Method and apparatus having plate electrode for surface treatment using capillary discharge plasma

Abstract

A method and an apparatus for treating a workpiece using a plasma discharge are disclosed in the present invention. In treating a workpiece using a plasma discharge, the apparatus includes at least one plate electrode electrically coupled to a power source, a dielectric body having first and second sides, wherein the first side is coupled to the at least one plate electrode and the second side has at least one capillary extending substantially therethrough in a direction of the first side of the dielectric body, and a counter electrode electrically coupled to the power source.

What is claimed is:  
     
         1 . An apparatus for treating a workpiece using a plasma, comprising: 
 at least one plate electrode electrically coupled to a power source;    a dielectric body having first and second sides, wherein the first side is coupled to the at least one plate electrode and the second side has at least one capillary extending substantially therethrough in a direction of the first side of the dielectric body; and    a counter electrode electrically coupled to the power source.    
     
     
         2 . The apparatus according to  claim 1 , wherein the dielectric body has a thickness in the range of about 1 mm to 3 cm.  
     
     
         3 . The apparatus according to  claim 1 , wherein the at least one capillary has a diameter in the range of about 0.2 mm to 0.8 mm.  
     
     
         4 . The apparatus according to  claim 1 , wherein the workpiece is placed between the at least one plate electrode and the counter electrode.  
     
     
         5 . The apparatus according to  claim 1 , wherein the workpiece is conductive.  
     
     
         6 . The apparatus according to  claim 1 , further comprising a chamber for treating the workpiece under a working gas environment.  
     
     
         7 . The apparatus according to  claim 6 , wherein the chamber includes at least one gas input opening and at least one gas output opening.  
     
     
         8 . The apparatus according to  claim 1 , wherein the capillary in the dielectric body is located to have a parallelogram shape.  
     
     
         9 . An apparatus for treating a workpiece using a plasma, comprising: 
 at least one plate electrode electrically coupled to a power source;    a dielectric body comprising at least one capillary extending therethrough thereby exposing portions of the plate electrode to the workpiece;    a counter electrode electrically coupled to the power source; and    a dielectric plate electrically coupled to the counter electrode.    
     
     
         10 . The apparatus according to  claim 9 , wherein the dielectric body has a thickness in the range of about 1 mm to 3 cm.  
     
     
         11 . The apparatus according to  claim 9 , wherein the at least one capillary has a diameter in the range of about 0.2 mm to 0.8 mm.  
     
     
         12 . The apparatus according to  claim 9 , wherein the workpiece is placed between the at least one plate electrode and the counter electrode.  
     
     
         13 . The apparatus according to  claim 9 , wherein the workpiece is non-conductive.  
     
     
         14 . The apparatus according to  claim 9 , further comprising a chamber for treating the workpiece under a working gas environment.  
     
     
         15 . The apparatus according to  claim 14 , wherein the chamber includes at least one gas input opening and at least one gas output opening.  
     
     
         16 . The apparatus according to  claim 9 , wherein the capillary in the dielectric body is located to form a parallelogram shape.  
     
     
         17 . An apparatus for treating a workpiece using a plasma, comprising: 
 at least one plate electrode electrically coupled to a power source;    a dielectric body coupled to the plate electrode;    a counter electrode embedded in the dielectric body, and electrically coupled to a power source; and    at least one capillary extending through the dielectric plate, counter electrode and dielectric body.    
     
     
         18 . The apparatus according to  claim 17 , wherein the dielectric body has a thickness in the range of about 1 mm to 3 cm.  
     
     
         19 . The apparatus according to  claim 17 , wherein the at least one capillary has a diameter in the range of about 0.2 mm to 0.8 mm.  
     
     
         20 . The apparatus according to  claim 17 , wherein the workpiece is placed between the at least one plate electrode and the counter electrode.  
     
     
         21 . The apparatus according to  claim 17 , wherein the workpiece is one of conductive, semiconductive and non-conductive.  
     
     
         22 . The apparatus according to  claim 17 , further comprising a chamber for treating the workpiece under a working gas environment.  
     
     
         23 . The apparatus according to  claim 22 , wherein the chamber includes at least one gas input opening and at least one gas output opening.  
     
     
         24 . The apparatus according to  claim 17 , wherein the capillary formed in the dielectric body is located to form a parallelogram shape.  
     
     
         25 . A method of treating a workpiece using a plasma discharge apparatus, the method comprising: 
 placing the workpiece in close proximity to the apparatus, wherein the apparatus includes at least one plate electrode for receiving a power source, a dielectric body having first and second sides, wherein the first side is coupled to the at least one plate electrode and the second side has at least one capillary extending to a direction of the first side of the dielectric body, and a counter electrode electrically coupled to the power source and a ground;    applying a potential to the at least one plate electrode and the counter electrode; and    generating a plasma discharge out of the capillary.    
     
     
         26 . The method according to  claim 25 , wherein the workpiece is in a continuous motion by placing the workpiece on a conveyer that passes under the plasma.  
     
     
         27 . The method according to  claim 25 , further comprising providing a working gas in close proximity to the workpiece.