US2003228238A1PendingUtilityA1
High-PTF sputtering targets and method of manufacturing
Priority: Jun 7, 2002Filed: Jun 7, 2002Published: Dec 11, 2003
Est. expiryJun 7, 2022(expired)· nominal 20-yr term from priority
B22F 1/09C23C 14/3414H01J 37/3426G11B 5/851B22F 2998/10Y10T428/31938
36
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Claims
Abstract
A target for a deposition apparatus is formed by blending at least two different types of powders together and consolidating the powders with a powder metallurgy process to form a billet. The target is then formed from the billet. The target includes a first material phase having a first PTF and a second material phase having a second PTF higher than the first PTF. The second PTF is also higher than a PTF of a material having the same chemistry as the target.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A target for a deposition apparatus, comprising:
a first material phase having a first PTF; and a second material phase having a second PTF, the second PTF being higher than the first PTF.
2 . The target according to claim 1 , wherein the target has a chemistry differing from chemistries of both the first and second material phases.
3 . The target according to claim 2 , wherein the second PTF is higher than a PTF of a material having a same chemistry as the target.
4 . The target according to claim 1 , wherein a chemistry of the target is that for a soft magnetic material.
5 . The target according to claim 4 , wherein the target has a thickness greater than 3 mm, a diameter greater than 50 mm, and a PTF of the target is greater than 5%.
6 . The target according to claim 5 , wherein a PTF of the target is greater than 20%.
7 . The target according to claim 6 , wherein the chemistry of the target includes at least 40 atomic% of Fe or Ni.
8 . The target according to claim 7 , wherein the chemistry of the target does not include Co.
9 . The target according to claim 5 , wherein a PTF of the target is greater than 50%.
10 . The target according to claim 9 , wherein the chemistry of the target includes at least 40 atomic% of Co and does not include Fe and Ni.
11 . The target according to claim 1 , wherein the average grain-size of the target is less than 500 microns.
12 . The target according to claim 11 , wherein the average grain-size of the target is less than 200 microns.
13 . The target according to claim 1 , wherein the first and second phases consist essentially of elemental phases.
14 . The target according to claim 1 , wherein the first and second phases consist essentially of alloy phases.
15 . The target according to claim 1 , wherein one of the first and second phases is an elemental phase and another of the first and second phases is an alloy phase.
16 . The target according to claim 1 , wherein the target has a density greater than 80% of theoretical.
17 . The target according to claim 16 , wherein the target has a density greater than 95% of theoretical.
18 . The target according to claim 1 , wherein the target is formed by powder metallurgy.
19 . A method of forming a target for a deposition apparatus, comprising the steps of:
blending at least two different types of elemental of alloy powders together; consolidating the powders with a powder metallurgy process to form a billet; and forming the target from the billet.
20 . The method according to claim 19 , wherein the at least two powders consist essentially of elemental powders.
21 . The method according to claim 19 , wherein the at least two powders consist essentially of alloy powders.
22 . The method according to claim 19 , wherein one of the at least two powders is an elemental powder and another of the at least two powders is an alloy powder.
23 . The method according to claim 19 , wherein the consolidation of the powders is by isostatic pressing.
24 . The method according to claim 19 , wherein the consolidation of the powders is by uniaxial pressing.
25 . The method according to claim 19 , wherein the aggregate diameter of each of the powders is less than 500 microns.
26 . The method according to claim 25 , wherein the aggregate diameter of each of the powders is less than 200 microns.
27 . The method according to claim 19 , wherein the target includes a first material phase having a first PTF and a second material phase having a second PTF, and the second PTF is higher than the first PTF.
28 . The method according to claim 27 , wherein the target has a chemistry differing from chemistries of both the first and second material phases.
29 . The method according to claim 28 , wherein the second PTF is higher than a PTF of a material having a same chemistry as the target.
30 . The method according to claim 19 , wherein a chemistry of the target is that for a soft magnetic material.
31 . The method according to claim 30 , wherein the target has a thickness greater than 3 mm, a diameter greater than 50 mm, and a PTF of the target is greater than 5%.
32 . The method according to claim 31 , wherein a PTF of the target is greater than 20%.
33 . The method according to claim 32 , wherein the chemistry of the target includes at least 40 atomic% of Fe or Ni.
34 . The method according to claim 33 , wherein the chemistry of the target does not include Co.
35 . The method according to claim 31 , wherein a PTF of the target is greater than 50%.
36 . The method according to claim 35 , wherein the chemistry of the target includes at least 40 atomic% of Co and does not include Fe and Ni.
37 . The method according to claim 19 , wherein the target has a density greater than 80% of theoretical.
38 . The method according to claim 37 , wherein the target has a density greater than 95% of theoretical.
39 . A method of forming a magnetic disk, comprising the steps of:
providing a substrate of the magnetic disk; and depositing material from a target onto the substrate, wherein the target includes a first material phase having a first PTF and a second material phase having a second PTF, the second PTF higher than the first PTF.
40 . The method according to claim 39 , wherein the target has a chemistry differing from chemistries of both the first and second material phases.
41 . The method according to claim 39 , wherein a chemistry of the target is that for a soft magnetic material.
42 . The method according to claim 39 , wherein the target is formed by powder metallurgy.
43 . A disk drive, comprising:
a magnetic disk; wherein the magnetic disk is formed by depositing material from a target onto a substrate of the magnetic disk, the target includes a first material phase having a first PTF and a second material phase having a second PTF, the second PTF higher than the first PTF.
44 . The disk drive according to claim 43 , wherein the target has a chemistry differing from chemistries of both the first and second material phases.
45 . The disk drive according to claim 43 , wherein a chemistry of the target is that for a soft magnetic material.
46 . The method according to claim 43 , wherein the target is formed by powder metallurgy.Cited by (0)
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