Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer

Abstract

Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between said ceramic block and said semiconductor wafer, said adhesive composition comprising water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfacants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula wherein each R 1 , R 2 , and R 3 independently is hydrogen or methyl; R is a hydrocarbyl group of 1 to 4 carbon atoms; each R 4 and R 5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms; R 6 is hydrocarbyl group of 1 to 20 carbon atoms; w, x, y, and z independently are a number from 1 to 100; wherein said adhesive composition adheres more strongly to said holding block than to said semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating said holding block or one side of said semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting one side of said semiconductor wafer to said coated holding block or said coated side of said semiconductor wafer to said holding block, such that said semiconductor wafer adheres to said coated holding block; (e) polishing the other side of said semiconductor wafer; and (f) removing the semiconductor wafer from the coated ceramic holding block.

What is claimed is:  
     
         1 . An assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: 
 (b) a holding block    (b) a semiconductor wafer; and    (c) an aqueous adhesive composition interposed between said ceramic block and said semiconductor wafer, said adhesive composition comprising water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfacants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula                          wherein each R 1 , R 2 , and R 3  independently is hydrogen or methyl; R is a hydrocarbyl group of 1 to 4 carbon atoms; each R 4  and R 5  independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms; R 6  is hydrocarbyl group of 1 to 20 carbon atoms; w, x, y, and z independently are a number from 1 to 100; wherein said adhesive composition adheres more strongly to said holding block than to said semiconductor wafer.    
     
     
         2 . The assembly system of  claim 1 , wherein the release agent is present at a level of about 0.05% to about 20% by weight of the adhesive composition.  
     
     
         3 . The assembly system of  claim 1 , wherein the resin is present at a level of about 5% to about 40% by weight of the adhesive composition.  
     
     
         4 . The assembly system of  claim 1 , wherein water is present at a level of about 5% to about 95% by weight of the adhesive composition.  
     
     
         5 . The assembly system of  claim 1 , wherein the fluorosurfactant is a compound having a perfluoroalkyl group, said compound being represented by the formula C n F 2n+1 X wherein X is SO 2  or (CH 2 ) 2 OH; and n is about 4-14.  
     
     
         6 . The assembly system of  claim 1 , wherein the (meth)acrylic acid or (meth)acrylate based polymer is a styrene-acrylic acid copolymer.  
     
     
         7 . The assembly system of  claim 1 , wherein the vinyl acetate polymer is a vinyl alcohol-vinyl acetate copolymer.  
     
     
         8 . The assembly system of  claim 7 , wherein the vinyl alcohol-vinyl acetate copolymer has a weight average molecular weight (M w ) of about 5,000 to about 250,000.  
     
     
         9 . The assembly system of  claim 1 , wherein the adhesive composition further comprises at least one of the following components: an alcohol having about 2 to 5 carbon atoms, an aqueous ammonium hydroxide solution, and a biocide composition.  
     
     
         10 . The assembly system of  claim 9 , wherein the alcohol is isopropanol.  
     
     
         11 . The assembly system of  claim 9 , wherein the biocide composition comprises at least one compound selected from the group consisting of dimethyloxazolidine and 3,4,4-trimethyloxazolidine.  
     
     
         12 . The assembly system of  claim 1 , wherein the release agent is polyethylene glycol and the resin is a (meth)acrylic acid or (meth)acrylate based polymer.  
     
     
         13 . The assembly system of  claim 12 , wherein the (meth)acrylic acid or (meth)acrylate based polymer is a styrene-acrylic acid copolymer.  
     
     
         14 . The assembly system of  claim 1 , wherein the release agent is polyethylene glycol and the resin is a vinyl acetate polymer.  
     
     
         15 . The assembly system of  claim 14 , wherein the vinyl acetate polymer is a vinyl acetate-vinyl alcohol copolymer.  
     
     
         16 . The assembly system of  claim 1 , wherein the adhesive composition comprises, by weight, about 5% to about 95% water, about 0.05% to about 20% of polyethylene glycol having a weight average molecular weight (M w ) of about 100 to 5000, and about 5% to about 40% of styrene-acrylic acid copolymer having a weight average molecular weight (M w ) of about 500 to about 50,000.  
     
     
         17 . The assembly system of  claim 16 , wherein the styrene-acrylic acid copolymer has a weight average molecular weight (M w ) of about 500 to about 2500.  
     
     
         18 . The assembly system of  claim 1 , wherein the adhesive composition comprises, by weight, about 5% to about 95% water, about 0.05% to about 20% of polyethylene glycol having a weight average molecular weight (M w ) of about 100 to 5000, about 5% to about 40% of vinyl alcohol-vinyl acetate copolymer having a weight average molecular weight (M w ) of about 5000 to 50,000, and 0.05% to 1% of a biocide composition comprising dimethyloxazolidine and 3,4,4-trimethyloxazolidine.  
     
     
         19 . The assembly system of  claim 1 , wherein the holding block is a ceramic holding block.  
     
     
         20 . The assembly system of  claim 19 , wherein the ceramic holding block comprises a silicon carbide, zinc oxide, aluminum oxide, or titanium dioxide material.  
     
     
         21 . A process for manufacturing a semiconductor wafer, comprising the steps of: 
 (a) providing a holding block;    (b) providing a semiconductor wafer;    (c) coating said holding block with an aqueous adhesive composition comprising water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfacants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula                          wherein each R 1 , R 2 , and R 3  independently is hydrogen or methyl; R is a hydrocarbyl group of 1 to 4 carbon atoms; each R 4  and R 5  independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms; R 6  is hydrocarbyl group of 1 to 20 carbon atoms; w, x, y, and z independently are a number from 1 to 100;    (d) contacting one side of said semiconductor wafer to said coated holding block, such that said semiconductor wafer adheres to said coated holding block;    (e) polishing the other side of said semiconductor wafer; and    (f) removing the semiconductor wafer from the coated ceramic holding block.    
     
     
         22 . A process for manufacturing a semiconductor wafer, comprising the steps of: 
 (a) providing a holding block;    (b) providing a semiconductor wafer;    (c) coating one side of said semiconductor wafer with an aqueous adhesive composition comprising water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfacants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula                          wherein each R 1 , R 2 , and R 3  independently is hydrogen or methyl; R is a hydrocarbyl group of 1 to 4 carbon atoms; each R 4  and R 5  independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms; R 6  is hydrocarbyl group of 1 to 20 carbon atoms; w, x, y, and z independently are a number from 1 to 100;    (d) contacting said coated side of said semiconductor wafer in step (c) to said holding block such that said semiconductor wafer adheres to said coated holding block;    (e) polishing the other uncoated side of said semiconductor wafer; and    (f) removing the semiconductor wafer from the coated ceramic holding block.    
     
     
         23 . The process of  claim 21 , wherein prior to step (d), the coated holding block of step (c) is heated to a temperature of about 80-95° C.