Multi-piece fiber optic component and manufacturing technique

Abstract

An apparatus for use in a commercial fiber optic connector is made up of an assembly of a set of slices. Each of the slices having multiple through holes of a specified arrangement. At least some of the through holes on any two adjoining slices are aligned with respect to each other so as to define a conduit between them. A transmission medium is within the holes. A method of making a fiber optic connector adapted to receive a fiber bearing unit is also described. The method involves coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure, coupling the at least two high precision pieces to a low precision piece to form a unit, and housing the unit within a fiber optic connector housing.

What is claimed is:  
     
         1 . An apparatus for use in a commercial fiber optic connector comprising: 
 an assembly of a set of slices, each of the slices having multiple through holes of a specified arrangement;    at least some of the through holes on any two adjoining slices being aligned with respect to each other so as to define a conduit between the any two adjoining slices; and    a transmission medium within the holes.    
     
     
         2 . The apparatus of  claim 1  wherein the transmission medium is an optical epoxy.  
     
     
         3 . The apparatus of  claim 1  further comprising: 
 a metal layer coating a periphery of the conduit.  
 
     
     
         4 . The apparatus of  claim 3  further comprising a thin dielectric material between the metal layer and the transmission medium.  
     
     
         5 . The apparatus of  claim 1  wherein the at least some of the through holes on the any two adjoining slices are axially aligned with each other.  
     
     
         6 . The apparatus of  claim 5  wherein the at least some of the through holes are all fiber holes.  
     
     
         7 . The apparatus of  claim 1  wherein some of the at least some through holes on the any two adjoining slices are axially misaligned with each other.  
     
     
         8 . The apparatus of  claim 1  wherein the at least some through holes have straight sidewalls.  
     
     
         9 . The apparatus of  claim 8  wherein, when a cross section of the assembly is taken along a through hole axis, a group of the through holes collectively comprise a Y branch.  
     
     
         10 . The apparatus of  claim 8  wherein, when a cross section of the assembly is taken along a through hole axis, a group of the through holes collectively comprise a series of parallel conduits.  
     
     
         11 . The apparatus of  claim 8  wherein at least two through holes on a first slice are aligned with a single common through hole on a second adjoining slice.  
     
     
         12 . The apparatus of  claim 1  wherein the at least some through holes have tapered sidewalls.  
     
     
         13 . The apparatus of  claim 12  wherein, when a cross section of the assembly is taken along a through hole axis, a group of the through holes collectively comprise a Y branch.  
     
     
         14 . The apparatus of  claim 12  wherein, when a cross section of the assembly is taken along a through hole axis, a group of the through holes collectively comprise a series of parallel conduits.  
     
     
         15 . The apparatus of  claim 12  wherein at least two through holes on a first slice are aligned with a single common through hole on a second adjoining slice.  
     
     
         16 . The apparatus of  claim 1  wherein the slices comprise silicon wafer and the through holes are created using an isotropic wet etch process.  
     
     
         17 . The apparatus of  claim 16  wherein the isotropic wet etch process is a KOH etch.  
     
     
         18 . The apparatus of  claim 1  wherein the slices comprise silicon wafer and the through holes are created using an anisotropic etch process.  
     
     
         19 . The apparatus of  claim 18  wherein the anisotropic etch process is a Bosch process.  
     
     
         20 . The apparatus of  claim 19  wherein the through holes adjoin at a clean edge created by an isotropic silicon wet etch.  
     
     
         21 . The apparatus of  claim 1  wherein the through holes are created using a drilling process.  
     
     
         22 . An apparatus to guide light between an optical device and a fiber comprising: 
 a set of pieces, each cleaved from a silicon wafer having a first side and a second side, wherein each piece has internal walls defining holes created by: 
 i) performing a Bosch etch on the first side of the silicon wafer to create etch indentations in the silicon wafer,  
 ii) depositing a SiN x  stop layer in the etch indentations;  
 iii) photoresist patterning the second side in alignment with the indentations in the first side,  
 iv) wet etching the second side, and  
 v) removing the SiN x  stop layer,  
   the pieces being stacked together as a unit such that the first sides abut the second sides, and at least some of the holes in one piece at least partly align with at least some of the holes in an abutting piece, and    the pieces having an optical transmission medium inside at least some of the holes.    
     
