Multiport polishing fluid delivery system

Abstract

A method and system for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, the system includes an arm having a delivery portion disposed at least partially over the polishing surface. A first nozzle and a second nozzle are disposed on the delivery portion of the arm. The first nozzle is adapted to flow the polishing fluid at a first rate while the second nozzle is adapted to flow the polishing fluid at a second rate that is different than the first rate. A method for delivering a polishing fluid to a chemical mechanical polishing surface generally includes the steps of supplying the polishing fluid to a semiconductor polishing surface in one location at a first rate and providing the polishing fluid to the polishing surface at a second location at a second rate which is different than the first rate.

What is claimed is:  
     
         1 . A system for delivering a polishing fluid to a chemical mechanical polishing surface comprising: 
 an arm having a delivery portion disposed at least partially over the polishing surface;    a first nozzle disposed on the delivery portion and adapted to flow the polishing fluid at a first rate; and    at least a second nozzle disposed on the delivery portion and adapted to flow the polishing fluid at a second rate that is different than the first rate.    
     
     
         2 . The system of  claim 1  further comprising a flow control device coupled to the first nozzle.  
     
     
         3 . The system of  claim 2  further comprising a second control device coupled to the second nozzle.  
     
     
         4 . The system of  claim 2 , wherein the flow control device is a flow control selected from the group consisting of orifices, needle valves, proportional valves, pinch valves, restrictors, mass flow controllers and a metering pumps.  
     
     
         5 . The system of  claim 1 , wherein the arm further comprises a polishing fluid delivery line coupled to both the first and second nozzle.  
     
     
         6 . The system of claim I further comprising a first fluid source coupled to the first nozzle and a second fluid source coupled to the second nozzle.  
     
     
         7 . The system of  claim 1  further comprising a plurality of nozzles adapted to flow polishing fluid at a controlled rate.  
     
     
         8 . The system of  claim 7 , wherein each nozzle is independently controllable.  
     
     
         9 . The system of  claim 1  further comprising a rotating platen adapted to support a polishing material, the polishing material comprising the polishing surface.  
     
     
         10 . The apparatus of  claim 9 , wherein the polishing material is a polyurethane pad or a fixed abrasive pad.  
     
     
         11 . The system of  claim 10 , wherein the polishing material is a web of fixed abrasive.  
     
     
         12 . The system of  claim 1 , wherein the first nozzle is disposed radially inward of the second nozzle relative to the center of rotation of the polishing pad, and wherein the first flow is at least  1 . 15  time greater than the second flow.  
     
     
         13 . The system of  claim 1 , wherein first flow is at least 1.15 times the second flow rate.  
     
     
         14 . The system of  claim 1 , wherein first flow is about 1.2 to about 20 times the second flow rate.  
     
     
         15 . The system of  claim 1  further comprising a metrology device adapted to provide information utilized to control at least one of the flows through the nozzles.  
     
     
         16 . A system for delivering a polishing fluid to a chemical mechanical polishing surface comprising: 
 an arm having a delivery portion disposed at least partially over the polishing surface;    a first means for providing polishing fluid to the polishing surface at a first rate; and    a second means for providing polishing fluid to the polishing surface at a second rate, wherein the second rate is different than the first rate.    
     
     
         17 . The system of  claim 16 , wherein the first and second means are independently controllable.  
     
     
         18 . The system of  claim 16  further comprising one or more additional means for providing polishing fluid to the polishing surface disposed between the first means and the second means.  
     
     
         19 . A system for delivering a polishing fluid to a chemical mechanical polishing surface comprising: 
 a platen supporting the polishing surface;    a polishing head disposed over the platen;    an arm having a delivery portion disposed at least partially over the polishing surface;    a first nozzle disposed on the delivery portion and adapted to flow the polishing fluid at a first rate; and    at least a second nozzle disposed on the delivery portion and adapted to flow the polishing fluid at a second rate that is different than the first rate.    
     
     
         20 . The system of  claim 19 , wherein at least the first flow is controllable.  
     
     
         21 . The system of  claim 20 , wherein the second flow is controllable.  
     
     
         22 . The system of  claim 19  further comprising a metrology device adapted to provide information utilized to control at least one of the flows through the nozzles.  
     
     
         23 . A method of supplying a polishing fluid to a chemical mechanical polishing surface comprising: 
 flowing the polishing fluid onto the pad at a first location at a first rate; and    flowing the polishing fluid on the pad at a second location at a second rate that is different than the first rate.    
     
     
         24 . The method of  claim 23 , wherein the first rate is independently controllable relative the second rate.  
     
     
         25 . The method of  claim 23  further comprising: 
 flowing the polishing fluid on the pad at one or more locations between the first location and the second location.  
 
     
     
         26 . The method of  claim 23 , wherein the step of flowing the polishing fluid at a first rate further comprises: 
 adjusting the flow rate during polishing.    
     
     
         27 . The method of  claim 26 , wherein the step of adjusting further comprises: 
 adjusting the flow rate in response to a polishing metric.