US2003038107A1PendingUtilityA1
Method and apparatus for removal of unwanted electroplating deposits
Est. expiryMar 22, 2020(expired)· nominal 20-yr term from priority
H10P 50/667H10P 14/47H10P 72/0468H10P 72/0414H10P 70/54H10P 72/0424C23F 1/08Y10S134/902H10P 14/46H10P 70/15H10P 50/642H10P 72/06H10P 72/0426
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Claims
Abstract
An apparatus and associated method for removing deposits from a substrate. In one aspect, a system is provided which supplies etchant to an edge bead removal chamber. The apparatus includes an etchant delivery system, an etchant tank, a sensor, and a mixing tank.
Claims
exact text as granted — not AI-modified1 . A point-of-use etchant preparation and delivery apparatus, comprising:
a chemical source; a mixing module in fluid communication with the chemical source and configured for mixing two or more chemical received from the chemical source into an etchant; and an edge bead removal chamber supply line coupled at one end to the mixing module.
2 . The apparatus of claim 1 , wherein the chemical source comprises an acid storage member.
3 . The apparatus of claim 1 , wherein the chemical source comprises a nitric acid storage member.
4 . The apparatus of claim 1 , wherein the chemical source comprises a citric acid storage member.
5 . The apparatus of claim 1 , wherein the chemical source comprises a sulfuric acid storage member.
6 . The apparatus of claim 1 , wherein the chemical source comprises an oxidizer storage member.
7 . The apparatus of claim 1 , wherein the mixing module further comprises a fluid-level sensor.
8 . The apparatus of claim 7 , further comprising a controller communicably connected to the fluid-level sensor and configured to initiate an etchant mixing process within the mixing module in response to information received from the fluid-level sensor.
9 . The apparatus of claim 1 , wherein the chemical source comprises an acid storage member and an oxidizer storage member.
10 . The apparatus of claim 9 , wherein the acid storage member is a sulfuric acid storage member and the oxidizer storage member is a hydrogen peroxide storage member.
11 . A point-of-use etchant preparation and delivery apparatus, comprising:
a chemical source comprising an acid source and an oxidizer source; a mixing module in fluid communication with the chemical source and configured for mixing an acid from the acid source and an oxidizer from the oxidizer source into an etchant; a supply line coupled at one end to the mixing module; and an edge bead removal chamber connected at another end of the supply line and comprising:
a substrate support member; and
a plurality of etchant delivery nozzles.
12 . The apparatus of claim 11 , wherein the acid is citric acid.
13 . The apparatus of claim 11 , wherein the acid is one of citric acid and sulfuric acid.
14 . The apparatus of claim 11 , wherein the oxidizer is hydrogen peroxide and the acid is sulfuric acid.
15 . The apparatus of claim 11 , wherein plurality of nozzles are circumferentially spaced around a periphery of the substrate support member.
16 . The apparatus of claim 11 , further comprising a heating tank disposed inline with the supply line.
17 . The apparatus of claim 11 , wherein the mixing module further comprises a fluid-level sensor.
18 . The apparatus of claim 17 , further comprising a controller communicably connected to the fluid-level sensor and configured to initiate an etchant mixing process within the mixing module in response to information received from the fluid-level sensor.
19 . A method of preparing and delivering an etchant at a point of use, comprising:
flowing an acid from an acid source to a mixing module; flowing an oxidizer from an oxidizer source to the mixing module; mixing the oxidizer and acid in the mixing module to form an etchant; flowing the etchant from the mixing module to an edge bead removal chamber; wherein the acid source, oxidizer source and edge bead removal chamber are each connected to the mixing module during each of the flowing and mixing steps.
20 . The method of claim 19 , further comprising sensing a fluid level in the mixing module.
21 . The method of claim 19 , wherein flowing the acid and flowing the oxidizer occur in response to sensing a fluid level in the mixing module.
22 . The method of claim 19 , wherein the oxidizer is hydrogen peroxide and the acid is sulfuric acid.
23 . The method of claim 19 , wherein the oxidizer is hydrogen peroxide and the acid is citric acid.
24 . The method of claim 19 , further comprising heating the etchant.
25 . The method of claim 19 , further comprising applying the etchant only to a peripherary of a substrate disposed in the edge bead removal chamber to remove material therefrom.
26 . The method of claim 25 , further comprising, after applying the etchant only to the peripherary of the substrate:
spinning the substrate; rinsing the substrate; and drying the substrate.
27 . A method of processing a substrate having an electroplated material deposited thereon to remove unwanted deposits of electroplated material, the method comprising:
mixing an oxidizer and an acid in a mixing module to form an etchant; flowing the etchant from the mixing module to an edge bead removal chamber; applying the etchant only to a periphery of the substrate while rotatating the substrate in the edge bead removal chamber;
28 . The method of claim 27 , further comprising, prior to mixing:
flowing the acid and flowing the oxidizer to the mixing module in response to sensing a fluid level in the mixing module.
29 . The method of claim 27 , wherein the oxidizer is hydrogen peroxide and the acid is sulfuric acid.
30 . The method of claim 27 , wherein the oxidizer is hydrogen peroxide and the acid is citric acid.
31 . The method of claim 27 , further comprising heating the etchant.Join the waitlist — get patent alerts
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