Mold assembly and method for encapsulating semiconductor device

Abstract

A mold assembly including: a first mold half; a second mold half relatively movable with respect to the first mold half; and a thin film disposes between the both mold halves and in contact with the surface of a semiconductor chip. Because of the contact between the edges of the surface of the semiconductor chip and the thin film, the portion of the semiconductor chip at which the burr is liable to be generated is protected and no burrs are generated.

What is claimed:  
     
         1 . A method for molding a semiconductor chip in a mold assembly having first and second mold halves disposed for relative movement with respect to each other, said method comprising the steps of: 
 sandwiching a mold releasing member and the semiconductor chip between said first mold half and said second mold half, the mold releasing member having a property of elastically deforming, the releasing member and one of said first and second mold halves defining a cavity for receiving the semiconductor chip therein; ands    injecting resin in the cavity by using a first pressure lower than a pressure, which allows the mold releasing member to elastically deform, in a closed state of the mold assembly to thereby mold the semiconductor chip.    
     
     
         2 . The method as defined in  claim 1 , wherein the mold releasing member is a film having a substantially uniform thickness.  
     
     
         3 . The method as defined in  claim 1 , further comprising the step of releasing the mold releasing member from the one of the first and second mold halves.  
     
     
         4 . The method as defined in  claim 1 , wherein the closed state is achieved by elastically holding at least one of the first and second mold halves, and the first pressure is lower than a pressure that allows the mold assembly to open from the closed state.