US2003232964A1PendingUtilityA1

Epoxy resin, epoxy resin composition, cured epoxy resin and manufacturing method thereof

42
Priority: Jun 7, 2002Filed: Jun 20, 2003Published: Dec 18, 2003
Est. expiryJun 7, 2022(expired)· nominal 20-yr term from priority
C08G 59/24C08G 59/02C09K 19/3411
42
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Claims

Abstract

An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes a major compound having a structure expressed by the Chemical Formula (1), and a method is provided for manufacturing the epoxy resin by reaction of (A) an epoxy resin with one mesogen contained in a molecule and (B) a compound with two elements of active hydrogen contained in a molecule, with the percentage composition of (B) active hydrogen with respect to (A) epoxy group being 0.25 and over, up to and including 0.7.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method for manufacturing an epoxy resin, comprising reacting the following compounds: 
 (A) an epoxy resin with one mesogen contained in a molecule; and    (B) a compound with two elements of active hydrogen contained in a molecule,    with the percentage composition of active hydrogen in compound (B) with respect to epoxy group in the epoxy resin (A) being 0.25 and over up and to including 0.7.    
     
     
         2 . A method for manufacturing an epoxy resin as claimed in  claim 1 , wherein said reacting is performed with addition of a curing agent for epoxy resin in an amount of 0.01-15% by weight with respect to said epoxy resin.  
     
     
         3 . A method for manufacturing an epoxy resin as claimed in  claim 1 , wherein said reacting is performed with addition of a curing agent for epoxy resin in an amount of 0.1 to 5% by weight with respect to said epoxy resin.

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