US2003044370A1PendingUtilityA1
Resin powder for dermatologic composition, skin cleansing agent and cosmetic composition using the powder, and preparation process of the powder
Est. expiryAug 17, 2021(expired)· nominal 20-yr term from priority
C08J 3/12A61Q 19/10A61K 8/8152A61K 8/85A61K 8/81
46
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Provided is a resin powder for a dermatologic composition composed of resin particles having an average volume particle size of 2.0 to 20.0 μm, a shape factor SF1 of 110 to 140 and an average volume particle size distribution GSDv of 1.3 or less. Also disclosed are a skin cleansing composition and a cosmetic composition containing the resin powder, and a preparation process of the resin powder.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A resin powder for a dermatologic composition, which comprises resin particles having an average volume particle size of 2.0 to 20.0 μm, a shape factor SF1 of 110 to 140 and an average volume particle size distribution GSDv of 1.3 or less.
2 . The resin powder of claim 1 , wherein the resin particles further have a surfaceness index of 2.0 or less.
3 . The resin powder of claim 1 , wherein the resin particles further have an average number particle size distribution GSDp of 1.5 or less.
4 . The resin powder of claim 1 , wherein a volumetric ratio of the resin particles having a volume particle size of 20 μm or greater is 3% or less.
5 . The resin powder of claim 1 , wherein the resin has a number-average molecular weight of 3,000 to 20,000.
6 . The resin powder of claim 1 , wherein the resin has a weight-average molecular weight of 6,000 to 100,000.
7 . The resin powder of claim 1 , wherein the resin has a glass transition temperature ranging from 40 to 100° C.
8 . The resin powder of claim 1 , which have a compaction ratio of 0.6 or less.
9 . The resin powder of claim 1 , wherein the resin particles have a water content of 3 wt. % or less.
10 . The resin powder of claim 1 , wherein a volatile content in the resin particles is 100 ppm or less.
11 . The resin powder of claim 1 , wherein the resin constituting the resin particles has an acid value ranging from 1.0 to 20 mg/KOH/g.
12 . The resin powder of claim 1 , wherein a solution, obtained by dissolving 1 g of the resin powder in 3 g of acetone, adding 25 g of deionized water to the resulting solution to give a precipitate and filtering the precipitate thus formed has a surface tension of 20 mN or greater.
13 . The resin powder of claim 1 , wherein a solution, obtained by dissolving 1 g of the resin powder in 3 g of acetone, adding 25 g of deionized water to the resulting solution to give a precipitate and filtering the precipitate thus formed has a conductivity of 100 μS or less.
14 . The resin powder of claim 12 , wherein the solution has a conductivity of 100 μS or less.
15 . The resin powder of claim 12 , wherein the resin particles has other fine particles adhered thereto.
16 . The resin powder of claim 15 , wherein the resin particles and the fine particles are used in combination so as to satisfy the following formula: (volume average particle size of the resin particles)/(volume average particle size of the fine particles)≧2.
17 . The resin powder of claim 15 , wherein a weak adhesive strength ratio of the fine particles to the resin particles is 90% or less.
18 . A cosmetic composition comprising a resin powder for a dermatologic composition as claimed in claim 1 .
19 . The cosmetic composition of claim 18 , wherein the content of the resin powder is from 0.1 to 90 wt. % of the composition.
20 . A skin cleansing composition, comprising a resin powder for a dermatologic composition as claimed in claim 1 .
21 . The skin cleansing composition of claim 20 , wherein the content of the resin powder is from 0.1 to 90 wt. % of the composition.
22 . A process for preparing a resin powder for a dermatologic composition as claimed in claim 1 , which comprises preparing a dispersion of resin particles by emulsion polymerization and allowing the resin particles to undergo agglomeration.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.