Continuous heat sink for an electronic device

Abstract

A continuous heat sink adapted to an electronic device comprises a prefabricated slat folded into a plurality of perforated sections to define segregated spaces for ventilation and adhered by glue or fasteners to a base plate with a skirt folded at a right angle to each section; the base plate then is placed on the top of the electronic device for the heat to be conducted to the heat sink for dissipation, further improved by the holes that promote the lateral airflow.

I claim:  
     
         1 . A continuous structure of a heat sink adapted to an electronic device that generates heat comprising a body formed by a slat continuously folded into a plurality of sections with each section laterally punched with a plurality of holes to define segregated space for the body; and one or more than one body is adhered to a top surface of said electronic device.  
     
     
         2 . A continuous structure of a heat sink adapted to an electronic device that generates heat as claimed in  claim 1 , wherein, a skirt is folded to a bottom of each section of said slat and flush adhered to a base plate.  
     
     
         3 . A continuous structure of a heat sink adapted to an electronic device that generates heat as claimed in  claim 1 , wherein, the body of the heat sink is adhered to said base plate by applying a coating of heat dissipation glue or fixed to said base plate by means of fasteners.  
     
     
         4 . A continuous structure of a heat sink adapted to an electronic device that generates heat as claimed in  claim 1 , wherein, a flange is punched to each of said holes of said slat.