Titanium copper alloy having excellent strength and bendability, and manufacturing method thereof
Abstract
A titanium copper alloy having excellent strength and bendability comprising 1.0 to 4.5% by mass of Ti, the balance of copper and inevitable impurities, characterized in that; diameters of the intermetallic compound particles consisting of Cu and Ti precipitated in the alloy are 3 μm or less; the average number of the intermetallic compound particles having the diameters of 0.2 to 3 μm is 700 or less per a cross-sectional area of 1000 μm 2 in a transverse direction to a rolling direction; the average grain size measured in the above cross-sectional area is 10 μm or less; and a tensile strength is 890 MPa or more.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A titanium copper alloy having excellent strength and bendability characterized in that;
it comprises 1.0 to 4.5% by mass of Ti, the balance of copper and inevitable impurities; diameters of intermetallic compound particles consisting of Cu and Ti precipitated in the alloy are 3 μm or less; the average number of said intermetallic compound particles having the lo diameters of 0.2 to 3 μm is 700 or less per a cross-sectional area of 1000 μm 2 in a transverse direction to a rolling direction; the average grain size measured in a cross-sectional area in a transverse direction to a rolling direction is 10 μm or less; and a tensile strength is 890 MPa or more.
2 . The titanium copper alloy according to claim 1 , wherein the average number of the intermetallic compound particles having the diameters of 0.2 to 3 μm is 6 to 700 per a cross-sectional area of 1000 μm 2 in a transverse direction to a rolling direction.
3 . A manufacturing method of the titanium copper alloy according to claim 1 or 2 comprising a hot rolling, a cold rolling, a solution treatment, a cold rolling and an aging treatment, of a titanium copper alloy ingot in this order characterized in that;
the ingot is heated at a temperature of 850 to 950° C. for 30 minutes or more before the hot rolling and then the ingot is hot rolled and the temperature in the end of the hot rolling is 700° C. or more;
in the solution treatment, the material is annealed at a temperature in a range between (T−50) ° C. and (T+10) ° C., wherein T is a temperature at which the solubility of Ti in Cu is equal to the concentration of Ti contained in the alloy; and thereafter
the annealed material is cooled at a cooling rate of 100° C./sec or more.
4 . A manufacturing method of the titanium copper alloy according to claim 3 , wherein a reduction ratio in the cold rolling between the solution treatment and the aging treatment is 50% or less.
5 . A manufacturing method of the titanium copper alloy according to claim 3 or 4 , wherein the aging treatment is conducted at a temperature of 300 to 600° C.Join the waitlist — get patent alerts
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