US2003048620A1PendingUtilityA1
Printed-circuit board with fuse
Priority: Mar 14, 2000Filed: Mar 13, 2001Published: Mar 13, 2003
Est. expiryMar 14, 2020(expired)· nominal 20-yr term from priority
H05K 3/4611H05K 2201/10181H01H 85/0047H05K 2201/09727H05K 2201/062H05K 2201/10037H05K 1/0293H05K 2203/049H01H 85/0411H05K 2201/0305H05K 3/28H01H 85/046H01H 2085/0275H01H 2069/027H05K 2201/0394H05K 3/4697H05K 1/0272H01H 85/463H05K 2201/0989H05K 2201/09063
32
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A printed wiring board includes a substrate ( 20 ) on which a wiring pattern ( 12 ) has been formed, and a fuse ( 6 ) provided on the substrate ( 20 ). One end of the fuse ( 6 ) is directly connected to a first pad ( 12 a ) of the wiring pattern ( 12 ), and the other end of the fuse ( 6 ) is directly connected to a second pad ( 12 b ) of the wiring pattern ( 12 ). The fuse ( 6 ) is covered by a protective material ( 7 ).
Claims
exact text as granted — not AI-modified1 . A printed wiring board, comprising:
an insulating substrate on which a wiring pattern has been formed; and a fuse including circuit breaking means, the circuit breaking means being directly connected to the wiring pattern.
2 . The printed wiring board according to claim 1 , wherein the wiring pattern includes two conductor pads that are apart from each other, and the circuit breaking means bridges the two conductor pads.
3 . The printed wiring board according to claim 1 , wherein the circuit breaking means is covered with a protective material.
4 . The printed wiring board according to claim 1 , further comprising at least one electronic part mounted on the substrate, and the circuit breaking means being disposed lower than the electronic part.
5 . The printed wiring board according to claim 1 , wherein the circuit breaking means is a solder wire.
6 . The printed wiring board according to claim 1 , further comprising heat insulating means disposed in the vicinity of the circuit breaking means.
7 . The printed wiring board according to claim 1 , wherein the circuit breaking means is formed integrally with the wiring pattern.
8 . The printed wiring board according to claim 7 , wherein the circuit breaking means is a relatively narrow portion of the wiring pattern.
9 . The printed wiring board according to claim 8 , wherein the wiring pattern is composed of copper.
10 . The printed wiring board according to claim 6 , further comprising a resist layer that covers the wiring pattern, and the heat insulating means including an opening formed in the resist layer.
11 . The printed wiring board according to claim 6 , wherein the heat insulating means is a through hole provided to the substrate.
12 . The printed wiring board according to claim 11 , wherein the circuit breaking means bridges the through hole.
13 . The printed wiring board according to claim 11 , wherein the circuit breaking means is provided inside the through hole.
14 . The printed wiring board according to claim 6 , the heat insulating means being a recess provided to the substrate.
15 . The printed wiring board according to claim 14 , wherein the circuit breaking means bridges the recess.
16 . The printed wiring board according to claim 6 , further comprising an additional insulating substrate, and the heat insulating means including a through hole formed in the additional insulating substrate.
17 . The printed wiring board according to claim 6 , further comprising an additional insulating substrate, and the heat insulating means including a recess formed in the additional insulating substrate.Join the waitlist — get patent alerts
Track US2003048620A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.