Resin-sealed semiconductor device

Abstract

A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.

1 . A resin-sealed semiconductor device comprising: 
 a die pad;    a first semiconductor chip whose circuit surface is bonded to a surface of said die pad;    a second semiconductor chip whose back is bonded to the back of said first semiconductor chip;    wires for connecting each of said semiconductor chips to outer leads; and    a sealing resin for encapsulating said die pad, said first and second semiconductor chips and said wires so that the other surface of said die pad is exposed.    
     
     
         2 . A resin-sealed semiconductor device comprising; 
 a die pad;    a first semiconductor chip whose circuit surface is bonded to a surface of said die pad;    a second semiconductor chip whose circuit surface is bonded to the back of said first semiconductor chip;    a third semiconductor chip whose back is bonded to the back of saig second semiconductor chip;    wires for connecting each of said semiconductor chips to outer leads; and    a sealing resin for encapsulating said die pad, said first, second, and third semiconductor chips and said wires so that the other surface of said die pad is exposed.    
     
     
         3 . A resin-sealed semiconductor device comprising; 
 a die pad;    a first semiconductor chip whose circuit surface is bonded to a surface of said die pad;    a second semiconductor chip whose back is bonded to the back of said first semiconductor chip;    a third semiconductor chip whose back is bonded to the circuit surface of said second semiconductor chip;    wires for connecting each of said semiconductor chips to outer leads; and    a sealing resin for encapsulating said die pad, said first, second, and third semiconductor chips and said wires so that the other surface of said die pad is exposed.    
     
     
         4 . A resin-sealed semiconductor device comprising; 
 a die pad;    a first semiconductor chip whose circuit surface is bonded to a surface of said die pad;    a second semiconductor chip whose circuit surface is bonded to the back of said first semiconductor chip;    wires for connecting each of said semiconductor chips to outer leads; and    a sealing resin for encapsulating said die pad, said first and second semiconductor chips and said wires so that the other surface of said die pad and the back of said second semiconductor chip are exposed.    
     
     
         5 . The resin-sealed semiconductor device according to  claim 4 , wherein a step is formed on a part of the back of said second semiconductor chip.  
     
     
         6 . The resin-sealed semiconductor device according to  claim 4  or  5 , wherein the inner ends of said outer leads are bent to a substantially L-shape.  
     
     
         7 . The resin-sealed semiconductor device according to  claim 6 , wherein the back of the ends bent to a substantially L-shape is allowed to expose from said sealing resin to be external terminals.