Semiconductor light emitting device package

Abstract

A semiconductor package includes two or more conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode, may be attached to the inner conductor and to the outer conductor. The package may be, for example, cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors.

What is being claimed is:  
     
         1 . A semiconductor package comprising: 
 a first conductor having a face end and a first length;    a second conductor at least partially surrounding the first conductor and having a second length;    a first insulator disposed between the first conductor and the second conductor; and    a flip chip semiconductor device electrically connected to the face end of the first conductor and to the second conductor.    
     
     
         2 . The semiconductor package of  claim 1 , wherein the semiconductor device is a light emitting diode (LED).  
     
     
         3 . The semiconductor package of  claim 1 , wherein the face end is one of concave and pedestal.  
     
     
         4 . The semiconductor package of  claim 1 , wherein the first conductor and the second conductor are concentric.  
     
     
         5 . The semiconductor package of  claim 1 , wherein the first conductor and the second conductor are coaxial.  
     
     
         6 . The semiconductor package of  claim 1 , wherein the first length is longer than the second length.  
     
     
         7 . The semiconductor package of  claim 1 , wherein the first length and the second length are about equal.  
     
     
         8 . The semiconductor package of  claim 1 , wherein the second conductor completely surrounds a portion of the first length.  
     
     
         9 . The semiconductor package of  claim 1 , wherein the flip chip semiconductor device is directly attached to the face end with no intermediate structure.  
     
     
         10 . The semiconductor package of  claim 1  further comprising a lens overlying the flip chip semiconductor device.  
     
     
         11 . The semiconductor package of  claim 1  further comprising a heat sink connected to the first conductor.  
     
     
         12 . The semiconductor package of  claim 1  wherein a first portion of the flip chip semiconductor device is affixed to the first conductor and a second portion of the flip chip semiconductor device is affixed to the second conductor.  
     
     
         13 . A semiconductor package, comprising: 
 a first conductor having a face end and a first length;    a second conductor at least partially surrounding the first conductor and having a second length;    a first insulator disposed between the first conductor and the second conductor;    a first semiconductor device attached to the face end of the first conductor and to the second conductor;    a third conductor at least partially surrounding the second conductor and having a third length;    a second insulator separating the third and the second conductors; and    a second semiconductor device attached to the first conductor and to the third conductor.    
     
     
         14 . The semiconductor package of  claim 13 , wherein the first conductor includes an exposed flat surface along the first length and an insulated surface along the first length, and wherein the second and third conductors at least partially surround the insulated surface.  
     
     
         15 . The semiconductor package of  claim 14 , further comprising a plurality of electrical devices mounted on the exposed flat surface, each of the plurality of electrical devices electrically connected to one of the second conductor and the third conductor.  
     
     
         16 . The semiconductor package of  claim 15 , wherein the plurality of electrical devices includes one or more LEDs.  
     
     
         17 . The semiconductor package of  claim 15 , wherein the plurality of electrical devices comprise one or more of a semiconductor laser, a resistor, an inductor, and a capacitor.  
     
     
         18 . The semiconductor package of  claim 14 , wherein the first conductor is generally cylindrical, wherein the insulated surface comprises a curved surface of the cylinder, and wherein the second and the third conductors at least partially surround the curved surface.  
     
     
         19 . The semiconductor package of  claim 14 , wherein the first conductor is a rectangular solid, wherein the insulated surface comprises any three sides of the first conductor along the first length, and wherein the second and third conductors at least partially surround the insulated surface.  
     
     
         20 . The semiconductor package of  claim 13 , further comprising: 
 a heat sink coupled to the inner conductor; and    a lens overlying at least one of the first and second semiconductor devices.    
     
     
         21 . A coaxial package for mounting electrical components, comprising: 
 an inner conductor, comprising: 
 a first surface for mounting the electrical components; and  
 an electrical connection section for coupling the package to an electrical supply;  
   at least one outer conductor generally coaxial with the inner conductor; and    an electrical insulator disposed between the inner and each of the at least one outer conductors.    
     
     
         22 . The coaxial package of  claim 21 , wherein the inner conductor is a solid body having end faces and one or more side faces, wherein the first surface is on an end face, wherein the inner conductor comprises a second surface for mounting the electrical components, the second surface formed on one or more of the one or more side faces wherein one or more electrical components are disposed on the second surface.