Apparatus and method for augmented cooling of computers

Abstract

A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the computer's internal heat removal system and a heat transfer module connected to the thermal interface port. The heat transfer module has a heat dissipation component and at least one heat transfer conduit having one end thermally coupled to the computer's internal heat removal system, and the other end thermally coupled to the heat dissipation component.

What is claimed is:  
     
         1 . An external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, said module comprising: 
 a thermoelectric device;    a heat conductive plate in thermal contact with a cool side of said thermoelectric device; and    at least one heat transfer conduit having a first portion adjacent to one end of said at least one heat transfer conduit and thermally coupled to said computer's internal heat removal system, and a second portion adjacent the other end of said at least one heat transfer conduit, said second portion thermally coupled to said heat conductive plate.    
     
     
         2 . The module of  claim 1  wherein said heat transfer conduit is a heat pipe.  
     
     
         3 . The module of  claim 1  further comprising a heat sink thermally connected to a hot side of said thermoelectric device.  
     
     
         4 . The module of  claim 1  further comprising a fan for moving air over said hot side of said thermoelectric device.  
     
     
         5 . The module of  claim 1  wherein said second portion of said heat transfer conduit has a flattened shape.  
     
     
         6 . An external heat transfer module for improving the heat removing capability of a computer's internal heat removal system, said module comprising: 
 thermoelectric means having a hot side and a cold side; and    heat transfer means thermally coupled to said cold side of said thermoelectric means for transferring heat from said computer's heat removal system to said thermoelectric means.    
     
     
         7 . The module of  claim 6  wherein said thermoelectric means includes a heat dissipation means for dissipating heat from a hot side of said thermoelectric means.  
     
     
         8 . The module of  claim 6  wherein said heat transfer means includes a heat plate means thermally connected to a heat conduit means.  
     
     
         9 . The module of  claim 7  wherein said heat dissipation means is a heat sink.  
     
     
         10 . The module of  claim 9  wherein said heat dissipation means further includes a fan.  
     
     
         11 . The module of  claim 8  wherein said heat conduit means is a heat pipe.  
     
     
         12 . In combination a computer and an external heat transfer module, said combination comprising: 
 a computer with a thermal interface port connected to the computer's internal heat removal system; and    a heat transfer module external to said computer, said heat transfer module connected to said thermal interface port of said computer.    
     
     
         13 . The combination of  claim 12  wherein said heat transfer module includes a heat dissipation component and at least one heat transfer conduit having a first end thermally coupled to said heat dissipation component, and a second end connected to said thermal interface port.  
     
     
         14 . The combination of  claim 13  wherein said heat dissipation component includes a thermoelectric device wherein a cool side of said thermoelectric device is coupled to said first end of said at least one heat transfer conduit.  
     
     
         15 . The combination of  claim 14  wherein said heat dissipation component further includes a thermal conductive plate in thermal contact with said cool side of said thermoelectric device.  
     
     
         16 . The combination of  claim 13  wherein said at least one heat transfer conduit is a heat pipe.  
     
     
         17 . A docking station for a laptop computer comprising: 
 an enclosure;    a laptop computer interface on at least one side of said enclosure wherein said interface has at least a thermal interface port; and    a heat transfer module within said enclosure and coupled to said thermal interface port, said heat transfer module comprising: 
 a heat dissipating device; and  
 at least one heat transfer conduit having a first portion adjacent one end of said at least one heat transfer conduit thermally connected to said heat dissipating device, and a second portion adjacent the other end of said at least one heat transfer conduit, said second portion being thermally connected to said thermal interface port.  
   
     
     
         18 . The docking station of  claim 17  wherein said heat dissipating device is a thermoelectric device wherein a cool side of said thermoelectric device is thermally connected to said heat transfer conduit.  
     
     
         19 . The docking station of  claim 18  wherein said heat dissipating device further includes a thermal conductive plate thermally coupled to said cool side of said thermoelectric device and said heat transfer conduit.  
     
     
         20 . The docking station of  claim 19  wherein said thermoelectric device further includes a heat sink thermally coupled to said second substrate.  
     
     
         21 . The docking station of  claim 20  wherein said thermoelectric device further includes a fan coupled to said heat sink for moving air over said heat sink.  
     
     
         22 . The docking station of  claim 17  wherein said heat transfer conduit is a heat pipe.  
     
     
         23 . A method of making an external device for improving the heat removing capability of a computer's internal heat management system, said method comprising: 
 attaching a first portion of one end of a heat transfer conduit to a heat dissipating device; and    configuring a second portion of the other end of said heat transfer conduit for thermally mating with a heat dissipation end of said computer's internal heat management system.    
     
     
         24 . The method of  claim 23  wherein said heat dissipating device is a thermoelectric device wherein a cool side of said thermoelectric device is thermally coupled to said heat transfer conduit.  
     
     
         25 . The method of  claim 24  further comprising thermally coupling a heat conductive plate to said cool side of said thermoelectric device.  
     
     
         26 . The method of  claim 25  further comprising thermally coupling a heat sink to a hot side of said thermoelectric device.  
     
     
         27 . The method of  claim 26  further comprising coupling a fan to said heat sink for moving air over said heat sink.  
     
     
         28 . A method of improving the heat removing capability of a computers internal heat removal system, said method comprising: 
 obtaining a heat transfer module having one end of a heat transfer conduit thermally coupled to said heat transfer module and the other end of said heat transfer conduit configured for mating to a thermal interface port of a computer, said thermal interface port thermally coupled to said computer's internal heat removal system;    thermally connecting said other end of said heat transfer conduit to said thermal interface port; and    enabling said heat transfer module.    
     
     
         29 . The method of  claim 28  wherein said heat transfer module is a thermoelectric device wherein a cool side of said thermoelectric device is connected to said heat transfer conduit.