US2003196451A1PendingUtilityA1

Contact cooling device

39
Assignee: LYTRON INCPriority: Apr 11, 2002Filed: Apr 11, 2003Published: Oct 23, 2003
Est. expiryApr 11, 2022(expired)· nominal 20-yr term from priority
F28F 13/12
39
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Claims

Abstract

A high performance cooling device including multiple, relatively thin plates, each having patterns formed thereon that, as arranged within the device, cause turbulence in a fluid passing within the cold plate. Adjacent ones of the plates within the cold plate are arranged such that fluid passing channels within their patterns are arranged crosswise. The plates may be arranged such that the fluid passing channels within the adjacent plate patterns are at an included angle of between 36 and 60 degrees. Manufacturing of the device includes stacking the plates in an alternating fashion such that the channels within the pattern of each plate are crosswise with respect to the channels in the pattern of an adjacent plate. A pair of end plates, which are stacked at the top and bottom of the assembly, do not have an etched pattern and allow for fluid input and output ports. During operation of the disclosed device, the ports bring fluid, such as a coolant, into and out of the device.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A cooling device, comprising: 
 a plurality of patterned plates, each of said patterned plates having a pattern formed thereon, wherein said pattern includes a plurality of channels through which liquid can pass, and wherein said plates are arranged such that said channels of said pattern in a first one of said patterned plates are arranged substantially crosswise with respect to said channels of said pattern in a second, adjacent one of said plurality of patterned plates.    
     
     
         2 . The cooling device of  claim 1 , wherein said plates are arranged such that each of said channels of said pattern in said first one of said patterned plates are arranged at an included angle of between 36 and 60 degrees with respect to said channels of said second, adjacent plate.  
     
     
         3 . The cooling device of  claim 2 , further comprising a pair of end plates coupled to opposite sides of the device, wherein said end plates include an input port for allowing a fluid to enter said device and an output port for allowing a fluid to exit said device.  
     
     
         4 . The cooling device of  claim 3 , wherein said plurality of patterned plates are formed primarily of copper.  
     
     
         5 . The cooling device of  claim 1 , wherein said patterned plates are rectangular, and wherein said channels in said pattern extend angularly from a lengthwise side of said first one of said patterned plates, wherein said lengthwise side of said first one of said patterned plates corresponds to a lengthwise side of said device.  
     
     
         6 . The cooling device of  claim 5 , wherein said channels in said pattern extend at an angle within the range of 18 to 30 degrees from said lengthwise side in said first one of said patterned plates.  
     
     
         7 . The cooling device of  claim 8 , wherein said channels in said pattern extend at an angle within the range of negative 18 to negative 30 degrees from said lengthwise side in said second, adjacent one of said patterned plates.  
     
     
         8 . A method of manufacturing a cooling device, comprising: 
 forming a pattern on a plurality of plates to produce a plurality of patterned plates, wherein said pattern includes a plurality of channels through which liquid can pass;    arranging said plurality of patterned plates in a stack such that said channels of said pattern in a first one of said patterned plates are crosswise with respect to channels in said pattern of a second, adjacent one of said plurality of patterned plates in said stack; and    affixing a pair of end plates to said stack, wherein said pair of end plates include an input fluid port and an output fluid port.    
     
     
         9 . The method if  claim 8 , wherein said forming said pattern on said plurality of plates to produce said plurality of patterned plates includes photo-etching said pattern onto said plurality of plates.  
     
     
         10 . The method of  claim 8 , wherein said forming said pattern on said plurality of plates to produce said plurality of patterned plates includes stamping said pattern onto said plurality of plates.  
     
     
         11 . The method of  claim 8 , wherein said forming said pattern on said plurality of plates to produce said plurality of patterned plates includes casting said plurality of plates to obtain said pattern.  
     
     
         12 . The method of  claim 8 , wherein said forming said pattern on said plurality of plates to produce said plurality of patterned plates include forging said plurality of plates to obtain said pattern.  
     
     
         13 . The method of  claim 8 , further comprising attaching a pair of end plates to said stack, wherein said end plates include an input port for allowing liquid into said cooling device, and an output port for allowing liquid out of said cooling device.  
     
     
         14 . The method of  claim 8 , further comprising placing said stack into a fixture and soldering said patterned plates together while a mechanical load is applied to maintain contact pressure between the patterned plates in the stack.  
     
     
         15 . The method of  claim 14 , further comprising soldering at least one pad on a component contact surface of said cooling device while soldering said patterned plates together.

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