Critically aligned optical mems dies for large packaged substrate arrays and method of manufacture

Abstract

A novel array of optically and electrically interacting optical MEMS dies physically and electrically integrally attached upon an optically transmissive preferably (transparent) printed circuit substrate that is monolithically formed with one or more optical components, such as lenses, for providing fixed optical path alignment and interaction therebetween, and with provision for the integration also of active optical components such as lasers and photodiodes and the like.

What is claimed is:  
     
         1 . An assembled array of optically and electrically interacting optical MEMS dies physically and electrically integrally attached upon a light-transmissive substrate carrying a pattern of printed electrical circuit interconnections for operating the dies; the light-transmissive substrate being integrated monolithically with optical components to provide accurate and fixed optical alignment of the MEMS and the optical components optically interacting therewith.  
     
     
         2 . The assembled array of  claim 1  wherein the optical components comprise lenses and the optical MEMS dies carry electrical signal-controllable mirrors, and said fixed optical alignment enables the lenses integrated in the light-transmissive substrate to focus light onto the MEMS mirrors along fixed optical paths for optically addressing the array.  
     
     
         3 . The assembled array of  claim 2  wherein the MEMS dies are provided with metalization between the mirrors, and are flip-chip solder-bonded in inverted position to conductive posts provided in the printed circuit of the substrate, with sufficient clearance between the substrate and the mirrors to avoid interference with the operation of the mirrors.  
     
     
         4 . The assembled array of  claim 3  wherein the lenses are integrally formed on the bottom surface of the substrate, enabling optical readout of the MEMS in reflection from the bottom surface.  
     
     
         5 . The assembled array of  claim 3  wherein a patterned optical blocking layer is applied to the substrate in areas surrounding said conductive posts.  
     
     
         6 . The assembled array of  claim 3  wherein the backside of the substrate is provided with a solid annular peripheral metalized region solder-attachable as to an external pin or ball grid array package housing.  
     
     
         7 . The assembled array of  claim 6  wherein a package housing is provided receiving the assembled array bonded therewithin with the substrate electrically connected to package pads disposed annularly within the housing.  
     
     
         8 . The assembled array of  claim 7  wherein the upper side of the substrate is provided with peripheral conductive pads connected internally of the package housing with said package pads as by wirebonding.  
     
     
         9 . The assembled array of  claim 7  wherein the upper side or the bottom of the package housing is apertured or windowed to enable the transmission of optical readout light for the array mounted within the package.  
     
     
         10 . The assembled array of  claim 9  wherein the packaged housing is sealed and the medium therewithin is environmentally controlled.  
     
     
         11 . An optical and electrical MEMS device physically and electrically integrally attached upon an optically transmissive substrate carrying a pattern of printed electrical circuit interconnections for the device, the light-transmissive substrate being integrated monolithically with an optical component to provide fixed optical alignment of the MEMS device and the optical component.  
     
     
         12 . The device as claimed in  claim 11  wherein the optical component is a passive optical element.  
     
     
         13 . The device as claimed in  claim 12  wherein the optical element is selected from the group consisting of lenses, diffractive optical elements, phase elements, masks, mirrors and polarizers.  
     
     
         14 . The device as claimed in  claim 11  wherein the optical component is an active optical element.  
     
     
         15 . The device as claimed in  claim 14  wherein the optical element is selected from the group consisting of light sources, and sensors including lasers and photodiodes.  
     
     
         16 . The device as claimed in  claim 14  wherein the optical element is integrated onto or into said light-transmissive substrate.  
     
     
         17 . An optical and electrical MEMS device physically and electrically integrally attached upon an optically transmissive substrate carrying a pattern of printed electrical circuit interconnections for the device, the light-transmissive substrate being integrated monolithically with an active optical component integrated onto or into the MEMS device or the light-transmissive substrate, and optically cooperative with the light-transmissive substrate as integrated with the MEMS device.  
     
     
         18 . The device as claimed in  claim 17  wherein the active optical component is selected from the group consisting of light sources, and sensors including lasers, VCSELs and photodetectors.  
     
