Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes

Abstract

An apparatus and method for removing materials, such as photoresist, on surfaces of objects, such as semiconductor wafers, utilizes one or more integrated dry-wet processing modules to selectively perform plasma ashing and wet-chemical cleaning processes. Thus, a customized combination of plasma ashing and wet-chemical cleaning processes can be performed on a single platform to achieve desired processing results on the objects. In an embodiment, the apparatus may also include a critical dimension inspection unit to inspect the objects that are being processed by the apparatus.

What is claimed is:  
     
         1 . An apparatus for processing objects comprising: 
 an object loading/unloading unit configured to load and unload objects into and from said apparatus;    a first processing unit configured to perform a plasma ashing process;    a second processing unit configured to perform a wet-chemical cleaning process; and    an object transfer system configured to selectively transfer said objects from said object loading/unloading unit to one of said first and second processing units such that a first process performed on said objects can be selected from said plasma ashing process and said wet-chemical cleaning process.    
     
     
         2 . The apparatus of  claim 1  wherein said first and second processing units are incorporated into an integrated dry-wet processing module.  
     
     
         3 . The apparatus of  claim 2  wherein said first and second processing units of said integrated dry-wet processing module are vertically positioned such that one unit of said first and second processing units is positioned above the other unit of said first and second processing units.  
     
     
         4 . The apparatus of  claim 2  further comprising additional integrated dry-wet processing modules, and wherein said object transfer system is configured to transfer said object between any of said integrated dry-wet processing module and said additional dry-wet processing modules.  
     
     
         5 . The apparatus of  claim 4  wherein said object transfer system includes a first object handling device and a second object handling device, said first object handling device being configured to transfer said objects between said object loading/unloading unit and said second object handling device, said second object handling device being configured to transfer said objects between said first object handling device and said integrated dry-wet processing module and said additional integrated dry-wet processing modules.  
     
     
         6 . The apparatus of  claim 1  wherein said second processing unit includes a single-object spin-type wet-chemical cleaning unit.  
     
     
         7 . The apparatus of  claim 1  wherein said first processing unit includes a processing chamber having a maintenance window located on a side of said processing chamber.  
     
     
         8 . The apparatus of  claim 7  wherein said first processing unit includes a removable assembly having a chuck to support an object to be processed, said removal assembly being configured to reveal said maintenance window when said removal assembly is removed.  
     
     
         9 . The apparatus of  claim 1  wherein said first processing unit includes an exhaust outlet connected to a processing chamber of said first processing unit, said exhaust outlet leading from said processing chamber to a side of said first processing unit.  
     
     
         10 . The apparatus of  claim 1  further comprising an object inspection module, said object inspection module being configured to inspect features on surfaces of said objects, said object inspection module being accessible by said object transfer system such that said objects can be transferred between said first and second processing units and said object inspection module by said object transfer system.  
     
     
         11 . An apparatus for processing objects comprising: 
 an object loading/unloading unit configured to load and unload objects into and from said apparatus;    an integrated dry-wet processing module having a first processing unit configured to perform a plasma ashing process and a second processing unit configured to perform a wet-chemical cleaning process, said first and second processing units being vertically positioned such that one unit of said first and second processing units is positioned above the other unit of said first and second processing unit; and    an object transfer system configured to transfer said objects between said object loading/unloading unit and said integrated dry-wet processing module.    
     
     
         12 . The apparatus of  claim 11  wherein said second processing unit of said integrated dry-wet processing module is a single-object spin-type wet-chemical cleaning unit.  
     
     
         13 . The apparatus of  claim 11  wherein said object transfer system is configured to selectively transfer said objects from said object loading/unloading unit to one of said first and second processing units of said integrated dry-wet processing module such that a first process performed on said objects can be selected from said plasma ashing process and said wet-chemical cleaning process.  
     
     
         14 . The apparatus of  claim 11  wherein said first processing unit of said integrated dry-wet processing module includes a processing chamber having a maintenance window located on a side of said processing chamber.  
     
     
         15 . The apparatus of  claim 14  wherein said first processing unit of said integrated dry-wet processing module includes includes a removable assembly having a chuck to support an object to be processed, said removal assembly being configured to reveal said maintenance window when said removal assembly is removed.  
     
     
         16 . The apparatus of  claim 11  wherein said first processing unit of said integrated dry-wet processing module includes an exhaust outlet connected to a processing chamber of said first processing unit, said exhaust outlet leading from said processing chamber to a side of said first processing unit.  
     
     
         17 . The apparatus of  claim 11  further comprising additional integrated dry-wet processing modules, and wherein said object transfer system is configured to transfer said object between any of said integrated dry-wet processing module and said additional dry-wet processing modules.  
     
     
         18 . The apparatus of  claim 17  wherein said object transfer system includes a first object handling device and a second object handling device, said first object handling device being configured to transfer said objects between said object loading/unloading unit and said second object handling device, said second object handling device being configured to transfer said objects between said first object handling device and said integrated dry-wet processing module and said additional integrated dry-wet processing modules.  
     
     
         19 . The apparatus of  claim 11  further comprising an object inspection module, said object inspection module being configured to inspect features on surfaces of said objects, said object inspection module being accessible by said object transfer system such that said objects can be transferred between any of said first and second processing units of said integrated dry-wet processing module and said object inspection module by said object transfer system.  
     
     
         20 . A method of removing material on surfaces of objects comprising: 
 providing an object to be processed at an apparatus;    selectively performing a first process on said object at a first processing unit of said apparatus, said first process being one of a plasma ashing process and a wet-chemical cleaning process; and    selectively performing a second process that differs from said first process on said object at a second processing unit of said apparatus, said second process being one of said plasma ashing process and said wet-chemical cleaning process.    
     
     
         21 . The method of  claim 20  further comprising selectively repeating one of said first and second processes on said object.  
     
     
         22 . The method of  claim 20  further comprising selectively performing a third process on said object at a third processing unit of said apparatus, said third processing being one of said plasma ashing process, said wet-chemical cleaning process and a critical dimension inspection process.  
     
     
         23 . The method of  claim 22  further comprising selectively repeating one of said first, second and third processes on said object.  
     
     
         24 . The method of  claim 22  wherein said critical dimension inspection process includes measuring a feature profile of a surface of said object.  
     
     
         25 . The method of  claim 22  wherein said critical dimension inspection process includes measuring a thickness of said object.  
     
     
         26 . The method of  claim 22  further comprising selectively transferring said object between said first, second and third processing units of said apparatus.  
     
     
         27 . The method of  claim 20  wherein said wet-chemical cleaning processing includes rotating said object and applying one or more cleaning fluids on said object.  
     
     
         28 . The method of  claim 20  wherein said plasma ashing process includes delivering plasma gas into a processing chamber and applying said plasma gas onto said object.  
     
     
         29 . The method of  claim 20  wherein said first and second processing units of said apparatus are incorporated into an integrated wet-dry processing module.  
     
     
         30 . The method of  claim 29  wherein said first and second processing units of said integrated wet-dry processing module are vertically positioned such that one unit of said first and second processing units are positioned above the other unit of said first and second processing units.  
     
     
         31 . The method of  claim 20  further comprising detecting residue of said material on said object.  
     
     
         32 . The method of  claim 31  wherein said detecting of said residue of said material on said object is performed during one of said wet-chemical cleaning process and said critical dimension inspection process.  
     
     
         33 . The method of  claim 20  further comprising: 
 providing an additional object to be processed at said apparatus;  
 selectively performing said first process on said additional object at an additional first processing unit of said apparatus; and  
 selectively performing said second process on said additional object at an additional second processing unit of said apparatus.