US2003024169A1PendingUtilityA1

Abrasive articles with water soluble particles

37
Priority: Mar 28, 2001Filed: Mar 28, 2001Published: Feb 6, 2003
Est. expiryMar 28, 2021(expired)· nominal 20-yr term from priority
Inventors:Philip E. KendallSoon-Chul ParkWesley J. Bruxvoort
B24D 3/346B24D 11/00
37
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Claims

Abstract

The present invention is directed to a method of abrading a surface of a workpiece. The method of the invention comprises bringing a surface of a workpiece and an abrasive article into frictional contact in the presence of an aqueous fluid. The abrasive article comprises a backing comprising a surface, and an abrasive layer bonded to the surface of the backing, the abrasive layer comprising a binder, a plurality of abrasive particles, and a plurality of organic water soluble particles, the abrasive layer comprising a plurality of three-dimensional abrasive composites. The invention is also directed to the abrasive article for use in the method.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method of abrading a surface of a workpiece comprising: 
 bringing into frictional contact the surface of the workpiece and an abrasive article in the presence of an aqueous fluid, the abrasive article comprising:    (a) a backing comprising a surface; and    (b) an abrasive layer attached to the surface of the backing, the abrasive layer comprising a binder, a plurality of abrasive particles, and a plurality of organic water soluble particles, the abrasive layer comprising a plurality of three-dimensional abrasive composites.    
     
     
         2 . The method of  claim 1  wherein the workpiece further comprises a non-metallic surface.  
     
     
         3 . The method of  claim 2  wherein the workpiece further comprises a painted surface.  
     
     
         4 . The method of  claim 1  wherein the workpiece comprises a glass.  
     
     
         5 . The method of  claim 1  wherein the workpiece comprises a ceramic material.  
     
     
         6 . The method of  claim 1  wherein the workpiece comprises a semiconductor wafer.  
     
     
         7 . The method of  claim 1  wherein the organic water soluble particle is sugar.  
     
     
         8 . The method of  claim 1  wherein the organic water soluble particle is polyvinyl alcohol.  
     
     
         9 . An abrasive article comprising 
 (a) a backing comprising a surface; and    (b) an abrasive layer attached to the surface of the backing, the abrasive layer comprising a binder, a plurality of abrasive particles, and a plurality of organic water soluble particles, the abrasive layer comprising a plurality of three-dimensional abrasive composites.    
     
     
         10 . The abrasive article of  claim 9  wherein the organic water soluble particle is sugar.  
     
     
         11 . The abrasive article of  claim 9  wherein the organic water soluble particle is polyvinylalcohol.

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