Adaptable multi zone carrier

Abstract

A substrate carrier having a deformable surface for receiving a substrate. Non annular pressure application zones apply pressure to the deformable surface, and addressable transducers within the pressure application zones receive a signal and applying a selectable amount of pressure in response to the signal. In this manner, the amount of pressure provided by the substrate carrier differs from one portion of the substrate to another in a selectable manner. Thus, the pressure applied to the substrate can be tailored to the non uniform thickness of the layer that is being thinned. In other words, portions of the substrate where the layer is thicker can be pressed upon with a greater force by the substrate carrier, thus urging the substrate more forcefully into the polishing pad in those portions, and thereby removing material from the layer at a greater rate of speed in those portions. Similarly, portions of the substrate where the layer is thinner can be pressed upon with a lesser force by the substrate carrier, thus urging the substrate less forcefully into the polishing pad in those portions, and thereby removing material from the layer at a reduced rate of speed in those portions. In this manner, substrates having layers of non uniform thickness can be processed such that the resulting thickness of the thinned layer is extremely uniform.

What is claimed is:  
     
         1 . In a substrate carrier of the type used for retaining a substrate during chemical mechanical polishing, the improvement comprising: 
 a deformable surface for receiving the substrate,    non annular pressure application zones for applying pressure to the deformable surface, and    addressable transducers within the pressure application zones for receiving a signal and applying a selectable amount of pressure in response to the signal.    
     
     
         2 . The substrate carrier of  claim 1 , wherein the deformable surface comprises a metal fabric.  
     
     
         3 . The substrate carrier of  claim 1 , wherein the deformable surface comprises an elastomer.  
     
     
         4 . The substrate carrier of  claim 1 , wherein the non annular pressure application zones are disposed in a grid pattern.  
     
     
         5 . The substrate carrier of  claim 1 , wherein each of the non annular pressure application zones is between about one square millimeter and about six hundred square millimeters in size.  
     
     
         6 . The substrate carrier of  claim 1 , wherein the addressable transducers comprise solenoids.  
     
     
         7 . The substrate carrier of  claim 1 , wherein the addressable transducers comprise piezoelectric transducers.  
     
     
         8 . The substrate carrier of  claim 1 , wherein the addressable transducers comprise digitally addressable devices.  
     
     
         9 . The substrate carrier of  claim 1 , further comprising pressure transducers disposed within each of the pressure application zones, the pressure transducers for sensing pressures applied from the substrate to the substrate carrier during processing.  
     
     
         10 . The substrate carrier of  claim 1 , further comprising a controller for individually and selectively controlling the addressable transducers.  
     
     
         11 . The substrate carrier of  claim 1 , further comprising: 
 pressure transducers disposed within each of the pressure application zones, the pressure transducers for sensing pressures applied from the substrate to the substrate carrier during processing, and for sending pressure signals, and    a controller for receiving the pressure signals and individually and selectively controlling the addressable transducers based at least in part on the pressure signals.    
     
     
         12 . In a substrate carrier of the type used for retaining a substrate during chemical mechanical polishing, the improvement comprising: 
 a deformable surface for receiving the substrate,    non annular pressure application zones for applying pressure to the deformable surface, and    addressable transducers disposed in a grid pattern within the pressure application zones for receiving a signal and applying a selectable amount of pressure in response to the signal, wherein each of the non annular pressure application zones is between about one square millimeter and about six hundred square millimeters in size.    
     
     
         13 . The substrate carrier of  claim 12 , wherein the addressable transducers comprise digitally addressable devices.  
     
     
         14 . The substrate carrier of  claim 12 , further comprising pressure transducers disposed within each of the pressure application zones, the pressure transducers for sensing pressures applied from the substrate to the substrate carrier during processing.  
     
     
         15 . The substrate carrier of  claim 12 , further comprising: 
 pressure transducers disposed within each of the pressure application zones, the pressure transducers for sensing pressures applied from the substrate to the substrate carrier during processing, and for sending pressure signals, and    a controller for receiving the pressure signals and individually and selectively controlling the addressable transducers based at least in part on the pressure signals.    
     
     
         16 . In a substrate carrier of the type used for retaining a substrate during chemical mechanical polishing, the improvement comprising: 
 a deformable surface for receiving the substrate,    non annular pressure application zones for applying pressure to the deformable surface, and    addressable transducers disposed in a grid pattern within the pressure application zones for receiving a signal and applying a selectable amount of pressure in response to the signal, wherein the addressable transducers are digitally addressable devices.    
     
     
         17 . The substrate carrier of  claim 16 , wherein each of the non annular pressure application zones is between about one square millimeter and about six hundred square millimeters in size.  
     
     
         18 . The substrate carrier of  claim 16 , further comprising pressure transducers disposed within each of the pressure application zones, the pressure transducers for sensing pressures applied from the substrate to the substrate carrier during processing.  
     
     
         19 . The substrate carrier of  claim 16 , further comprising a controller for individually and selectively controlling the addressable transducers.  
     
     
         20 . The substrate carrier of  claim 16 , further comprising: 
 pressure transducers disposed within each of the pressure application zones, the pressure transducers for sensing pressures applied from the substrate to the substrate carrier during processing, and for sending pressure signals, and    a controller for receiving the pressure signals and individually and selectively controlling the addressable transducers based at least in part on the pressure signals.