Liquid crystalline polymer bond plies and circuits formed therefrom

Abstract

A method of making a bond ply comprises treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/° C. Such bond plies are of particular utility in the manufacture of circuit boards.

What is claimed is:  
     
         1 . A method of manufacturing a liquid crystalline bond ply, comprising heating a film comprising a liquid crystalline polymer at a temperature and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.  
     
     
         2 . The method of  claim 1 , wherein the liquid crystalline polymer is a copolymer of hydroxy benzoate/hydroxy naphthoate.  
     
     
         3 . The method of  claim 1 , wherein the liquid crystalline polymer bond ply has a thickness of about 10 to about 200 micrometers.  
     
     
         4 . The method of  claim 1 , wherein the liquid crystalline polymer has a melt temperature of about 250° C. to about 350° C.  
     
     
         5 . The method of  claim 1 , wherein the film is treated at a temperature of about 280° C. to about 330° C. and a pressure of about 0.5 Mpa to about 1.4 Mpa.  
     
     
         6 . A method of manufacturing a liquid crystalline bond ply, comprising heating a film comprising a liquid crystalline polymer having a melt temperature of about 250° C. to about 350° C. to a temperature of about 280° C. to about 330° C. at a pressure of about 0.5 Mpa to about 1.4 Mpa for a time effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.  
     
     
         7 . A liquid crystalline polymer bond ply produced by a method comprising heating a film comprising a liquid crystalline polymer at a temperature and a pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.  
     
     
         8 . The liquid crystalline polymer bond ply of  claim 7 , wherein the liquid crystalline polymer is a copolymer of hydroxy benzoate/hydroxy naphthoate.  
     
     
         9 . The liquid crystalline polymer bond ply of  claim 7 , wherein the liquid crystalline polymer bond ply has a thickness of about 10 to about 200 micrometers.  
     
     
         10 . The liquid crystalline polymer bond ply of  claim 7 , wherein the liquid crystalline polymer has a melt temperature of about 250° C. to about 350° C.  
     
     
         11 . The liquid crystalline polymer bond ply of  claim 7 , wherein the film comprising a liquid crystalline polymer is treated at a temperature of about 280° C. to about 330° C. and a pressure of about 0.5 Mpa to about 1.4 Mpa.