is bonded to the other side of the corrugated tape to form a double-faced flexible corrugated strip.  
     
     
         29 . The article of  claim 28  wherein each side of the flat flexible strip of thermal conductive material has an adhesive thereon.  
     
     
         30 . The article of  claim 24  which has been surface treated to increase the emmisivity of the article.  
     
     
         31 . The article of  claim 25  which has been surface treated to increase the emmissivity of the article.  
     
     
         32 . An electronic component assembly comprising a housing containing an electronic component which is cooled by adhering the flexible article of  claim 24  to the electronic component and the housing.  
     
     
         33 . The electronic component assembly of  claim 32  wherein the housing is metal or has a thin metal coating thereon.  
     
     
         34 . The electronic component assembly of  claim 32  wherein the flexible article used is the article of claim  25 .