Phosphor pattern, processes for preparing the same and photosensitive element to be used for the same
Abstract
Disclosed are a phosphor pattern which comprises a substrate having unevenness and a phosphor layer formed on the inner surface of a concave portion of the substrate, wherein the phosphor pattern thickness ratio (x)/(y) satisfies a range of 0.1 to 1.5, where when the length from the bottom of the concave portion to the top of a convex portion is L (μm), (x) is a thickness of the phosphor pattern formed on an uneven wall surface at a position of 0.9×L from the bottom of the concave portion toward the top of the convex portion, and (y) is a thickness of the phosphor pattern formed on the uneven wall surface at a position of 0.4×L from the bottom of the concave portion toward the top of the convex portion, and processes for preparing the same.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A phosphor pattern which comprises a substrate having unevenness and a phosphor layer formed on the inner surface of a concave portion of the substrate,
wherein the phosphor pattern thickness ratio (x)/(y) satisfies a range of 0.1 to 1.5, where when the length from the bottom of the concave portion to the top of a convex portion is L (μm), (x) is a thickness of the phosphor pattern formed on an uneven wall surface at a position of 0.9×L from the bottom of the concave portion toward the top of the convex portion, and (y) is a thickness of the phosphor pattern formed on the uneven wall surface at a position of 0.4×L from the bottom of the concave portion toward the top of the convex portion.Join the waitlist — get patent alerts
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