Notched finned heat sink structure

Abstract

A heat sink structure having a pipe attached to a plurality of fins for dissipating heat into an environment. Each fin in the plurality is constructed of a thermally conductive material and has a cavity formed therein dimensioned for seating about the pipe exterior surface. An opening or notch extends from the edge of each of the fins to the cavity to facilitate the spread of an adhesive or solder to the fin/pipe interface for providing thermal and physical coupling of the plurality of fins to the pipe.

What is claimed is:  
     
         1 . A heat sink structure, comprising: 
 a pipe having an exterior surface;    a plurality of fins to dissipate heat into an environment containing the heat sink structure, each fin in the plurality being constructed of a thermally conductive material and having two opposing faces and an edge, the opposing faces defining a cavity therein dimensioned for seating about the pipe exterior surface, said edge defining an opening having a sidewall extending from the edge to the cavity; and    means for attaching the plurality of fins to the exterior surface of the pipe.    
     
     
         2 . The heat sink structure of  claim 1 , wherein the pipe is one of a heat pipe and a fluid transfer tube.  
     
     
         3 . The heat sink structure of  claim 1 , wherein at least one fin in the plurality comprises a flange positioned about a periphery of the cavity for attaching the at least one fin to the exterior surface of the pipe.  
     
     
         4 . The heat sink structure of  claim 1 , wherein the opening of each of the fins are aligned to form a single channel.  
     
     
         5 . The heat sink structure of  claim 1 , wherein the opening sidewall comprises a pair of opposing sidewalls tapered inwardly from the edge to the cavity.  
     
     
         6 . The heat sink structure of  claim 3 , wherein the flange has opposing edges about the opening.  
     
     
         7 . The heat sink structure of  claim 1 , wherein the attaching means comprises a solder preform.  
     
     
         8 . The heat sink structure of  claim 1 , wherein the attaching means comprises a solder paste.  
     
     
         9 . The heat sink structure of  claim 6 , wherein said opposing edges are tapered relative to a plane containing the at least one fin.  
     
     
         10 . A method of making a heat sink structure, comprising the steps of: 
 providing a plurality of fins, each fin being constructed of a thermally conductive material having two opposing faces and an edge, the opposing faces defining a cavity therein which is partially bounded by a flange, the edge defining an opening extending from the edge to the cavity;    disposing a pipe within the cavity of each fin so that the pipe outer surface rests on a portion of each said flange; and    disposing an adhesive material on said pipe outer surface by accessing the pipe outer surface through the openings in the fins.    
     
     
         11 . The method of  claim 10 , wherein the pipe is one of a heat pipe and a fluid transfer tube.  
     
     
         12 . The method of  claim 10 , wherein said disposing step comprises feeding the pip through the fin cavities.  
     
     
         13 . The method of  claim 10 , wherein said disposing step comprises placing the pipe of the openings of the plurality of fins and applying a force so that the pipe moves within the cavities.  
     
     
         14 . The method of  claim 10 , wherein the opening comprises a ‘V’-shaped opening.  
     
     
         15 . The method of  claim 10 , wherein said adhesive comprises a solder material.