Riveted bond structure for heat sink

Abstract

By the riveting protrusion of the base and the riveting hole of the sideboard, a riveted bond structure for a heat sink of a central processing unit (CPU) rivets the riveting protrusion outside of the sideboard by an external force to mount the base and the sideboard. More particularly, the riveting protrusion has two identical V-shaped pressing parts. Peak points of the V-shaped pressing parts are disposed in a line. When the riveting protrusion inserts through the riveting hole, the V-shaped pressing parts are respectively riveted aside by an external force to mount the base and the sideboard.

What is claimed is:  
     
         1 . A riveted bond structure for a heat sink of a central processing unit (CPU), comprising at least a base and at least a sideboard, said base having at least a riveting protrusion and said sideboard having riveting holes corresponding to said riveting protrusion, said riveting protrusion being inserted through said riveting hole and being riveted together outside of said sideboard by an external force to mount said base and said sideboard, characterized in that: 
 said riveting protrusion has two identical V-shaped pressing parts, peak points of said V-shaped pressing parts are disposed in a line, when said riveting protrusion inserts through said riveting hole, said V-shaped pressing parts are respectively riveted aside by an external force to mount said base and said sideboard.