Semiconductor device and method of making the same

Abstract

A semiconductor device includes a housing, which is formed of a polyamide-series thermoplastic resin, and semiconductor package sealed in the housing, which is formed of a thermosetting epoxy resin. The package has a modified face that is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals extend from the packages in parallel. A portion of the terminals is also sealed in the housing together with the package. Thus, the device is easily produced by insert molding and has excellent moisture resistance.

1 . A semiconductor device comprising: 
 a housing formed of a first synthetic resin that is a thermoplastic resin; and    a semiconductor package formed of a second synthetic resin that is a thermosetting resin, wherein the package is sealed in the housing, wherein the package has a modified face that has adhesive properties to the first synthetic resin, wherein the modified face is formed on a surface of the package by UV-irradiating the surface before the sealing of the package in the housing.    
     
     
         2 . A semiconductor device according to  claim 1 , wherein the package is sealed in the housing by insert molding.  
     
     
         3 . A semiconductor device according to  claim 1 , wherein the first synthetic resin comprises polyamide or a thermoplastic resin including polyamide.  
     
     
         4 . A semiconductor device according to  claim 3 , wherein the second synthetic resin comprises a thermosetting epoxy resin.  
     
     
         5 . A semiconductor device according to  claim 3 , wherein the thermoplastic resin is a polymer alloy of polyamide and polyphenylene sulfide.  
     
     
         6 . A semiconductor device according to  claim 3 , wherein the thermoplastic resin is a polymer alloy of polyamide and polybutylene telephthalate.  
     
     
         7 . A semiconductor device comprising: 
 a housing formed of polyamide or a thermoplastic resin including polyamide; and    a semiconductor package formed of a thermosetting epoxy resin, wherein the package is sealed in the housing, wherein the semiconductor package has a modified face that has adhesive properties to the polyamide or the thermoplastic resin including polyamide, wherein the modified face is formed on a surface of the package by UV-irradiating the surface before the sealing of the package in the housing.    
     
     
         8 . A semiconductor device according to  claim 7 , wherein the thermoplastic resin is a polymer alloy of polyamide and polyphenylene sulfide.  
     
     
         9 . A semiconductor device according to  claim 7 , wherein the thermoplastic resin is a polymer alloy of polyamide and polybutylene telephthalate.  
     
     
         10 . A method of making a semiconductor device comprising: 
 UV-irradiating a semiconductor package formed of thermosetting epoxy resin to modify its surface to be adhesive to polyamide;    placing the package in a die; and    filling a space in the die with melted polyamide or a melted thermoplastic resin including polyamide to seal the package by insert molding.    
     
     
         11 . A method according to  claim 10 , wherein the thermoplastic resin is a polymer alloy of polyamide and polyphenylene sulfide.  
     
     
         12 . A method according to  claim 10 , wherein the thermoplastic resin is a polymer alloy of polyamide and polybutylene telephthalate.