     
         23 . The apparatus of  claim 22  wherein the apparatus is further created by vi) performing a clean up etching of the holes.  
     
     
         24 . The apparatus of  claim 22  further comprising: 
 at least one alignment hole in each piece in the stack.  
 
     
     
         25 . A coupler, of dimensions suitable for use in a commercial fiber optic connector adapted to accept a ferrule, the coupler comprising: 
 multiple pieces each having a thickness and edges defining a first surface and a second surface opposite the first surface,    the pieces each further having an array of holes, at least some of the holes being guide holes extending through the thickness between the first surface and the second surface,    the at least some guide holes having a first opening size on the first surface and a second opening size on the second surface smaller than the first opening size,    the multiple pieces being joined in a stack and dimensioned so as to fit within the commercial fiber optic connector as at least part of the ferrule, and    the guide holes each being filled with an optical epoxy.    
     
     
         26 . The coupler of  claim 25  wherein the second opening size is substantially constant for a distance within the thickness.  
     
     
         27 . The coupler of  claim 26  wherein the distance is approximately ½ of the thickness.  
     
     
         28 . The coupler of  claim 26  wherein the transition between the first opening size and the second opening size is substantially linear.  
     
     
         29 . The coupler of  claim 25  wherein the thickness is approximately equal to one of a four inch silicon wafer thickness or an eight inch silicon wafer thickness.  
     
     
         30 . The coupler of  claim 25  wherein: 
 a first piece in the stack abuts a second piece in the stack,  
 a guide hole on the first piece is coaxial with a guide hole on the second piece, and  
 the optical epoxy provides an optical path between the guide hole on the first piece and the guide hole on the second piece.  
 
     
     
         31 . The coupler of  claim 25  wherein: 
 a first piece in the stack abuts a second piece in the stack,  
 a guide hole on the first piece has a first axis,  
 a guide hole on the second piece has a second axis,  
 the optical epoxy provides an optical path between the guide hole on the first piece and the guide hole on the second piece, and  
 the first axis and the second axis are not aligned.  
 
     
     
         32 . The coupler of  claim 25  wherein the stack comprises exactly two pieces.  
     
     
         33 . The coupler of  claim 25  wherein the stack comprises at least three pieces.  
     
     
         34 . The coupler of  claim 25  wherein the stack comprises at least 10 pieces.  
     
     
         35 . The coupler of  claim 25  further comprising a low precision unit adapted to receive the stack, the low precision unit having a peripheral surface shaped like the ferrule.  
     
     
         36 . The coupler of  claim 25  wherein the commercial fiber optic connector is one of an MTP, MPO, MPX or SMC type connector and wherein the coupler comprises a low precision unit adapted to receive the stack and the stack, the low precision piece and the stack when combined having dimensions substantially equal to a respective one of an MTP, MPO, MPX or SMC ferrule dimensions.  
     
     
         37 . A method of making a fiber optic connector adapted to receive a fiber bearing unit, the method comprising: 
 coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure,    coupling the at least two high precision pieces to a low precision piece to form a unit, and    housing the unit within a fiber optic connector housing.    
     
     
         38 . A communications assembly component comprising: 
 a fiber bundle having a first end and a second end opposite the first end,    a first connector on the first end,    a second connector on the second end,    the first connector comprising a waveguide component having several slices piled together to form a stack,    a first of the slices in the stack having a first through hole,    a second of the slices in the stack having a second through hole,    the first and second slices being separated by at least one additional slice,    a waveguide structure connecting the first through hole with the second through hole, the first through hole and the second through hole being displaced from each other in at least two dimensions.    
     
     
         39 . The communications assembly component of  claim 38  wherein the at least two dimensions is exactly three dimensions.