     
         19 . The device as claimed in  claim 17  wherein the active optical device is carried by the MEMS device.  
     
     
         20 . The device as claimed in  claim 17  wherein a passive optical device is integrated into said substrate.  
     
     
         21 . A method for enabling the precision assembly of optical MEMS arrays to a single substrate without substantial restriction on the size or layout of the substrate, that comprises, custom-forming a plurality of MEMS dies each carrying electrical signal-controllable mirrors; forming a light transmissive substrate of desired size to accommodate the plurality of MEMS dies, and monolithically integrating into the light-transmissive substrate, optical components useful for light-path interfacing with the MEMS dies; providing integral printed electrical circuit interconnections on the substrate for operation of the mirrors of the dies; physically and electrically integrally attaching dies along and upon the single optically transmissive substrate and with electrical connection to the printed circuit, thereby to provide also for the accurate and fixed optical alignment of the MEMS dies and the optical components optically interacting therewith, enabling the focusing of light onto the MEMS mirrors along fixed optical paths for optically addressing the array and without requiring adjustments.  
     
     
         22 . The method of assembling an array of optically and electrically interacting optical MEMS dies, that comprises, physically and electrically integrally attaching the dies in a predetermined order or pattern along and upon a light-transmissive substrate carrying a pattern of printed electrical circuit interconnections for the dies; and monolithically integrating into the substrate, optical components for interacting light with the dies and to provide accurate and fixed optical alignment of the MEMS and the optical components optically interacting therewith.  
     
     
         23 . The method of  claim 22  wherein said optical components are passive and/or active optical elements.  
     
     
         24 . The method of  claim 23  wherein said optical components are active optical elements such as lasers and photodiodes and they are integratable onto or into said dies.  
     
     
         25 . The method of  claim 22  wherein the optical components comprise lenses and the optical MEMS dies carry electrical signal-controllable mirrors, and focusing light by said lenses along fixed optical paths for optically addressing the array.  
     
     
         26 . The method of  claim 25  wherein the MEMS dies are provided with metalization between the mirrors; and flip-chip solder-bonding conductive posts provided in the printed circuit of the substrate, leaving sufficient clearance between the substrate and the mirrors to avoid interference with the operation of the mirrors.  
     
     
         27 . The method of  claim 25  wherein the lenses are integrally formed on the top or bottom surface of the substrate, enabling optical readout of the MEMS in reflection from the bottom surface.  
     
     
         28 . The method of  claim 26  wherein a patterned optical blocking layer is applied to the substrate in areas surrounding said conductive posts.  
     
     
         29 . The method of  claim 25  wherein the backside of the substrate is provided with a solid annular peripheral metalized region solder-attachable as to an external pin or ball grid array package housing.  
     
     
         30 . The method of  claim 29  wherein a package housing is provided and the assembled array is bonded therewithin with the substrate electrically connected to package pads disposed annularly within the housing.  
     
     
         31 . The method of  claim 30  wherein the top of the substrate is provided with peripheral conductive pads, and wirebonding the conductive pads internally of the packaged housing to said package pads.  
     
     
         32 . The method of  claim 30  wherein the top or bottom of the package housing is apertured or windowed, and optical readout light for the array mounted within the package is transmitted therethrough.  
     
     
         33 . The assembled array of  claim 3  wherein the substrate is selected from the group of materials consisting of silicon, gallium phosphide, sapphire, a glass composite and quartz, and the MEMS dies are silicon-based.  
     
     
         34 . An optical MEMS system or architecture incorporating therein one or more of the packaged assembled arrays of  claim 9 .  
     
     
         35 . An optical MEMS system or architecture as claimed in  claim 34  wherein a first of said packaged assembled arrays is positioned to receive collimated ingress fiber bundle light signals and reflect the same to a mirror for redirection to a second of said packaged assembled arrays positioned to receive the light signals and reflect them to an egress collimated fiber bundle to provide optical cross-connection between the fiber bundles.