Laminating adhesives hardenable by radiation

Abstract

A method of forming a film laminate uses an adhesive composition containing at least three components A, B and C. The method includes providing a radiation curable adhesive that contains a) a compound bearing at least one epoxy group, b) a compound with at least three OH groups and a molecular weight below 400 and c) a photoinitiator which initiates a polymerization of components a) and b) after exposure to light with a wavelength of 100 to 600 nm.

1 . The use of an adhesive containing at least three components A, B and C for the production of film laminates, 
 a) component A containing a compound bearing at least one epoxy group,    b) component B containing a compound with at least three OH groups and a molecular weight below 400 and    c) component C containing a photoinitiator which initiates a polymerization of components A and B after exposure to light with a wavelength of 100 to 600 nm.    
     
     
         2 . The use claimed in  claim 1 , characterized in that the adhesive contains a component D, 
 d) component D being a compound with at least two OH groups and a molecular weight of at least 400.    
     
     
         3 . The use claimed in  claim 1  or  2 , characterized in that component A has a molecular weight of less than 400.  
     
     
         4 . The use claimed in  claim 1  or  2 , characterized in that component A has a molecular weight of more than 400.  
     
     
         5 . The use claimed in any of the preceding claims, characterized in that an alcohol containing 3 to 6 OH groups is present as component B.  
     
     
         6 . The use claimed in any of the preceding claims, characterized in that an alcohol selected from the group consisting of glycerol, triethylol propane, trimethylol propane or pentaerythritol or a mixture of two or more thereof is present as component B.  
     
     
         7 . The use claimed in any of the preceding claims, characterized in that a photoinitiator selected from the group consisting of triaryl sulfonium salts or diaryl iodonium salts is present as component C.  
     
     
         8 . The use claimed in any of  claims 2  to  7 , characterized in that a compound selected from the group of polyester polyols, polyether polyols, polycarbonate polyols, polyacetal polyols or polyurethane polyols is present as component D.  
     
     
         9 . The use claimed in any of the preceding claims, characterized in that the adhesive contains 
 1% by weight to 98% by weight of component A,    1% by weight to 10% by weight of component B and    1% by weight to 10% by weight of component C.    
     
     
         10 . The use claimed in any of the preceding claims, characterized in that the adhesive contains a component E, 
 e) component E being a compound or a mixture of two or more compounds containing a cationically polymerizable functional group that is not an epoxy group.