Thermal control layer in miniature LHP/CPL wicks

Abstract

A LHP/CPL wick includes an unconsolidated wick portion positioned within a first consolidated wick portion and a second consolidated wick portion. This wick provides a large ΔT across the wick, and sufficient capillary action for miniature LHP/CPL applications. Furthermore, the unconsolidated wick portion allows accommodation of mismatched coefficients of thermal expansion. A LHP/CPL having this wick is particularly applicable to silicon cooling devices.

What is claimed is:  
     
         1 . A wick comprising an unconsolidated wick portion positioned within a consolidated wick portion.  
     
     
         2 . A wick in accordance with  claim 1 , wherein said consolidated wick portion comprises at least one of a sintered powder, a screen, and felt.  
     
     
         3 . A wick in accordance with  claim 1 , wherein said consolidated wick portion is a sintered powder wick comprising a material selected from the group consisting of nickel, aluminum, silicon, germanium, a polymer, ceramic, and stainless steel.  
     
     
         4 . A wick in accordance with  claim 1 , wherein said unconsolidated wick portion comprises at least one of powder and felt.  
     
     
         5 . A wick in accordance with  claim 1 , wherein said unconsolidated wick portion is a powder wick comprising a material selected from the group consisting of metal, polymers, ceramics, plastics, intrinsic semiconductors, and doped semiconductors.  
     
     
         6 . A wick in accordance with  claim 1  wherein said wick comprises one of a capillary pumped loop wick and a looped heat pipe wick.  
     
     
         7 . A wick in accordance with  claim 1 , wherein said unconsolidated wick portion is contained and constrained within said consolidated wick portion.  
     
     
         8 . A heat pipe comprising: 
 an evaporator section;    a condenser section;    a vapor channel interconnecting said evaporator section and said condenser section in fluid communication;    a liquid channel interconnecting said evaporator section and said condenser section in fluid communication; and    a wick positioned between said liquid channel and said vapor channel, said wick comprising an unconsolidated wick portion positioned between a first consolidated wick portion and a second consolidated wick portion, wherein said first consolidated wick portion is positioned adjacent to said vapor channel and said second consolidated wick portion is positioned adjacent to said liquid channel.    
     
     
         9 . A heat pipe in accordance with  claim 8 , wherein said consolidated wick portion comprises at least one of a sintered powder, a screen, and felt.  
     
     
         10 . A heat pipe in accordance with  claim 8 , wherein said consolidated wick portion is a sintered powder wick comprising a material selected from the group consisting of metal, polymers, ceramics, plastics, intrinsic semiconductors, and doped semiconductors.  
     
     
         11 . A heat pipe in accordance with  claim 8 , wherein said unconsolidated wick portion comprises at least one of powder and felt.  
     
     
         12 . A heat pipe in accordance with  claim 8 , wherein said unconsolidated wick portion is a powder wick comprising a material selected from the group consisting of metal, polymers, ceramics, plastics, intrinsic semiconductors, and doped semiconductors.  
     
     
         13 . A heat pipe in accordance with  claim 8  further comprising an outer layer, wherein said evaporator section, said condenser section, said vapor channel, said liquid channel, and said wick are enclosed within said outer layer.  
     
     
         14 . A heat pipe in accordance with  claim 11 , wherein said outer layer is directly bonded to a device for cooling said device.  
     
     
         15 . A heat pipe in accordance with  claim 14 , wherein said device and said outer layer comprise the same material.  
     
     
         16 . A heat pipe in accordance with  claim 14 , wherein said material comprises at least one of silicon, germanium, a polymer, ceramic, and metal.