Non-foamed polishing pad and polishing method therewith

Abstract

A polishing pad made of a non-foamed resin material has surface roughness Ra in the range of 0.1-10 μm, or preferably 0.5-1.5 μm and variations in thickness less than 50 μm, or preferably less than 30 μm. Its Shore D hardness is greater than 60 degrees, or preferably 68 degrees. Its compressibility is less than 3%, or preferably less than 1% and its elasticity is greater than 30%, or preferably 50%, as measured by specified methods. Grooves may be formed over 30%-70%, or preferably 40%-60% of the total area of the polishing surface. When the polishing surface is subjected to a dressing process, its surface roughness Ra is restored to 0.1-10 μm, or preferably 0.5-1.5 μm.

What is claimed is:  
     
         1 . A polishing pad consisting substantially of a non-foamed resin material having a polishing surface with surface roughness Ra in the range of 0.1-10 μm and variations in thickness less than 50 μm.  
     
     
         2 . The polishing pad of  claim 1  having surface roughness Ra in the range of 0.5-1.5 μm and variations in thickness less than 30 μm.  
     
     
         3 . The polishing pad of  claim 1  wherein said resin material has Shore D hardness greater than 60 degrees, compressibility less than 3% and elasticity greater than 30%.  
     
     
         4 . The polishing pad of  claim 2  wherein said resin material has Shore D hardness greater than 60 degrees, compressibility less than 3% and elasticity greater than 30%.  
     
     
         5 . The polishing pad of  claim 3  wherein said resin material has Shore D hardness greater than 68 degrees, compressibility less than 1% and elasticity greater than 50%.  
     
     
         6 . The polishing pad of  claim 4  wherein said resin material has Shore D hardness greater than 68 degrees, compressibility less than 1% and elasticity greater than 50%.  
     
     
         7 . The polishing pad of  claim 4  wherein said polishing surface has grooves formed thereon over 30%-70% of the area of said polishing surface.  
     
     
         8 . The polishing pad of  claim 7  wherein said polishing surface has grooves formed thereon over 40%-60% of the area of said polishing surface.  
     
     
         9 . A method of polishing a target surface of an object, said method comprising the steps of: 
 preparing a polishing pad consisting substantially of a non-foamed resin material having a polishing surface with surface roughness Ra in the range of 0.1-1.10 μm and variations in thickness less than 30 μm; and    pressing said polishing surface of said polishing pad against said target surface and causing a relative motion between said polishing pad and said target surface.    
     
     
         10 . The method of  claim 9  wherein said polishing surface has surface roughness Ra in the range of 0.5-1.5 μm and variations in thickness of said polishing pad is less than 10 μm.  
     
     
         11 . The method of  claim 9  further comprising the step of subjecting said polishing surface of said polishing pad to a dressing process such that the surface roughness Ra of said polishing surface returns to the range of 0.1-10 μm and variations in thickness of said polishing pad return to less than 30 μm.  
     
     
         12 . The method of  claim 10  further comprising the step of subjecting said polishing surface of said polishing pad to a dressing process such that the surface roughness Ra of said polishing surface returns to the range of 0.5-1.5 μm and variations in thickness of said polishing pad return to less than 10 μm.  
     
     
         13 . The method of  claim 9  wherein said resin material has Shore D hardness greater than 60 degrees, compressibility less than 3% and elasticity greater than 30%.  
     
     
         14 . The method of  claim 10  wherein said resin material has Shore D hardness greater than 60 degrees, compressibility less than 3% and elasticity greater than 30%.  
     
     
         15 . The method of  claim 11  wherein said resin material has Shore D hardness greater than 60 degrees, compressibility less than 3% and elasticity greater than 30%.  
     
     
         16 . The method of  claim 12  wherein said resin material has Shore D hardness greater than 60 degrees, compressibility less than 3% and elasticity greater than 30%.  
     
     
         17 . The method of  claim 13  wherein said resin material has Shore D hardness greater than 68 degrees, compressibility less than 1% and elasticity greater than 50%.  
     
     
         18 . The method of  claim 14  wherein said resin material has Shore D hardness greater than 68 degrees, compressibility less than 1% and elasticity greater than 50%.  
     
     
         19 . The method of  claim 15  wherein said resin material has Shore D hardness greater than 68 degrees, compressibility less than 1% and elasticity greater than 50%.  
     
     
         20 . The method of  claim 16  wherein said resin material has Shore D hardness greater than 68 degrees, compressibility less than 1% and elasticity greater than 50%.