Cleaning processes using hydrofluorocarbon and/or hydrochlorofluorocarbon compounds

Abstract

Disclosed are methods of cleaning articles of manufacture using hydrofluorocarbon and hydrochlorofluorocarbon fluids. The methods comprise generally the steps of (a) providing a hydrofluorocarbon and/or hydrochlorofluorocarbon fluid in liquid or supercritical state; (b) contacting an article of manufacture with said fluid; and (c) removing substantially all of said fluid from said article of manufacture.

What is claimed is:  
     
         1 . A method for cleaning an article of manufacture containing contaminants on a surface thereof comprising the steps of: 
 (a) providing a compound comprising 1,1,1,3,3-pentafluoropropane as a supercritical fluid;    (b) contacting a surface of an article of manufacture containing contaminants with said supercritical fluid; and    (c) removing substantially all of said supercritical fluid from said surface of the article of manufacture.    
     
     
         2 . The method of  claim 1  wherein said supercritical fluid further comprises an oxygenate compound selected from the group consisting of aldehydes, ketones, esters, ethers and alcohols.  
     
     
         3 . The method of  claim 2  wherein said oxygenate compound is an alcohol selected from the group consisting of methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol and tert-butanol.  
     
     
         4 . The method of  claim 1  wherein said supercritical fluid further comprises from about 0.1 wt % to about 0.9 wt % of methanol.  
     
     
         5 . The method of  claim 1  wherein said supercritical fluid is a fluid in its liquid state.  
     
     
         6 . The method of  claim 5  wherein said supercritical fluid is at or below about the critical temperature of 1,1,1,3,3-pentafluoropropane.  
     
     
         7 . The method of  claim 5  wherein said supercritical fluid is at or below about the critical pressure of 1,1,1,3,3-pentafluoropropane.  
     
     
         8 . The method of  claim 1  wherein said providing step (a) comprises providing said compound comprising 1,1,1,3,3-pentafluoropropane at a temperature of from about −10° C. to about 200° C.  
     
     
         9 . The method of  claim 8  wherein said providing step (a) comprises providing said compound comprising 1,1,1,3,3-pentafluoropropane at a temperature of from about 15° C. to about 130° C.  
     
     
         10 . The method of  claim 8  wherein said providing step (a) comprises providing said compound comprising 1,1,1,3,3-pentafluoropropane at a pressure of from about 25 psia to about 10,000 psia.  
     
     
         11 . The method of  claim 9  wherein said providing step (a) comprises providing said compound comprising 1,1,1,3,3-pentafluoropropane at a pressure of from about 100 psia to about 3,500 psia.  
     
     
         12 . The method of  claim 1  wherein said contacting step (b) comprises covering at least a contaminated portion of said article with said supercritical fluid.  
     
     
         13 . The method of  claim 12  wherein said contacting step (b) further comprises dissolving in said supercritical fluid at least a portion of a contaminant on said contaminated portion of said article.  
     
     
         14 . The method of  claim 1  wherein said contacting step (b) comprises immersing at least a contaminated portion of said article in a stream of said supercritical fluid.  
     
     
         15 . The method of  claim 1  wherein said removing step (c) comprises converting said supercritical fluid to a gaseous state.  
     
     
         16 . The method of  claim 15  wherein said step of converting said supercritical fluid to a gaseous state comprises changing the pressure to which the supercritical fluid is subjected.  
     
     
         17 . The method of  claim 16  wherein said step of converting said supercritical fluid to a gaseous state further comprises changing the temperature of the supercritical fluid.  
     
     
         18 . The method of  claim 1  wherein said article of manufacture comprises a printed circuit board.  
     
     
         19 . The method of  claim 1  wherein said article of manufacture comprises a silicon wafer.