Optical device, method for producing the same, and method for producing polyimide film

Abstract

A method for producing an optical device having a polyimide film through which a light beam is transmitted, which comprises applying a solution containing a polyamic film-forming starting material on a substrate and then baking the resultant under vacuum to form the polyimide film.

What is claimed is:  
     
         1 . A method for producing an optical device having an organic polymer film through which a light beam is transmitted, which comprises 
 applying a solution containing an organic polymer film-forming starting material on a substrate to form the applied film,    and then baking the applied film under vacuum of 1 Torr or lower to form the organic polymer film, 
 wherein the organic polymer film has a high transmittance when the light beam has a wavelength of 1.5 μm or shorter.  
   
     
     
         2 . A method for producing an optical device having an organic polymer film through which a light beam is transmitted, which comprises 
 applying a solution containing an organic polymer film-forming starting material on a substrate to form the applied film,    and then baking the applied film under gaseous nitrogen to form the organic polymer film, 
 wherein the organic polymer film has a high transmittance when the light beam has a wavelength of 1.5 μm or shorter.  
   
     
     
         3 . A method according to  claim 1 , wherein the organic polymer film has an absorptivity coefficient of light of not more than 1.6 mm −1  in the wavelength of 650 nm.  
     
     
         4 . A method according to claims  1  or  2 , wherein the light beam has a wavelength of 500 nm to 800 nm.  
     
     
         5 . A method according to claims  1  or  2 , wherein the organic polymer film is a polyimide resin film.  
     
     
         6 . A method according to  claim 1 , wherein the polyimide resin film is a photosensitive polyimide resin film.  
     
     
         7 . A method according to  claim 2 , wherein the polyimide resin film is a photosensitive polyimide resin film.  
     
     
         8 . A method according to  claim 1 , wherein the organic polymer film has a thickness not less than 5 μm and not more than 200 μm.  
     
     
         9 . A method according to  claim 1 , wherein the applied film is preparatorily heated under atmospheric pressure, before the baking under vacuum.  
     
     
         10 . A method according to  claim 1 , wherein the baking is performed under a vacuum of 1×10 −2  Torr.  
     
     
         11 . A method according to  claim 6 , wherein the photosensitive polyimide type resin film is an acetophenone type resin film.  
     
     
         12 . A method according to  claim 6 , wherein the photosensitive polyimide type resin film includes a tertiary amine.  
     
     
         13 . A method according to  claim 1 , wherein the organic polymer film-forming starting material is a precursor of a polyimide type resin.