US2004029992A1PendingUtilityA1

Adhesive material and circuit connection method

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Assignee: SONY CHEMICALS CORPPriority: Aug 19, 1999Filed: Aug 5, 2003Published: Feb 12, 2004
Est. expiryAug 19, 2019(expired)· nominal 20-yr term from priority
Inventors:Motohide TakeichiJunji Shinozaki
H10W 90/734H10W 72/07331H10W 72/354H10W 72/353H10W 72/352H10W 72/325H10W 72/073C09J 11/04Y10T428/2852C09J 9/02
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Claims

Abstract

An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m 2 /g) satisfies Equation (1) below, their mean particle size D 1 (μm) and maximum particle size D 2 (μm) respectively satisfy Equations (2) and (3) below, 3<S≦17  (1) D 1 ≦5  (2) D 2 ≦0.5( h 1 +h 2 )  (3) (wherein h 1 represents the height of the protuberant electrode in the electronic component, and h 2 represents the height of the terminal electrode in the circuit board), and the content of said inorganic particles is 10 to 60 vol %.

Claims

exact text as granted — not AI-modified
1 . An adhesive material, for connecting a protuberant electrode of an electronic to a terminal electrode of a circuit board for carrying said electronic component, the adhesive material containing at least one curable resin and inorganic particles, wherein as to the inorganic particles, their specific surface area S (m 2 /g) satisfies Equation (1) below, their mean particle size D 1  (μm) and maximum particle size D 2  (μ) respectively satisfy Equations (2) and (3) below,  
       3<S≦17  (1) D 1 ≦5  (2)  D   2 ≦0.5( h   1   +h   2 )  (3)  
       (wherein h 1  represents the height of the protuberant electrode in the electronic component, and h 2  represents the height of the terminal electrode in the circuit board), and the content of said inorganic particles is 10 to 60 vol %.  
     
     
         2 . The adhesive material according to  claim 1 , wherein the mean particle size D 1  of the inorganic particles further satisfies the Equation (4) below.  
       0.1( h   1   +h   2 )≧ D   1   (4)  
     
     
         3 . The adhesive material according to  claim 1 , wherein said at least one curable resin is a thermosetting resin which exhibits a viscosity of 500 cps or less at 100° C.  
     
     
         4 . The adhesive material according to any of  claim 1 , further containing conductive particles having a mean particle size of 0.5 to 8.0 μm.  
     
     
         5 . The adhesive material according to any of  claim 1 , wherein the coefficient of moisture absorption in a 85% RH, 85° C. atmosphere is 1.5 wt % or less.  
     
     
         6 . The adhesive material according to any of  claim 1 , wherein the electronic component is a semiconductor element.

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