Latent curing agent for epoxy resin, and curable epoxy resin composition

Abstract

Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.

1 . A latent curing agent for epoxy resin, which comprises: 
 (A) a radically polymerized polymer of a monomer having at least one polymerizable double bond, which polymer has at least one tertiary amino group in the molecule, and    (B) a polymer having at least one hydroxyl group in the molecule, and wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond and said polymer having at least one hydroxyl group form a solid solution that is solid at 25° C.    
     
     
         2 . The latent curing agent for epoxy resin of  claim 1 , wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond also contains at least one amido bond.  
     
     
         3 . The latent curing agent for epoxy resin of  claim 1 , wherein said polymer having at least one hydroxyl group is solid at 25° C.  
     
     
         4 . The latent curing agent for epoxy resin of  claim 3 , wherein said polymer having at least one hydroxyl group is a reaction product of an epoxy resin and an active hydrogen compound.  
     
     
         5 . The latent curing agent for epoxy resin of  claim 3 , wherein said polymer having at least one hydroxyl group further contains at least one urethane and/or urea bond in the molecule.  
     
     
         6 . The latent curing agent for epoxy resin of  claim 1 , wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond has a softening point not higher than 150° C.  
     
     
         7 . The latent curing agent for epoxy resin of  claim 1 , wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond and said polymer having at least one hydroxyl group in the molecule are present in a weight ratio of 1:20 to 3:1.  
     
     
         8 . A curable epoxy resin composition, comprising: 
 (a) an epoxy compound with at least two epoxy groups in the molecule: and    (b) a latent curing agent, wherein said latent curing agent comprises: 
 (A) a radically polymerized polymer of a monomer having at least one polymerizable double bond, which polymer has at least one tertiary amino group in the molecule; and  
 (B) a polymer having at least one hydroxyl group in the molecule, and wherein said latent curing agent is a solid solution that is solid at 25° C.  
   
     
     
         9 . The curable epoxy resin composition of  claim 8 , wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond also contains at least one amido bond.  
     
     
         10 . The curable epoxy resin composition of  claim 8 , wherein said polymer having at least one hydroxyl group is solid at 25° C.  
     
     
         11 . The curable epoxy resin composition of  claim 10 , wherein said polymer having at least one hydroxyl group is a reaction product of an epoxy resin and an active hydrogen compound.  
     
     
         12 . The curable epoxy resin composition of  claim 10 , wherein said polymer having at least one hydroxyl group further contains at least one urethane and/or urea bond in the molecule.  
     
     
         13 . The curable epoxy resin composition of  claim 8 , wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond has a softening point not higher than 150° C.  
     
     
         14 . The curable epoxy resin composition of  claim 8 , wherein said latent curing agent comprises said radically polymerized polymer of a monomer having at least one polymerizable double bond and said polymer having at least one hydroxyl group in the molecule in a weight ratio of 1:20 to 3:1.  
     
     
         15 . The curable epoxy resin composition of  claim 8 , wherein said latent curing agent is present in an amount of 0.3 to 50 parts by weight based on 100 parts by weight of said epoxy compound.  
     
     
         16 . A method for preparing an article, said method comprising: 
 (1) applying an epoxy resin composition to at least one surface of a substrate; and    (2) curing said epoxy resin composition,    wherein said epoxy resin composition comprises:    (a) an epoxy compound with at least two epoxy groups in the molecule: and    (b) a latent curing agent,    wherein said latent curing agent comprises:    (A) a radically polymerized polymer of a monomer having at least one polymerizable double bond, which polymer has at least one tertiary amino group in the molecule; and    (B) a polymer having at least one hydroxyl group in the molecule,    and wherein said latent curing agent is a solid solution that is solid at 25° C.    
     
     
         17 . The method of  claim 16 , wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond also contains at least one amido bond.  
     
     
         18 . The method of  claim 16 , wherein said polymer having at least one hydroxyl group is solid at 25° C.  
     
     
         19 . The method of  claim 16 , wherein said polymer having at least one hydroxyl group is a reaction product of an epoxy resin and an active hydrogen compound.  
     
     
         20 . The method of  claim 16 , wherein said polymer having at least one hydroxyl group further contains at least one urethane and/or urea bond in the molecule.  
     
     
         21 . The method of  claim 16 , wherein said radically polymerized polymer of a monomer having at least one polymerizable double bond has a softening point not higher than 150° C.  
     
     
         22 . The method of  claim 16 , wherein said latent curing agent comprises said radically polymerized polymer of a monomer having at least one polymerizable double bond and said polymer having at least one hydroxyl group in the molecule in a weight ratio of 1:20 to 3:1.  
     
     
         23 . The method of  claim 16 , wherein said latent curing agent is present in said epoxy resin composition in an amount of 0.3 to 50 parts by weight based on 100 parts by weight of said epoxy compound.